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镁合金化学镀镍层的生长过程
引用本文:邵忠财,李建中,康凤娣,田彦文.镁合金化学镀镍层的生长过程[J].化工学报,2005,56(2):301-305.
作者姓名:邵忠财  李建中  康凤娣  田彦文
作者单位:沈阳理工大学环境与化学工程学院,辽宁 沈阳 110168;东北大学材料与冶金学院,辽宁 沈阳 110004
基金项目:辽宁省自然科学基金项目 (2040189).~~
摘    要:The initial nickel deposition for the direct electroless nickel plating on non-catalytically active magnesium alloy is critical. The surface morphology and composition of the initial nickel plating coating are obtained by means of the scanning electron microscopy (SEM) and the energy dispersive X-ray (EDS). In addition, the mass gain/loss in the initial nickel deposition process was measured by using the electrobalance. The results showed that the MgO coating was gradually corroded by the plating solution, at the same time, MgF2 produced by F , H and MgO was deposited on the substrate during the initial electroless plating process. The nickel of the initial electroless plating was mostly growing on the boundary between the MgF2 coating and the MgO coating of the activation substrate, and then came to two sides. After that, the Ni-P coating growth rate to cover with the MgF2 coating was prior to the MgO coating. The electroless plating was in company with the substrate corrosion, but the electroless plating rate catalyzed by the exchanged nickel was more than the substrate corrosion rate.

关 键 词:镁合金  化学镀  生长过程  腐蚀  
文章编号:0438-1157(2005)02-0301-05
收稿时间:2004-5-27
修稿时间:2004-7-16  

Deposition process of electroless nickel plating on magnesium alloy
SHAO Zhongcai,LI Jianzhong,KANG Fengdi,TIAN Yanwen.Deposition process of electroless nickel plating on magnesium alloy[J].Journal of Chemical Industry and Engineering(China),2005,56(2):301-305.
Authors:SHAO Zhongcai  LI Jianzhong  KANG Fengdi  TIAN Yanwen
Abstract:The initial nickel deposition for the direct electro le ss nickel plating on non-catalytically active magnesium alloy is critical.The s urface morphology and composition of the initial nickel plating coating are obta ined by means of the scanning electron microscopy (SEM) and the energy dispersiv e X-ray (EDS).In addition, the mass gain/loss in the initial nickel deposition process was measured by using the electro-balance.The results showed that the M gO coating was gradually corroded by the plating solution, at the same time, MgF 2 produced by F-,H+ and MgO was deposited on the substrate during the init ial electroless plating process.The nickel of the initial electroless plating wa s mostly growing on the boundary between the MgF 2 coating and the MgO coating of the activation substrate, and then came to two sides.After that, the Ni-P co ating growth rate to cover with the MgF 2 coating was prior to the MgO coating. The electroless plating was in company with the substrate corrosion,but the elec troless plating rate catalyzed by the exchanged nickel was more than the substra te corrosion rate.
Keywords:magnesium alloy  electroless nickel plating  depositi on process  corrosion
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