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Strength Evaluation of Piezoelectric Ceramics under Transient Thermal Environments
Authors:Bao-Lin Wang  Yiu-Wing Mai
Affiliation:Department of Manufacturing Engineering and Engineering Management (MEEM), City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong;Center for Composite Materials, Harbin Institute of Technology, Harbin 150001, P.R. China;Centre for Advanced Materials Technology (CAMT), School of Aerospace, Mechanical and Mechatronic Engineering, J07, The University of Sydney, Sydney, NSW 2006, Australia
Abstract:The strength of piezoelectric ceramics is analyzed for a plate suddenly exposed to an environmental medium of different temperatures. The admissible temperature jump the material can sustain is studied using the stress- and fracture-toughness-based failure criteria. The critical parameters governing the level of the transient thermal stress in piezoelectric ceramics are identified. Solutions are obtained for the maximum thermal shock that the plate can sustain without failure, under the conditions that (i) maximum local tensile stress equals the tensile strength of the ceramic, and (ii) maximum stress intensity factor for representative pre-existing cracks equals the fracture toughness of the ceramic.
Keywords:fracture    electromechanical properties    piezoelectric materials/properties
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