| 对某微波器件热真空试验自激故障的分析及解决方案 |
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| 引用本文： | 韩君祥,胡云.对某微波器件热真空试验自激故障的分析及解决方案[J].电子机械工程,2009,25(6):1-4,21. |
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| 作者姓名： | 韩君祥 胡云 |
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| 作者单位： | 1. 东南大学机械工程学院,江苏,南京,210096;中国航天科工集团公司8511研究所,江苏,南京,210007
2. 中国航天科工集团公司8511研究所,江苏,南京,210007 |
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| 摘 要： | 某微波放大器在做热真空试验时产生自激现象,详细分析了产生故障的原因,指出真空高温引起的盒体形变,是导致电路不能正常工作的主要原因,提出了解决措施,并对解决措施进行了应力分析及工艺可行性分析.其观点对进行航空、航天电子设备的结构设计人员有一定的参考价值.
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| 关 键 词： | 热真空试验 自激 热仿真 电磁屏蔽 |
Analysis of Thermal Vacuum Test Self-Excitation Failure of Microwave Devices and Their Solutions |
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| HAN Jun-xiang and HU Yun.Analysis of Thermal Vacuum Test Self-Excitation Failure of Microwave Devices and Their Solutions[J].Electro-Mechanical Engineering,2009,25(6):1-4,21. |
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| Authors: | HAN Jun-xiang and HU Yun |
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| Affiliation: | HAN Jun-xiang1,2,HU Yun2(1.College of Mechanical Engineering,Southeast University,Nanjing 210096,China)(2.No.8511 Research Institute of CASIC,Nanjing 210007,China) |
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| Abstract: | Self-excitation phenomenon occurred in certain microwave amplifier thermal vacuum tests.This paper analyses the causes of failure in detail,pointing out that box shape change by vacuum high temperature is the main cause leading to the circuit not working properly.A solution is proposed and a stress analysis and technical feasibility analysis are conducted.The concepts of this paper may have certain reference value for structural design of electronic equipment of avionics or used in space. |
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| Keywords: | thermal vacuum test self-excitation thermal simulation electromagnetic shielding |
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