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Nucleation of copper on an assembly of carbon microelectrodes
Authors:Z. Gruba?
Affiliation:a Department of General and Inorganic Chemistry, Faculty of Chemical Technology, University of Split, 21000 Split, N. Tesle 10, Croatia
b Department of Electrochemistry, Faculty of Chemical Engineering and Technology, University of Zagreb, 10000 Zagreb, P.O. Box 177, Croatia
Abstract:The initial stage of copper electrodeposition on the electrochemically activated assembly of carbon microelectrodes from an acid solution of copper sulfate was investigated using cyclic voltammetry, potentiostatic pulse technique and electrochemical impedance spectroscopy. Analysis of the experimental current transients has been carried out using a non-linear fitting procedure according to the model that takes into account spherical diffusion towards a disc-shaped microelectrode. The higher values of diffusion coefficient in comparison with those observed on planar electrodes were explained with an increased diffusion caused by the electrode geometry. Impedance spectra showed two time constants, the high-frequency related to the charge transfer process and the low-frequency corresponded to the deposit morphology.
Keywords:Copper   Microelectrodes   Thin films   Fiber technology   Kinetics   Electrical properties
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