| 电解铜箔添加剂配方优化 |
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| 引用本文： | 易光斌,何田,杨湘杰,彭文屹,蔡芬敏,卢皞,袁智斌. 电解铜箔添加剂配方优化[J]. 电镀与涂饰, 2010, 29(11) |
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| 作者姓名： | 易光斌 何田 杨湘杰 彭文屹 蔡芬敏 卢皞 袁智斌 |
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| 作者单位： | 南昌大学机电学院,江西,南昌,330031;南昌大学材料科学与工程学院,江西,南昌,330031;中国船舶系统工程部,北京,100036;江西省江铜-耶兹铜箔有限公司,江西,南昌,330029 |
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| 基金项目： | 科技部科技人员服务企业行动项目，江铜-耶兹铜箔有限公司与南昌大学合作研究项目 |
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| 摘 要： | 在高电流密度下用直流电沉积法制备了电解铜箔。电解液基础成分为:Cu2+80～90g/L,H2SO4120～130g/L和Cl-30～40mg/L。用正交试验法研究了聚乙二醇、2–巯基苯并咪唑、硫脲、明胶等4种添加剂对电解铜箔力学性能的影响。最佳配比为:聚乙二醇0～5.5mg/L,2–巯基苯并咪唑0～6.0mg/L,硫脲0～3.0mg/L,明胶0～4.5mg/L。由此制备的铜箔,其常温抗拉强度与延伸率分别是411.3MPa和9.3%,高温抗拉强度与延伸率分别是209.2MPa和2.9%。
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| 关 键 词： | 电解铜箔 添加剂 正交试验 力学性能 |
Optimization of additive formulation for electrolytic copper foil |
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| YI Guang-bin,HE Tian,YANG Xiang-jie,PENG Wen-yi,CAI Fen-min,LU Hao,YUAN Zhi-bin. Optimization of additive formulation for electrolytic copper foil[J]. Electroplating & Finishing, 2010, 29(11) |
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| Authors: | YI Guang-bin HE Tian YANG Xiang-jie PENG Wen-yi CAI Fen-min LU Hao YUAN Zhi-bin |
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| Affiliation: | YI Guang-bin,HE Tian,YANG Xiang-jie,PENG Wen-yi,CAI Fen-min,LU Hao,YUAN Zhi-bin School of Mechanical , Electronic Engineering,Nanchang University,Nanchang 330031,China |
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| Abstract: | Electrolytic copper foils were prepared by direct current electrodeposition at high current density. The electrolyte is mainly composed of Cu2+ 80-90 g/L,H2SO4 120-130 g/L and Cl-30-40 mg/L. The effects of four kinds of additives such as polyethylene glycol (PEG),2-mercapto-benzimidazole (M),thiourea (TU) and gelatin on the mechanical properties of electrolytic copper foil were studied. The optimal formulation is as follows:PEG 0-5.5 mg/L,M 0-6 mg/L,TU 0-3 mg/L,and gelatin 0-4.5 mg/L. The tensile strength a... |
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| Keywords: | electrolytic copper foil additive orthogonal test mechanical property |
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