| 化学镀无铅的锡基二元合金的研究和应用 |
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| 引用本文： | 张景双,潘莉,黎德育,屠振密. 化学镀无铅的锡基二元合金的研究和应用[J]. 电镀与环保, 2004, 24(3): 16-18 |
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| 作者姓名： | 张景双 潘莉 黎德育 屠振密 |
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| 作者单位： | 哈尔滨工业大学,"威海"海洋系,山东威海,264209;哈尔滨工业大学,"威海"海洋系,山东威海,264209;哈尔滨工业大学,"威海"海洋系,山东威海,264209;哈尔滨工业大学,"威海"海洋系,山东威海,264209 |
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| 摘 要： | 化学镀无铅的锡基二元合金镀层如Sn-Ag、Sn-Bi、Sn-In、Sn-Sb、Sn-Zn等,它们常具有优良的可焊性和耐烛性,故多用在印制板和其它电子领域,以取代含铅的锡合金,而锡-锌合金又可作为代镉镀层,有利于环境保护.以上这些锡基二元合金镀层可从适宜的化学镀液组成和工艺条件下得到,本文对此进行了论述.
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| 关 键 词： | 化学镀 锡基合金 可焊性 耐蚀性 应用 |
| 文章编号： | 1000-4742(2004)03-0016-03 |
| 修稿时间： | 2003-12-16 |
A Study of Electroless Lead-free Tin-base Binary Alloys Plating |
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| ZHANG Jing shuang,PAN Li,LI De yu,TU Zhen mi. A Study of Electroless Lead-free Tin-base Binary Alloys Plating[J]. Electroplating & Pollution Control, 2004, 24(3): 16-18 |
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| Authors: | ZHANG Jing shuang PAN Li LI De yu TU Zhen mi |
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| Abstract: | Coatings from lead free electroless tin base binary alloy plating, such as Sn Ag, Sn Bi, Sn In, Sn Sb, Sn Zn, etc., possess excellent solderability and corrosion resistance, so are often applied to printed circuit board and other electronics fields to replace tin alloy containing lead. In addition, Sn Zn alloy can also be used as a substitute for cadmium, which is helpful to environmental protection. The above tin base binary alloys coatings can be obtained from appropriate electroless bath compositions and operating conditions, which are also discussed. |
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| Keywords: | Electroless plating Tin base alloy Solderablity Corrosion resistance Application |
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