Study of nickel contamination on the ultrasonic bondability of gold bond finger of SD-48L packages |
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Authors: | K C Lee S J Hu |
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Affiliation: | (1) School of Physics, Universiti Sains Malaysia, 11800 USM Penang, Malaysia;(2) Present address: National Semiconductor Pte. Ltd., 11 Lorong 3, 1231 Toa Payoh, Singapore |
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Abstract: | Contamination is a major barrier to the adhesion of solid-phase metal couples. If me-tallic impurities are present on a gold
(Au) bonding surface, it can easily react with oxygen molecules in the atmosphere to form oxides. The oxides formed prevent
intimate metal-metal contact which is important for bond formation. A study is carried out to investigate whether nickel (Ni)
contamination can affect the ultrasonic bondability of Au bond finger of side-braze 48-lead ceramic package. Two sets of samples
are used for this study. The first set comprising uncontaminated packages serves as a control group. The second set are Ni
contaminated packages. The results of the study show that Ni contamination does not affect the ultrasonic bondability of the
Au bond finger. A second study to ascertain the quality of the wire bonds however shows that the mean bond tensile strength
of the Ni contaminated packages has weakened slightly. |
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Keywords: | Nickel contamination Au bond finger SD-48L packages Ultrasonic bondability |
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