首页 | 本学科首页   官方微博 | 高级检索  
     


Chemorheology of thermosetting resins. I. The chemorheology and curing kinetics of unsaturated polyester resin
Authors:Chang Dae Han  Kwok-Wai Lem
Abstract:The rheological properties and curing kinetics of a general-purpose polyester resin have been determined during isothermal cure. Both steady and oscillatory shearing flow properties were determined using a cone-and-plate rheometer, and the curing kinetics were determined using a differential scanning calorimeter (DSC). It was found that, as cure progresses, the steady shear viscosity increases very rapidly with cure time at all shear rates investigated, and normal forces show negative values at low shear rates and positive values at high shear rates. The observed negative normal forces are believed to result from material shrinkage during cure, and positive normal forces from the deformation of large molecules, formed by crosslinking reactions during cure. Note that, in a cone-and-plate rheometer, the shrinkage force acts in the direction opposite to that of normal forces. It is, therefore, concluded that extreme caution is needed in the interpretation of normal force measurements with thermosetting resins, subjected to steady shearing flow. Dynamic measurements seem to offer some insight on the onset of gel formation. More specifically, we have found that, when the unsaturated polyester resin was cured at a fast rate, the time at which a maximum in the loss modulus G” occurs coincides reasonably well with the time tη∞ at which the steady shear viscosity η approaches infinity. However, at a slow rate of cure, the time at which tan δ equals unity agrees fairly well with tη∞. DSC measurement has permitted us to determine the degree of cure as a function of cure time and the kinetic parameters in an empirical expression for the curing kinetics advanced by Kamal and co-workers. By combining the rheological and DSC measurements, we have constructed plots describing how the viscosity increases with the degree of cure, at various values of isothermal curing temperature.
Keywords:
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号