An analysis of the eddy effect in through-silicon vias based on Cu and CNT bundles: the impact on crosstalk and power |
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| Authors: | Sahu Chopali Chanchal Anand Shubham Majumder Manoj Kumar |
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| Affiliation: | 1.Department of Electronics and Communication Engineering, DSPM International Institute of Information Technology, Naya Raipur, 493661, India
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| Abstract: | Journal of Computational Electronics - The performance of three-dimensional integrated circuits primarily depends on the filler material used in the through-silicon vias (TSVs). The most widely... |
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