| Abstract: | Abstract— A 14.1‐in.‐diagonal backplane employing hydrogenated amorphous‐silicon thin‐film transistors (a‐Si:H TFTs) was fabricated on a flexible stainless‐steel substrate. The TFTs exhibited a field‐effect mobility of 0.54 cm2/V‐sec, a threshold voltage of 1.0 V, and an off‐current of 10?13 A. Most of the electrical characteristics were comparable to those of the TFTs fabricated on glass substrates. To increase the stability of a‐Si:H TFTs fabricated on stainless‐steel substrate, the specimens were thermally annealed at 230°C. The field‐effect mobility was reduced to 71% of the initial value because of the strain of the released hydrogen atoms and residual compressive stress in a‐Si:H TFT under thermal annealing at 230°C. |
