真空电子器件用V-B系列钎料研究

采用真空-充氩熔炼V-B系列钎料,并通过球磨技术制成焊料粉末.实验表明:V-B系列钎料的真空钎焊性能优良;V-B系列块状钎料瞬间熔化并快速铺开,流动性好,润湿性好,表面均匀.V-B-Pd块状钎料的熔点为1730℃,V-B块状钎料的熔点为1740℃;V-B粉末钎料铺展均匀,有明显的润湿环,钎料铺展面积约占基体面积的3/4,钎料的熔点为1560℃.

Research on A Series of V-B Solder Used in Vacuum Electronic Devices

A series of V-B solder were melted by vacuum-filling argon and solder powder was made by ball milling technology. The results show that the solderability of series of V-B solder is excellent, massive series of V-B solder are instantly melted and quickly spreaded, the fluidity and wettability is good, the surface is uniform. The melting point of V-B-Pd solder is 1730℃, the melting point of V-B solder is 1740℃. The powder of V-B solders is spreaded uniformly, it has significant wetting ring, the spreading area is 3/4 of matrix area, the melting point is 1560℃.