| 半导体工艺技术与半导体设备的关系 |
| |
| 引用本文： | 颜燕. 半导体工艺技术与半导体设备的关系[J]. 微电子技术, 2002, 30(3): 27-32 |
| |
| 作者姓名： | 颜燕 |
| |
| 作者单位： | 信息产业部电子58所,无锡,214035 |
| |
| 摘 要： | 半导体工艺技术的发展涉及多门学科和多种因素，而其中半导体设备的作用至关重要，本文以世界上最大的半导体设备制造商-美国应用材料公司（Applied MaterialsCO.)生产的众多半导体设备中的刻蚀设备的发展为主线，从一个侧面阐述了半导体工艺技术的发展与半导体设备的密切关系。从而说明半导体设备和工艺技术对相应的发展都起着非常重要的作用。
|
| 关 键 词： | 缺陷密度 刻蚀 介质 |
| 文章编号： | 1008-0147(2002)03-27-06 |
| 修稿时间： | 2001-11-23 |
Relationship between Processing Technology and Equipment of Semiconductor Industry |
| |
| YAN Yan. Relationship between Processing Technology and Equipment of Semiconductor Industry[J]. Microelectronic Technology, 2002, 30(3): 27-32 |
| |
| Authors: | YAN Yan |
| |
| Abstract: | The development processing technology of semiconductor industry depends upon multiscience and many other factors. The influence of equipemnt upon the development is very important. Let's take The Applied Materials Co.Ltd, which produced many types of etching equipment, as in example to illustrate the relationship between processing technology and equipment of semiconductor industry. |
| |
| Keywords: | Defect density Etching Dielectric |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
