| 大功率LED封装散热技术研究 |
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| 引用本文： | 苏达,王德苗.大功率LED封装散热技术研究[J].半导体技术,2007,32(9):742-744,749. |
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| 作者姓名： | 苏达 王德苗 |
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| 作者单位： | 浙江大学,信息与电子工程系,杭州,310027;浙江大学,信息与电子工程系,杭州,310027 |
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| 摘 要： | LED被称为第四代照明光源或者绿色光源,广泛地应用于手机闪光灯、大中尺寸显示器光源模块以及特殊用途照明系统,并将被扩展至一般照明系统设备.由于LED结温的高低直接影响到LED的出光效率、器件寿命、发光波长和可靠性等,因此如何提高散热能力是大功率LED实现产业化亟待解决的关键技术之一.介绍并分析了国内外大功率LED散热封装技术的研究现状,总结了其发展趋势并提出减少内部热沉的热阻可能是今后的发展方向.
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| 关 键 词： | 大功率LED 散热 封装 |
| 文章编号： | 1003-353X（2007）09-0742-03 |
| 修稿时间： | 2007-04-02 |
Technical Research on Heat-Release Package of High-Power LEDs |
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| SU Da,WANG De-miao.Technical Research on Heat-Release Package of High-Power LEDs[J].Semiconductor Technology,2007,32(9):742-744,749. |
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| Authors: | SU Da WANG De-miao |
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| Abstract: | LED is called the fourth generation light or green light,and it is widely used in mobile flashlight,large and medium size displays,illumination system in special usage,and also other future developments in illumination devices.The junction temperature of LED has directly influence upon light output efficiency,device life time,emitting wavelength and reliability of LED,so how to improve the heat-sinking capability is one of the key technical problems for the industrialization of high-power LEDs.The present technical research on heat-release package of high-power LEDs is analyzed,and the trend is summarized.Besides,it suggests that reducing the internal heat sink may be one of the developments in the future. |
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| Keywords: | high power LED heat release package |
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