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Effects of cooling rates on microstructure and microhardness of lead-free Sn-3.5%Ag solders |
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| Authors: | SHEN Jun LIU Yong-chang HAN Ya-jing GAO Hou-xiu WEI Chen YANG Yu-qin |
| Abstract: | |
| Keywords: | lead-free solder eutectic reaction intermetallic compounds microhardness |
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