| 铝基氧化铝表面化学镀铜工艺研究 |
| |
| 引用本文： | 郭登峰,王文昌,光崎尚利,陈智栋. 铝基氧化铝表面化学镀铜工艺研究[J]. 电镀与精饰, 2009, 31(10) |
| |
| 作者姓名： | 郭登峰 王文昌 光崎尚利 陈智栋 |
| |
| 作者单位： | 江苏工业学院,化学化工学院,江苏,常州,213164;常州江工阔智电子技术有限公司,江苏,常州,213164;江苏工业学院,化学化工学院,江苏,常州,213164;常州江工阔智电子技术有限公司,江苏,常州,213164 |
| |
| 基金项目： | 江苏省自然科学基金资助项目 |
| |
| 摘 要： | 在铝基板表面的氧化铝上实施化学镀铜,获得剥离强度良好的化学镀铜层.利用扫描电子显微镜观察了化学镀铜层的剖面形貌;测定了硅烷化前后氧化铝表面的润湿性;分析了硅烷化时间和施镀时间对氧化铝表面铜厚度的影响.结果表明:在铝基板表面氧化铝上所制得的化学镀铜层与基体结合力良好,可以满足印制线路板的要求.
|
| 关 键 词： | 铝基板 氧化铝 化学镀铜 |
Study on Electroless Copper plating Technology of Alumina layer on Aluminum Substrate |
| |
| GUO Deng-feng,WANG Wen-chang,Mitsuzaki Naotoshi,CHEN Zhi-dong. Study on Electroless Copper plating Technology of Alumina layer on Aluminum Substrate[J]. Plating & Finishing, 2009, 31(10) |
| |
| Authors: | GUO Deng-feng WANG Wen-chang Mitsuzaki Naotoshi CHEN Zhi-dong |
| |
| Affiliation: | GUO Deng-feng1,WANG Wen-chang1,Mitsuzaki Naotoshi2,CHEN Zhi-dong1,2(1.Department of Chemical Engineering,Jiangsu Polytechnic University,Changzhou 213164,China,2.Changzhou JPU Qualtec Co.Ltd.,China) |
| |
| Abstract: | Electroless copper plating,which shows good peeling strength,was carried out for the deposition of copper on alumina layer covered on aluminum substrate.The cross-sectional morphology of the coatings was studied by SEM.The wettability of alumina surface before and after silanization was measured.Silanization and plating period,which affected the copper coating thickness,were analyzed.The results indicated that excellent adhesion between copper coating and alumina was obtained under optimum conditions and it... |
| |
| Keywords: | aluminum substrate alumina electroless copper plating |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
