| 塑封IC潮敏分级及相应的使用要求 |
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| 引用本文： | 陆飞. 塑封IC潮敏分级及相应的使用要求[J]. 电子工艺技术, 2004, 25(1): 37-38 |
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| 作者姓名： | 陆飞 |
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| 作者单位： | 杰尔系统(上海)有限公司,上海,200121 |
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| 摘 要： | 参考JEDEC标准,介绍和讨论塑封IC器件的潮敏问题,如潮敏分级,相应的包装要求,SMT回流焊温度曲线等.对涉及潮敏IC器件的电子组装应用实践中的一些问题提出参考意见.
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| 关 键 词： | 集成电路 潮敏分级 返修 SMT JEDEC标准 |
| 文章编号： | 1001-3474(2004)01-0037-02 |
| 修稿时间： | 2003-08-20 |
Moisture Sensitive Level for Plastic IC and Some Application Notes |
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| LU Fei. Moisture Sensitive Level for Plastic IC and Some Application Notes[J]. Electronics Process Technology, 2004, 25(1): 37-38 |
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| Authors: | LU Fei |
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| Abstract: | Refer to related JEDEC standards, some issues for plastic IC - such as moisture sensitive level, packing requirements, SMT reflow profile and reworking - are introduced and discussed. Also some application notes for the board assembly of moisture sensitive devices are provided for reference. |
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| Keywords: | SMT |
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