WCu合金与铜合金梯度烧结的设计与分析

用梯度烧结法连接钨铜合金与纯铜或铜合金,并与传统的整体烧结、焊接、机械螺纹连接进行了对比分析,观察了结合界面和拉伸断口。结果表明,梯度烧结试样可以显著提高结合界面的抗拉强度(15%～30%)、降低电阻率(25%)。而且梯度烧结试样的界面表现为"犬牙交错"状,断裂方式为准解理,优于界面较为平整,断口呈解理断裂的其他几种连接方式。

Design and Analysis of Gradient Sintering between WCu Alloy and Aldary

The copper(aldary) and W-Cu alloy are linked up by the gradient sintering,which is compared with the conventional whole sintering,welding,threaded connection technology.The morphology of the joint and tensile strength are analyzed.Results show that,the gradient sintering W-Cu alloy and aldary has enhanced the tersile strength(15%～30%) and reduced the electric resistivity(25%) .Furthermore the sample's interface of gradient sintering is unconspicuous and fractured mode is quasi-cleavage crack.It is better than the other joint mode which interface is clear and the fractured mode is cleavage fracture.