| 混合电路贮存可靠性及评价方法 |
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| 引用本文： | 黄云,恩云飞,杨丹.混合电路贮存可靠性及评价方法[J].微电子学,2007,37(2):173-176. |
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| 作者姓名： | 黄云 恩云飞 杨丹 |
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| 作者单位： | 电子元器件可靠性物理及其应用技术国家级重点实验室;信息产业部,电子第五研究所,广东,广州,510610 |
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| 摘 要： | 系统地分析和总结了混合电路在贮存中的失效模式及机理,温度、湿度以及化学等导致贮存失效的主要因素,论述了缺陷消除或控制法、贮存寿命加速试验法、标准单元结构评估预计法、自然贮存试验法等评价贮存可靠性的方法,为评估/评价混合电路贮存可靠性提供了思路和参考。
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| 关 键 词： | 混合电路 贮存 失效 可靠性 |
| 文章编号： | 1004-3365（2007）02-0173-04 |
| 修稿时间： | 2006-08-292006-11-08 |
Storage Reliability and Evaluation Methods for Hybrid IC's |
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| HUANG Yun,EN Yun-fei,YANG Dan.Storage Reliability and Evaluation Methods for Hybrid IC''''s[J].Microelectronics,2007,37(2):173-176. |
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| Authors: | HUANG Yun EN Yun-fei YANG Dan |
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| Affiliation: | National Key Lab. for Reliab. Phys. and Appl. Technol. of Elec. Prod. ; China Elec. Prod. Reliab. and Environ Test. Resear. Instit. , Ministryof Information Industry, Guangzhou, Guangdong 510610, P. 17. China |
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| Abstract: | Failure modes and mechanisms for storage of hybrid IC's are systematically analyzed and summarized.Temperature,humidity and chemical factors are the major causes leading to HIC storage failures.Generally,most of the failures are adherence(chip/parts),bonding,package and other non-wearout storage failures due to the process or design defects.Furthermore,evaluation methods for storage reliability,such as defects avoid/control,storage life cycle accelerated testing,evaluation/prediction for standard unit construct,natural storage testing,are also discussed.All these methods provide a way to evaluate and assess the reliability of HIC's in storage. |
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| Keywords: | Hybrid IC Storage Failure Reliability |
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