PTLPB of Si3N4 to FA-129 using nickel as a core interlayer |
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| Affiliation: | 1. University of Alberta, Department of Chemical and Materials Engineering, Edmonton, Alberta T6G 2V4, Canada;2. University of Alberta, Department of Civil and Environmental Engineering, Edmonton, Alberta T6G 2V4, Canada;3. Waiward Steel LLP, Engineering Department, Edmonton, Alberta T6B 2V5, Canada |
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| Abstract: | Partial transient liquid phase bonding was applied to a silicon nitride/iron aluminide alloy (FA-129) joint. This joint was composed of two independent joining systems. The joint configuration was Si3N4/75Cu–25Ti/Cu/Ni/Al/FA-129. The results demonstrate that homogenization has no effect on the kinetic of the reaction layer formation between the ceramic and the nickel core due to a previous dissolution reaction. The reaction layer composition evolves from a TiN–Ti5Si3 layer system after reaction during the first soaking time, to a single TiN layer after the complete cycle. The dissolution of the Ti5Si3 layer in the Ni core becomes the driving factor influencing the properties of the joint. The composition of the copper–nickel alloy interlayer changes with homogenization treatment, passing from a maximum of 70–20 wt% Cu, depending on the conditions. NiAl and Ni3Al intermetallics were observed at the interface between the nickel and the FA-129 and their thicknesses varies with the homogenization conditions. The strength values obtained were within the range of 80 MPa, with the ceramic reaction layer being the region where all failures occurred. |
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