Thermo-compression bonding of alumina ceramics to metal |
| |
Authors: | S Das A N Tiwari A R Kulkarni |
| |
Affiliation: | (1) Society for Applied Microwave Electronics Engineering and Research (SAMEER), Hill Side, IIT Campus, Powai, Mumbai-, 400076, India;(2) Department of Metallurgical Engineering and Materials Science, IIT, Powai, Mumbai-, 400076, India |
| |
Abstract: | Alumina ceramics and Kovar with aluminum interlayer are pressed together under vacuum at temperatures around 600°C for joining. This process produces mechanically strong ceramic to metal bonds in one step in an economic manner. In order to arrive at the optimum conditions for solid-state bonding, effects of bonding temperature, pressure and time on the bond strength have been studied. Bonding kinetics is also elucidated. Irradiation of 99% Al2O3 ceramics by 4–5 MV X-rays has been found to increase the bond-strength sharply from 33 to 60 MPa with a dose of 15 k Rads for bonding temperatures around 540°C. The apparent activation energy for the bonding process (Q
B) depends strongly on the type of alumina ceramics. Irradiation of alumina ceramics (99%), prior to joining with Kovar, accelerates the solid-state bonding by reducing (Q
B) from 209 to 76 kJ/mole. |
| |
Keywords: | |
本文献已被 SpringerLink 等数据库收录! |
|