差示扫描量热法研究环氧端基酚酞聚芳醚酮的固化特性

为了提高环氧树脂的力学性能和耐热性能,制备了环氧端基酚酞聚芳醚酮,并研究其固化反应.由酚酞和4,4,-二氟二苯酮经芳香亲核缩聚反应,制得了含酚氧钾端基的聚芳醚酮低聚物.将其与环氧氯丙烷反应得到环氧值为0.13、数均分子量为1 540的含环氧端基聚芳醚酮.利用差示扫描量热法研究了以4,4＇-二氨基二苯醚为固化剂制备的环氧封端酚酞聚芳醚酮的固化反应和反应动力学特征.结果表明,固化反应为复杂反应,反应过程中体系放热,反应放热峰的起始温度和峰顶温度随着升温速率的增加而升高;该环氧体系的最低固化反应温度和固化反应峰顶温度为120.6℃和146.8℃,固化反应表观活化能和固化反应级数分别为68.21 kJ/mol和0.91.

Curing characteristics of epoxy resin terminated phenolphthalein polyaryletherketone using differential scanning calorimetry

To improve mechanical properties and heat resistance of epoxy resin,epoxy-terminated phenolphthalein polyaryletherketone （E-PEK） was synthesized by reaction of epichlorohydrin with Poly （ether ketone） oligomer having potassium phenoxide terminal group prepared by condensation of phenolphthalein with 4,4＇-difluorobenzophenone.E-PEK has number-average molecular weight and epoxy value of 1 540 g/mol and 0.13,respectively.E-PEK was cured with 4,4＇-diaminodiphenyl ether and the cure kinetics was investigated by differential scanning calorimetry technique.The results show that the curing reaction is a kind of exothermic reaction,the initial temperature and curing temperature of curing exothermic peak elevate with the increase of heating rate; the lowest temperature of curing reaction is 120.6 ℃,the activation energy and curing reaction order are 68.21 kJ/mol and 0.91,respectively.