| 以次磷酸钠为还原剂的化学镀铜 |
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| 引用本文： | 刘存海,霍小平,李亚龙. 以次磷酸钠为还原剂的化学镀铜[J]. 电镀与环保, 2009, 29(6): 33-35 |
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| 作者姓名： | 刘存海 霍小平 李亚龙 |
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| 作者单位： | 陕西科技大学教育部轻化工助剂化学与技术重点实验室,陕西西安,710021 |
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| 摘 要： | 研究了以次磷酸钠为还原剂的化学镀铜过程。确立了以硫酸铜为主盐,次磷酸钠为还原剂,乙二胺四乙酸二钠和柠檬酸钠为混合配位剂的碱性还原镀铜体系。在铸铁基体上实现了铜的连续自催化沉积,获得了较光亮、红黄色的铜镀层。
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| 关 键 词： | 化学镀铜 次磷酸钠 还原剂 铸铁 |
Electroless Copper Plating Using Sodium Hypophosphite as Reductant |
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| LIU Cun-hai,HUO Xiao-ping,LI Ya-long. Electroless Copper Plating Using Sodium Hypophosphite as Reductant[J]. Electroplating & Pollution Control, 2009, 29(6): 33-35 |
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| Authors: | LIU Cun-hai HUO Xiao-ping LI Ya-long |
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| Affiliation: | LIU Cun-hai,HUO Xiao-ping,LI Ya-long(Key Laboratory of Auxiliary Chemistry & Technology for Chemical Industry,Ministry of Education,Shanxi University of Science & Technology,Xi'an 710021,China) |
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| Abstract: | The process of the electroless copper plating using sodium hypophosphite as reductant was studied.An alkaline electroless copper plating bath with copper sulfate as main salt,sodium hypophosphite as reducing agent,EDTA and sodium citrate as blending chelating agent,was established.A continuous self-catalyzed deposition of bright red-yellow copper coating on cast iron substrate was obtained. |
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| Keywords: | electroless copper plating sodium hypophosphite reductant cast iron |
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