HIgh-Power C-Band Multiple-IMPATT-Diode Amplifiers

The design considerations and performance characteristics of two high-power microwave reflection amplifiers that use multiple silicon IMPATT diodes are presented. The amplifiers employ microstrip hybrid-circuit-type power combiners to combine the individually matched IMPATT diodes. The first unit, a single-stage 4-diode amplifier, produced 8-W output with 6-dB gain while the second 12-diode amplifier gave 15.8-W output at about 9-dB gain. FM and AM noise added by these amplifiers has been measured with each amplifier driven to nearly full output. Use of microstrip hybrid-circuit power combiners appears to offer a simple and economical design approach for the implementation of microwave solid-state power amplifiers using multiple active devices.     

Integrated electrically tuned X-band power amplifier utilizing Gunn and IMPATT diodes

A totally integrated X-band power amplifier for FM and PM communication system applications having 1-W output power and 30-dB gain is described. The amplifier consists of two electrically tuned injection-locked oscillator stages taht are tunable over a 500-MHz range with 250-MHz minimum locking bandwidth. A Gunn diode is utilized in the first stage and a silicon IMPATT diode in the second stage oscillator for the best overall FM noise, AM/PM conversion, output power, and efficiency. The FM noise and AM/PM conversion of the separate stages are presented in relation to overall amplifier performance. The amplifier design includes a combined power monitor and `out-of-lock' detection circuit. In addition, temperature-compensated current and voltage regulators and automatic interface circuitry to shut off the amplifier when out of lock occurs are described. Temperature compensation for the free-running frequency of each stage over the temperature and frequency range is discussed.     

K-Band High-Power GaAs FET Amplifiers

Lumped-element internal matching techniques were successfully adopted for K-band power GaAs FET amplifiers. The developed 18-GHz band two-stage amplifier provides 1.05-W power output at 1-dB gain compression and 1.26-W saturated power output with 8.1-dB small-signal gain. The 20-GHz band single-stage amplifier has 1.04-W power output with 3-dB associated gain. Lumped-element internal matching circuit design as well as amplifier fabrication are described. Intermodulation distortion and AM-to-PM conversion characteristics are also presented.     

Ka全频段功率合成放大器的设计

采用基于波导-微带探针阵列的四路波导空间功率分配/ 合成结构,研制了一种Ka 全频段1 W 功率合成放大器。该模块中集成了驱动放大器以提高整个功放的增益。利用镜像原理,简化了具有对称性结构的波导-微带四探针功率分配/ 合成网络的仿真设计。在分析了屏蔽微带线相关寄生模式的基础上,合理设计腔体结构,保证了合成放大器在全频段内稳定工作。实测结果表明,在26.5 ~40 GHz 的Ka 全频段范围内,连续波饱和输出功率大于30.5 dBm,小信号增益大于40 dB。合成效率全频带内大于84%,36 GHz 以下频段高于88%。     

A Compact 6.5-W PHEMT MMIC Power Amplifier for Ku-Band Applications

A compact 6.5-W AlGaAs/InGaAs/GaAs PHEMT monolithic microwave integrated circuit (MMIC) power amplifier (PA) for Ku-band applications is proposed. This two-stage amplifier with chip size of 8.554mm² (3.64mmtimes2.35mm) is designed to fully match 50-Omega input and output impedance. Under 8V and 2000mA dc bias condition, the PA deliver 38.1dBm (6.5W) saturated output power, 10.5-dB small signal gain and peak power added efficiency of 24.6% from 13.6 to 14.2GHz. This MMIC also achieved the best power densities (760mW/mm²) at Ku band reported to date     

一种超宽带中功率MPM的设计

介绍了一种超宽带中功率微波功率模块（MPM）的设计方法,主要内容包括MPM的系统构成和系统集成设计,重点阐述了前级固态驱动放大器以及后级行波管放大器外围集成电源的设计方法,针对MPM要求的小体积、高功率密度带来的散热问题作了细致的分析,提出了工程设计中的解决方法,并以此为基础,研制出了一种较为通用的100W／6—18GHz微波功率模块。     

Design and performance of wideband GaAs MMIC's for high-speedoptical communication systems

Advanced design techniques for GaAs wideband direct-coupled amplifiers are described. The amplifier achieved a 20 dB gain with a 3 dB bandwidth of 13 GHz and a 5-7 dB noise figure. An equalizing amplifier module consisting of amplifier and variable attenuator monolithic microwave integrated circuits (MMICs) exhibited a high gain of 43 dB over a 10 GHz band with a controllable gain of 20-43 dB     

A Single Supply, High Linearity 2-W PA MMIC for WLAN Applications Using Quasi-Enhancement Mode PHEMTs

A fully matched, 2-W high linearity amplifier monolithic microwave integrated circuit, by using quasi-enhancement mode technology of AlGaAs/InGaAs/ GaAs pseudomorphic high electron mobility transistors, is demonstrated for wireless local area network applications. At Vgs= 0 V, V_ds= 5 V, this power amplifier has achieved 14-dB small-signal gain, 33-dBm output power at 1-dB gain compression point, and 34.5-dBm saturated output power with 35% power added efficiency at 5.8 GHz. Moreover, high-linearity with 45.2-dBm third-order intercept point is also achieved     

X频段2W功放模块的设计

介绍了一种新颖X频段功放模块的设计方法和研制过程.该功放模块利用微波电路大信号CAD技术,采用混合集成电路制作工艺,成功地解决了模块单电源供电、体积小等难点.整个电路密封在标准管壳内,在X波段高端、带宽500 MHz频率范围内,实现了小信号增益≥16dB,饱和输出功率Pout≥2 W的性能,具有体积小、效率高、单电源供电等特点.     

P波段脉冲输出150W高增益功率晶体管

采用微波功率管二次发射极镇流和掺砷多晶硅发射极覆盖树枝状结构等新工艺技术，研制出用于工程的实用化P波段脉冲大功率晶体管。该器件由16个单胞内匹配而成，在该频带内，脉宽500μs，占空比15％，脉冲输出150W，增益大于10dB，集电极效率大于50％。     

W波段集成化收发组件设计北大核心CSCD

基于混合微波集成电路技术(HMIC)设计了一种W波段小型化高频收发组件。该收发组件由固态发射机、环形器和接收机三部分组成。发射支路输入信号经过倍频放大后进入二选一开关,输出到天线自检口或经由环形器输出。为了实现高输出功率,该组件采用功率合成的设计思想,通过3 dB波导桥结构实现对两路功放的合成,解决了单个单片功率放大器的输出功率有限的问题。所设计的收发组件整体尺寸为125 mm×90 mm×26.5 mm。实测结果表明,在90~96 GHz工作频带范围内,遥测电压4.23 V。该收发组件的发射部分输出功率范围为33.6~35.4 dBm,开关隔离度大于110 dB;接收部分增益范围为30.2~33 dB,噪声系数小于6.5 dB。该组件具备良好的射频性能,同时实现了高集成度、大功率、高增益、高隔离度的要求。     

A 77 GHz mHEMT MMIC Chip Set for Automotive Radar Systems

A monolithic microwave integrated circuit (MMIC) chip set consisting of a power amplifier, a driver amplifier, and a frequency doubler has been developed for automotive radar systems at 77 GHz. The chip set was fabricated using a 0.15 µm gate‐length InGaAs/InAlAs/GaAs metamorphic high electron mobility transistor (mHEMT) process based on a 4‐inch substrate. The power amplifier demonstrated a measured small signal gain of over 20 dB from 76 to 77 GHz with 15.5 dBm output power. The chip size is 2 mm × 2 mm. The driver amplifier exhibited a gain of 23 dB over a 76 to 77 GHz band with an output power of 13 dBm. The chip size is 2.1 mm × 2 mm. The frequency doubler achieved an output power of –6 dBm at 76.5 GHz with a conversion gain of ?16 dB for an input power of 10 dBm and a 38.25 GHz input frequency. The chip size is 1.2 mm × 1.2 mm. This MMIC chip set is suitable for the 77 GHz automotive radar systems and related applications in a W‐band.     

A 9.1–10.7 GHz 10-W, 40-dB Gain Four-Stage PHEMT MMIC Power Amplifier

This letter presents a compact X-band high gain and high power four-stage AlGaAs/InGaAs/GaAs pseudomorphic high electron mobility transistor (PHEMT) monolithic microwave integrated circuit (MMIC) high power amplifier (PA). This amplifier is designed to fully match a 50-Omega input and output impedance. Based on 0.35-mum gate-length power PHEMT technology, this PA MMIC is fabricated on a 3-mil thick wafer. While operating under 8 V and 2700-mA dc bias condition, the characteristics of 40-dB small-signal gain, a 10-W continuous-wave saturation output power, and 33% power added efficiency at 9.7GHz can be achieved     

A compact LTCC-based Ku-band transmitter module

Presents design, implementation, and measurement of a three-dimensional (3-D)-deployed RF front-end system-on-package (SOP) in a standard multi-layer low temperature co-fired ceramic (LTCC) technology. A compact 14 GHz GaAs MESFET-based transmitter module integrated with an embedded bandpass filter was built on LTCC 951AT tapes. The up-converter MMIC integrated with a voltage controlled oscillator (VCO) exhibits a measured up-conversion gain of 15 dB and an IIP3 of 15 dBm, while the power amplifier (PA) MMIC shows a measured gain of 31 dB and a 1-dB compression output power of 26 dBm at 14 GHz. Both MMICs were integrated on a compact LTCC module where an embedded front-end band pass filter (BPF) with a measured insertion loss of 3 dB at 14.25 GHz was integrated. The transmitter module is compact in size (400 /spl times/ 310 /spl times/ 35.2 mil/sup 3/), however it demonstrated an overall up-conversion gain of 41 dB, and available data rate of 32 Mbps with adjacent channel power ratio (ACPR) of 42 dB. These results suggest the feasibility of building highly SOP integrated RF front ends for microwave and millimeter wave applications.     

八毫米脉冲IMPATT振荡器

本文简述了脉冲IMPATT器件的设计考虑和制造工艺以及振荡器的微波电路结构和脉冲调制器的原理。对脉冲偏置期间产生的频啁效应作了原理性说明,并提出了减小频啁带宽的方法。目前所研制的八毫米IMPATT振荡器最大的脉冲输出功率在34.2GHz下为15.7W。     

Broad-band high-power amplifier using spatial power-combining technique

High power, broad bandwidth, high linearity, and low noise are among the most important features in amplifier design. The broad-band spatial power-combining technique addresses all these issues by combining the output power of a large quantity of microwave monolithic integrated circuit (MMIC) amplifiers in a broad-band coaxial waveguide environment, while maintaining good linearity and improving phase noise of the MMIC amplifiers. A coaxial waveguide was used as the host of the combining circuits for broader bandwidth and better uniformity by equally distributing the input power to each element. A new compact coaxial combiner with much smaller size is investigated. Broad-band slotline to microstrip-line transition is integrated for better compatibility with commercial MMIC amplifiers. Thermal simulations are performed and an improved thermal management scheme over previous designs is employed to improve the heat sinking in high-power application. A high-power amplifier using the compact combiner design is built and demonstrated to have a bandwidth from 6 to 17 GHz with 44-W maximum output power. Linearity measurement has shown a high third-order intercept point of 52 dBm. Analysis shows the amplifier has the ability to extend spurious-free dynamic range by N/sup 2/3/ times. The amplifier also has shown a residual phase floor close to -140 dBc at 10-kHz offset from the carrier with 5-6-dB reductions compared to a single MMIC amplifier it integrates.     

A 4-W X-band compact coplanar high-power amplifier MMIC with 18-dB gain and 25% PAE

The performance of a compact coplanar microwave monolithic integrated circuit (MMIC) amplifier with high output power in the X-band is presented. Based on our 0.3-/spl mu/m gate-length GaAs power pseudomorphic high electron mobility transistor (PHEMT) process on 4-in wafer, this two-stage amplifier, having a chip size of 16 mm/sup 2/, averages 4-W continuous-wave (CW) and 25% mean power-added efficiency (PAE) in the X-band, with more than 18-dB linear gain. Peak output powers of P/sub -1dB/=36.3dBm (4.3 W) and P/sub sat/ of 36.9 dBm (4.9 W) at 10 GHz with a PAE of 50% were also measured. Compared to previously reported X-band coplanar high-power amplifiers, this represents a chip size reduction of 20%, comparable to the size of compact state-of-the-art microstrip power amplifiers.     

基于大信号模型的L波段400W高效GaN功率放大器设计

文章阐述了用精确的GaN Angelov模型设计了一款L波段400W内匹配率放大器.选用SiC衬底的GaN器件是为了获得大功率输出以及高效率性能.为了精确设计放大器,采用脉冲I-V测试和多偏置的S参数测试建立起高压GaN大信号模型.采用模型设计的GaN放大器输入输出电路集成在17.4mm×24mm的封装管壳里.最终采用单枚55mm栅宽GaN管芯设计的放大器在48V漏压,100μs脉宽,10%占空比偏置下在1.2~1.4GHz输出功率大于400W,功率增益大于15dB,最高功率附加效率达到81.3%,这是国内L波段400W微波功率放大器的最高效率报道,验证了模型的准确度,实现了极好的电路性能.     

A single-supply Ku-band 1-W power amplifier MMIC with compact self-bias PHEMTs

In this letter, the design of a self-bias 1.8-mm AlGaAs/InGaAs/GaAs pseudomorphic high electron mobility transistor with a compact source capacitor for operation in Ku-band frequency is described. Based on the proposed device, a self-bias Ku-band 1-W two-stage power amplifier monolithic microwave integrated circuit (MMIC) is also demonstrated. Under a single bias condition of 8 V and 630 mA, the self-bias MMIC possesses 14.2-dB small-signal gain, 30.2-dBm output power at 1-dB gain compression point with 19.2% power added efficiency and 31.3-dBm saturated output power with 22.5% power added efficiency at 14GHz. With the performance comparable to the dual-bias MMIC counterpart, the proposed self-bias MMIC is more attractive to system designers on very small aperture terminal applications.     

A 6.5—16-GHz monolithic power amplifier module

A miniaturized 6.5-16-GHz power amplifier module, which includes T/R switch, dual polarity power supply, switch driver, and gate functions, was designed using two types of broad-band MMIC amplifiers. The two cascade designs were a 900-1200-µm FET amplifier and a 300-300-µm feedback amplifier which were used to provide large and small gain functions, respectively. The module exhibits 35 dB of gain, 1-W power output, and 55-dB T/R switch isolation.