| 直接敷铜Al2O3陶瓷基板的界面产物研究 |
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| 引用本文： | 方志远,陈虎,周和平.直接敷铜Al2O3陶瓷基板的界面产物研究[J].无机材料学报,2000,15(5):935-938. |
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| 作者姓名： | 方志远 陈虎 周和平 |
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| 作者单位： | 清华大学材料科学与工程系新型陶瓷与精细工艺国家重点实验室, 北京 100084 |
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| 摘 要： | 直接敷铜Ａｌ２Ｏ３基板已被广泛应用于大功率场合。本文通过Ｃｕ箔表面预氧化生成Ｃｕ２Ｏ的方法引入氧，１０７０℃在Ｃｕ箔和Ａｌ２Ｏ３基板界面上所产生的Ｃｕ－Ｃｕ２Ｏ共晶液体促进了二者的牢固结合，流动氮气氛下保温１ｈ，观察到了明显的界面产物层。ＳＥＭ和ＸＲＤ的分析表明，界面产物相为ＣｕＡｌＯ２。
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| 关 键 词： | 直接敷铜法 预氧法 界面产物 氧化铝陶瓷 基板 |
| 收稿时间： | 1999-7-22 |
| 修稿时间： | 1999-9-20 |
Interfacial Product of Direct Copper-Bonded Alumina Substrate |
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| FANG Zhi-yuan,CHEN Hu,ZHOU He-Ping.Interfacial Product of Direct Copper-Bonded Alumina Substrate[J].Journal of Inorganic Materials,2000,15(5):935-938. |
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| Authors: | FANG Zhi-yuan CHEN Hu ZHOU He-Ping |
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| Affiliation: | StateKeyLaboratoryofNewCeramicsandFineProcessing;DepartmentofMaterialsScienceandEngineering;TsinghuaUniversity;BeiJing100084;China |
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| Abstract: | Direct copper-bonded alumina substrates were widely usedin large-power applications. Cu-Cu2O eutectic bonding of copper to Al2O3was investigated in this paper. Oxygen was introduced by pre-oxidizing copper foil andit was shown that Cu-Cu2O eutectic liquid promoted the bonding between copperand Al2O3 greatly. Chemical reaction happened at the solid-liquid interface andled to the formation of the binary oxide CuAlO2, which can be observed whenthe specimen was prepared at 1070C for 60min. |
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| Keywords: | direct bonded copper(DBC) pre-oxidizing interfacial product |
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