首页 | 本学科首页   官方微博 | 高级检索  
     

双酚二胺型苯并噁嗪树脂的合成及表征
引用本文:蒋健美,梁云,张文娜,杨进. 双酚二胺型苯并噁嗪树脂的合成及表征[J]. 中国胶粘剂, 2009, 18(10)
作者姓名:蒋健美  梁云  张文娜  杨进
作者单位:华南理工大学制浆造纸工程国家重点实验室,广东,广州,510640
摘    要:以双酚、甲醛和二胺为主要原料,以甲苯为溶剂,合成了苯并嗪(BOZ)中间体。采用红外光谱(FT-IR)技术对其结构进行了表征,同时采用差示扫描量热(DSC)法和热重分析(TGA)法对其固化过程及热稳定性能进行了研究。结果表明:双酚二胺类BOZ体系具有较宽的固化峰,其在200℃左右开始开环固化,具有良好的加工性能;700℃时的残炭率均超过40%(其中AFMDA体系为65%),耐温指数为185℃,说明该双酚二胺类BOZ体系是一种良好的耐高温材料,可以用于耐高温胶粘剂的制备。

关 键 词:双酚  二胺  苯并嗪  耐热性  固化

Synthesis and characterization of benzoxazine resin based on bisphenol-diamine
JIANG Jian-mei,LIANG Yun,ZHANG Wen-na,YANG Jin. Synthesis and characterization of benzoxazine resin based on bisphenol-diamine[J]. China Adhesives, 2009, 18(10)
Authors:JIANG Jian-mei  LIANG Yun  ZHANG Wen-na  YANG Jin
Affiliation:JIANG Jian-mei,LIANG Yun,ZHANG Wen-na,YANG Jin (State Key Lab of Pulp and Paper Engineering,South China University of Technology,Guangzhou 510640,China)
Abstract:With bisphenol, formaldehyde and diamine as main raw materials, toluene as solvent, so a benzoxazine(BOZ) intermediate was synthesized. Its structure was characterized by FT-IR, its curing process and thermal stability were investigated by DSC and TGA. The results showed that the BOZ system based on bisphenol-diamine had more wider curing peaks and well processability when its ring was opened and cured about 200 ℃. The BOZ system based on bisphenol-diamine was a well high temperature resistance material, could be used for preparing high temperature resistance adhesive because the rate of residual carbon exceeded 40%(65% in AFMDA system) at 700 ℃, and the temperature resistance index was 185 ℃.
Keywords:bisphenol  diamine  BOZ  heat resistance  curing  
本文献已被 CNKI 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号