| 利用激光辅助植晶机理形成PCB的高厚径比盲微导通孔的质量和可靠性 |
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| 引用本文： | 蔡积庆. 利用激光辅助植晶机理形成PCB的高厚径比盲微导通孔的质量和可靠性[J]. 印制电路信息, 2006, 19(3): 34-42 |
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| 作者姓名： | 蔡积庆 |
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| 摘 要： | 概述了利用激光辅助植晶(LAS)机理形成PCB的高厚径比盲微导通孔的质量和可靠性,可以比得上传统的化学镀技术。LAS是一种有前途的替代技术。
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| 关 键 词： | 高厚径比盲微导通孔 激光辅助植晶机理 质量和可靠性 |
Quality and Reliability of High Aspect-Ratio Blind Microvias Formed by Laser-Assisted Seeding Mechanism in PCB |
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| Cai Jiqing. Quality and Reliability of High Aspect-Ratio Blind Microvias Formed by Laser-Assisted Seeding Mechanism in PCB[J]. Printed Circuit Information, 2006, 19(3): 34-42 |
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| Authors: | Cai Jiqing |
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| Abstract: | This paper describes the quality and reliability of high aspect-ratio blind microvias formed by Laser- Assisted Seeding (LAS) mechanism in PCB, as reliable as that formed by conventional electroless plating technology.LAS is a promising alternative technology. |
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| Keywords: | high aspect-ratio blind microvias laser-assisted seeding mechanism quality and reliability |
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