| 小型化收发组件结构设计 |
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| 引用本文： | 吴天阳,张晖,张帅. 小型化收发组件结构设计[J]. 电子与封装, 2020, 0(1): 56-59 |
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| 作者姓名： | 吴天阳 张晖 张帅 |
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| 作者单位： | ;1.中科芯集成电路有限公司 |
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| 摘 要： | 论述了一种小型化收发组件结构设计方案,在电性能、散热、环境适应性等方面进行了结构设计和分析。通过ANSYS仿真平台对组件进行了热仿真与随机力学仿真,并给出了组件在正常工作时的实测温度及随机振动试验结果,并对仿真结果进行了验证,提高了收发组件的小型化一次设计成功率。
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| 关 键 词： | 小型化 收发组件 热仿真 随机振动仿真 |
Miniaturized T/R Module Structure Design |
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| WU Tianyang,ZHANG Hui,ZHANG Shuai. Miniaturized T/R Module Structure Design[J]. Electronics & Packaging, 2020, 0(1): 56-59 |
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| Authors: | WU Tianyang ZHANG Hui ZHANG Shuai |
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| Affiliation: | (China Key System&Integrated Circuit Co.,Ltd.,Wuxi 214072,China) |
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| Abstract: | The paper presents a structural design of a miniaturized T/R module,which is designed and analyzed in terms of electrical performance,heat dissipation and environmental adaptability.The thermal and random vibration simulations were carried out by ANSYS simulation platform,the module working temperature and random vibration test results were given out,and the simulation results were verified,which improved the primary design success rate of the miniaturized T/R module. |
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| Keywords: | miniaturization T/R module thermal simulation random vibration simulation |
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