| 单晶硅片超精密加工表面亚表面损伤检测技术 |
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| 引用本文： | 张银霞. 单晶硅片超精密加工表面亚表面损伤检测技术[J]. 电子质量, 2004, 0(7): 72-75 |
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| 作者姓名： | 张银霞 |
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| 作者单位： | 大连理工大学机械工程学院大连,大连,116024 |
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| 摘 要： | 对超精密加工的硅片的表层完整性的精密控制需要以精、准的检测技术为基础,本文概括性的分析了用于超精密加工硅片的表面亚表面损伤检测技术,并从破坏性和非破坏性两个角度对检测方法的应用和发展进行了论述.
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| 关 键 词： | 超精密加工 硅片 损伤 检测 |
| 文章编号： | 1003-0107(2004)07-0072-04 |
Measurement of Silicon Wafer Surface/subsurface Damage Induced by Ultra-precision Processing |
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| ZHANG Yin-xia. Measurement of Silicon Wafer Surface/subsurface Damage Induced by Ultra-precision Processing[J]. Electronics Quality, 2004, 0(7): 72-75 |
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| Authors: | ZHANG Yin-xia |
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| Abstract: | The precise measurement is the base of the precisely controlling the silicon wafer surface and subsurface integrity during ultra-precision processing. In this paper, the measuring techniques involved in the assessment of silicon wafer damage have been discussed briefly. Moreover, the application and development of the techniques are presented. |
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| Keywords: | ultra-precision processing silicon wafer damage measurement |
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