| 无铅焊料的发展概况 |
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| 引用本文： | 张红耀. 无铅焊料的发展概况[J]. 云南冶金, 2002, 31(5): 50-53 |
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| 作者姓名： | 张红耀 |
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| 作者单位： | 云南冶金集团总公司,云南,昆明,650051 |
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| 摘 要： | 随着环保意识的增强，人们加紧了对无铅焊料的研究。文章概述了无铅焊料的研究现状及发展趋势，对近20年来部分无铅焊料的研究成果进行了述评，探讨了无铅焊接研究中急需解决的几个问题。
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| 关 键 词： | 发展概况 焊接 无铅焊料 铅锡焊料 |
| 文章编号： | 1006-0308(2002)05-0050-04 |
| 修稿时间： | 2002-08-12 |
General situation of Development of Lead-free Solder |
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| ZHANG Hong-yao. General situation of Development of Lead-free Solder[J]. , 2002, 31(5): 50-53 |
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| Authors: | ZHANG Hong-yao |
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| Abstract: | The study on lead-free solder is intensified along with the more strict requirement on environmental protection.In this paper,the current situation and developing trend are briefly reviewed,some research research results in recent twenty years are presented,several problems to be resolved urgently are discussed. |
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| Keywords: | welding lead-free solder lead-tinsolder |
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