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纳米颗粒增强铜基复合材料的最新研究动态及发展趋势 总被引:7,自引:0,他引:7
纳米颗粒增强铜基复合材料具有独特的结构特征、优异的力学性能,与纯铜近似的导电、导热性能,是一种有着广泛应用领域的功能材料。综述了纳米颗粒增强相的类型及选用原则,论述了纳米颗粒增强铜基复合材料的制备方法以及颗粒增强相的类型、颗粒增强相的含量、制备工艺三方面对复合材料性能的影响,并对将来材料的研究方向进行了展望。 相似文献
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弥散强化铜基复合材料具有高温强度、高导电、导热的特性,具有不可替代的作用。以氧化铝弥散强化铜复合材料为例,综述其制备工艺、性能分析、强化机理及应用领域,并预示了其在冶金企业应用的美好前景。 相似文献
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弥散强化铜基复合材料制备的关键是如何向铜基体中引入弥散强化相以及控制弥散相的粒径、分布等。本研究采用溶胶-凝胶法与微波加热、微波烧结相结合的方法制备Al2O3弥散强化铜基复合材料,并与普通电阻炉工艺制备的复合材料各项性能进行对比。 相似文献
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综述了铜基耐磨复合材料的研究发展现状,介绍了铜基耐磨材料种类、制备方法和增强机理.指出陶瓷颗粒增强铜基复合材料具有较高的耐磨性、高温力学性能和较低的热膨胀系数,且制备工艺简单、成本较低,粉末冶金法仍是当今制备和研究碳纤维和陶瓷颗粒增强铜基复合材料的重要方法,而原位反应合成技术由于具有显著的技术和经济优势,也具有很好的发展前景. 相似文献
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以Cu-Al合金粉末为原料,采用内氧化方法制备出综合性能优异的Al_2O_3增强铜基复合材料。通过观察试样的显微组织,并测试其拉伸性能,分析存在的各种强化机制并定量计算综合强化效果。结果表明:Cu基体上均匀分布着Al_2O_3弥散相颗粒,颗粒尺寸约6 nm,颗粒间距为30~50 nm,冷拉拔后Cu丝屈服强度高达680 MPa;主要强化机制是弥散强化和热错配位错强化,均匀分布的细小Al_2O_3颗粒阻碍位错运动,强化效果显著;屈服强度实验值略低于理论值692 MPa,原因为Al_2O_3颗粒的团聚和存在多种变体造成的。 相似文献
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采用高能球磨细化晶粒、原位反应合成及热压技术制备了致密的Al2 O3 p TiCp/Al复合材料 ,并用XRD、SEM、以及EDAX等手段分析了复合材料的相组成、显微组织。结果表明 :Al TiO2 C三元体系在热压反应烧结后 ,可制得致密度较高的Al2 O3p TiCp/Al原位复合材料 ,其显微组织中Al2 O3 和TiC颗粒尺寸为 1μm左右 ,分布均匀。高能球磨有利于增强颗粒细化及弥散分布和反应。 相似文献
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为满足现代电子工业日益增长的散热需求,急需研究和开发新型高导热陶瓷(玻璃)基复合材料,而改善复合材料中增强相与基体的界面结合状况是提高复合材料热导率的重要途径.本文在对金刚石和镀Cr金刚石进行镀Cu和控制氧化的基础上,利用放电等离子烧结方法制备了不同的金刚石增强玻璃基复合材料,并观察了其微观形貌和界面结合状况,测定了复合材料的热导率.实验结果表明:复合材料中金刚石颗粒均匀分布于玻璃基体中,Cu/金刚石界面和Cr/Cu界面分别是两种复合材料中结合最弱的界面;复合材料的热导率随着金刚石体积分数的增加而增加;金刚石/玻璃复合材料的热导率随着镀Cu层厚度的增加而降低,由于镀Cr层实现了与金刚石的化学结合以及Cr在Cu层中的扩散,镀Cr金刚石/玻璃复合材料的热导率随着镀Cu层厚度的增加而增加.当金刚石粒径为100μm、体积分数为70%及镀Cu层厚度为约1.59μm时,复合材料的热导率最高达到约91.0 W·m-1·K-1. 相似文献
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内生颗粒增强镁基复合材料的研究现状 总被引:1,自引:0,他引:1
从基体、增强相的选择、制备方法及其原理、组织与性能和原位反应的机理4个不同方面。概述了内生颗粒增强镁基复合材料的研究进展。着重介绍了机械合金化法、混合盐反应法、自蔓延高温合成法、反应浸渗法、固液反应法和原位固态反应法等镁基复合材料的制备方法及其原理与特点。最后,提出了存在的问题与展望。 相似文献
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为了开发高导热低成本电子封装材料与器件,采用SPS方法制备了SiC/Cu复合材料,研究了SiC的粒径和体积分数对材料致密度和热导率的影响.结果表明:随着SiC体积分数的减少(从70%到50%),材料致密度逐渐提高;随着SiC粒径从40μm变化到14μm,材料的致密度提高.在材料未达到完全致密的情况下,材料的热导率主要受致密度的影响,SiC粒径的减小和体积分数的适宜降低对材料热导率的提高有利.此外,研究了对SiC进行化学镀铜对复合材料的影响.SiC化学镀铜改善了复合材料两相界面的润湿性,与未镀铜SiC相比,使样品相对密度提高了3%,热扩散系数提高了60%,热导率为167 W/(m·K). 相似文献
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现代电子封装迫切需要开发新型高导热陶瓷(玻璃)基复合材料.本文在对镀钛金刚石进行镀铜和控制氧化的基础上,利用放电等离子烧结方法制备了金刚石增强玻璃基复合材料,并观察了其微观形貌和界面结合情况,测定了复合材料的热导率和热膨胀系数.实验结果表明:复合材料微观组织均匀,Ti/金刚石界面是复合材料中结合最弱的界面,复合材料的热导率随着金刚石粒径和含量的增大而增加,而热膨胀系数随着金刚石含量的增加而降低.当金刚石粒径为100 μm、体积分数为70%时,复合材料热导率最高达到了40.2 W·m-1·K-1,热膨胀系数为3.3×10-6K-1,满足电子封装材料的要求. 相似文献
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AbstractSilicon carbide reinforced copper matrix composites containing 50–80 vol.-%SiCp were fabricated by hot pressing copper coated SiCp powder. The results show that the densification, thermal expansion coefficients, flexural strength, and thermal conductivity of Cu/SiCp composites reinforced by electroless copper plating and their corrosion resistance in 5%NaCl solution are better than those without electroless plating. Physical properties and flexural strength of the composites decrease with an increase in SiCp content, whereas the corrosion resistance increases with an increase in SiCp volume fraction. By observing the fracture surface after a flexural test, it can be seen there are two types of fracture model: the cracking of Cu/SiCp interface and the pulling out of SiCp particles. The experiment also proved that the bonding strength of the Cu/SiCp interface and the pressure of the hot pressing operation are the two main factors which influence the fracture of these composites. 相似文献
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Mahesh Paidpilli Anish Upadhyaya D. K. Mishra G. P. Khanra S. C. Sharma 《Canadian Metallurgical Quarterly》2018,57(1):120-128
Tungsten–copper composites exhibit excellent resistance to erosion and good electrical as well as thermal conductivity. W–Cu composites are mainly used for heat sinks, electrical contacts and transpiration cooling applications. In this investigation the microstructure, mechanical and electrical properties of infiltrated tungsten–copper composite along the infiltration direction have been studied. The microstructures of the top, middle and bottom regions of the composite were evaluated using both optical and scanning electron microscope. Bulk hardness, electrical conductivity, instrumented hardness and contiguity were measured along the depth of W–Cu composite. It was found that the copper phase fraction decreases along the infiltration direction of the specimen. The effect of distribution of copper in the W–Cu system has a significant influence on the mechanical and the electrical properties. The effect of copper content on indentation depth, instrumented hardness, Young’s modulus, and stiffness of the composite has been evaluated using an instrumented hardness tester. 相似文献
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《Acta Metallurgica Materialia》1993,41(5):1431-1445
A systematic study of the effect of microstructural parameters on the fracture behaviour of silicon carbide particle reinforced aluminium matrix composites has been carried out. Acoustic emissions have been monitored during tensile testing, giving the size and number of emmissions as a function of strain. This has been shown to be simply related to the rate of void nucleation at the reinforcing phase. Both particle fracture and particle/matrix decohesion mechanisms can be detected. Void nucleation was observed from the onset of plastic deformation and a linear relationship between damage initiation rate and strain was found. The rate of emission increased with reiforcing particle size and volume fraction but was independent of matrix alloy composition and heat treatment. These results show that the failure strain of particulate metal matrix composites is not controlled solely by the onset of void nucleation at the reinforcing phase. Local failure processes in the matrix are shown to promote void coalescence and dominate the ductility. However, suppression of void nucleation at the particles increases the ductility. It is suggested that a critical number of fractured particles is required before failure. 相似文献