SiC/Cu纳米包裹粉体及其复合材料的制备

选用工业生产的SiC亚微米粉体,利用置换反应制备纳米Cu.采用直接还原-旋转沉淀工艺制备SiC/Cu包裹粉体.采用气氛烧结获得金属陶瓷复合材料.分别通过AES、XRD、SEM等分析方法对原始SiC粉体、包裹复合粉体和烧成样品进行表征.结果表明:包裹复合粉体具有"核-壳"结构,由于Cu的自发氧化使得复合粉体中出现Cu2O.包裹结构中SiC颗粒抑制了烧结过程中Cu的晶粒生长,从而使烧结样品呈现纳米结构.     

SiC/Cu复合材料磨损界面研究

采用非均相沉淀法制备了SiC／Cu包裹复合粉体,热压烧结制备SiC／Cu复合材料．以Si3N4球为摩擦副,在400℃条件下进行磨损实验．采用XRD、SEM分别对磨损前后材料的界面物相、磨损界面的形貌以及裂纹的扩展变化情况进行分析．结果表明：在该实验条件下,SiC／Cu复合材料界面的物相随着磨损的进行发生变化,Cu2O含量大大增加,同时出现CuO．随着循环荷载的增加,复合材料的内部产生了裂纹,裂纹的扩展是沿着SiC／Cu界面进行;而SiC颗粒的存在,使复合材料内部裂纹发生偏转,有利于提高材料的耐磨性．     

放电等离子体烧结SiC/Cu金属陶瓷复合材料研究

选用SiC/Cu包裹复合粉体,采用最新型的放电等离子体烧结方式制备了SiC/Cu金属陶瓷复合材料.分别采用XRD、SEM等方法对烧成样品进行表征.结果表明,放电等离子体烧结过程中,由于等离子体的作用,不同的烧成温度使得烧成样品中的物质及相应的含量发生变化.样品的密度随温度升高而增大,而硬度在730℃左右出现最大值,这是采用放电等离子体烧结制备SiC/Cu金属陶瓷复合材料的最佳烧成温度.由于SiC的增强作用,使得SiC/Cu金属陶瓷复合材料的硬度远远高于Cu.     

SiCp/Al复合材料的凝胶法混料工艺研究

采用凝胶法研究了SiCp/Al复合材料制备中原料混合工艺的影响因素。实验结果表明,经湿法腐蚀超声处理可得到粒径集中分布的SiC颗粒;经表面涂覆后的SiC颗粒能降低颗粒的团聚程度;通过向凝胶体系添加分散剂,并以去离子水为分散介质,聚乙烯吡咯烷酮(PVP)能够使SiC颗粒完全均匀分布于复合粉体中。     

-βSiC纳米颗粒对Ni-Co共电沉积合金结构和性能的影响

采用复合电沉积方法在Ni基体上制备了(Ni-Co)-SiC纳米复合镀层,该镀层的组织结构与电沉积Ni-Co合金(晶粒尺寸:110 nm)镀层不同,由Ni-Co固溶体基体(晶粒尺寸:50 nm)和均匀分布其中的SiC纳米颗粒(晶粒尺寸:45 nm)组成。SiC纳米颗粒的加入大大细化了镀层的组织,增加了镀层的显微硬度.电化学实验表明:SiC纳米颗粒使金属还原电位发生正移,降低了Ni-Co合金镀液的极化作用.     

碳化硅颗粒增强铝基复合材料的制备及半固态挤压成形技术的研究

研究了半固态挤压对SiC颗粒增强铝基复合材料组织和性能的影响。结果表明，复合材料能在较低压力下一步成形，SiC颗粒在挤压后仍分布均匀，且可消除坯料内部的孔隙，改善颗粒与基体结合状况。     

机械合金化中Fe-Cu粉体微观结构变化研究

通过对不同配比的Fe粉和Cu粉进行合金化处理,研究球磨过程中粉体的微观结构。实验结果证明:球磨后粉体的晶粒尺寸先增大后减小,最后趋于稳定。XRD分析表明经过球磨后,粉体的衍射峰发生了宽化并形成了固溶体。固溶体的形成改善了金属结合剂金刚石工具的使用性能。     

超显微硬度法研究SiCp／6066铝基复合材料微区硬度变化

对喷射共沉积后经挤压的SiCp/6066铝基复合材料,通过采用超微硬度法测量其微区的硬度变化,观察其显微组织。结果表明：在SiC颗粒分布密集处,基体超显微硬度值HV为143．2,而在SiC颗粒分布稀疏处,硬度值HV为107．2,二者之间有明显差距。这是由于分布密集的增强体SiCp周围局部基体应力场应力集中更剧烈而使超显微硬度值提高,此外还测量了由于热收缩应力引起SiCp周围应力场的变化而导致的微区硬度的变化。在SiC颗粒附近基体硬度值较高,HV达105．8而离SiC子距离大于其颗粒半径的基体中,硬度较低,HV约变81．7,SiCp造成基体中应力场的叠加可使基体中出现张应力区。此外,通过测量复合材料超显微硬度值的变化,分析了残余应力对喷射共沉积复合材料微区一些力学性能的影响。     

粉末冶金法制备Al2O3陶瓷颗粒增强铜基复合材料的研究

研究了Al2O3陶瓷颗粒弥散强化铜基复合材料的制备工艺.采用化学镀法制备Cu/Al2O3复合粉体,采用干压成型的方法将Cu/Al2O3复合粉体压制成型,在N2保护条件下进行烧结,制备出了Al2O3陶瓷颗粒弥散强化铜基复合材料,并采用OM,SEM,EDS等分析测试技术对复合材料的组织进行了观察分析,结果表明,用该方法制备的铜基复合材料中Al2O3颗粒分布均匀,Al2O3与铜基体结合良好.     

SiCp/Cu复合材料热膨胀性能研究

以电子封装基片为应用背景,采用挤压铸造方法制备了体积分数为55％,不同颗粒粒径增强的SiCp／Cu复合材料,并分析测试了颗粒粒径和热处理状态对材料热膨胀性能的影响规律．显微组织观察表明,复合材料颗粒分布均匀,材料组织致密;热膨胀性能测试表明,随着温度升高,复合材料的热膨胀系数呈非线性增加;SiC体积分数相同时,减小SiC颗粒尺寸有利于降低复合材料的热膨胀系数;退火处理可以减小基体中的热残余应力,有助于降低复合材料的热膨胀系数．     

Mechanical Characterization of Close Cell Aluminum Foams Reinforced by High Voltages Electro-deposition

The parameters for the electro-deposition of Cu were optimized in order to increase the compressive properties of close cell aluminum. Different values of deposition voltages and times were considered to vary the amount of deposited Cu. The surface morphology of the coating was observed by SEM and the compressive properties were evaluated by MTS. The results show that the coating is more homogeneous and compact with increasing voltage in a certain range, and beyond which, the coating quality decreases apparently. The reason is dedicated to the discharge rate of Cu~(2+) and nucleus formed in unit time. The compression results show three experienced stages: elastic deformation stage, collapse deformation stage and densification stage. After the electro-deposition of Cu, the elasticity modulus is increased obviously and the platform stress is also increased. Under the same strain, the stress of the aluminum foam with coating is reinforced comparing with the aluminum foam without coating. Furthermore, the platform area is widened apparently. In addition, Cu-SiC nanocomposite coatings are electrodeposited in alumium foams for further improving the mechanical characterization.     

Effects of Surfactants SDS and CTAB on Ni-SiC Deposition

The influences of surfactant type and concentration on the content and uniformity of SiC particles in Ni-SiC deposit were studied in this paper. The electrochemical behavior of preparing Ni-SiC composite coating was investigated using the cyclic voltammetry method. Then the impact of surfactants on the deposition potential of Ni-SiC coating was analyzed. Electrochemical studies showed that the cathode overvoltage increases gradually with increasing SDS (Sodium dodecyl sulfate) concentration. The CV curve showed the shift towards a lower current at a given potential with increasing SDS concentration. Ni-SiC composite coatings were prepared by electrodeposition. The experimental results show that the dispersion of 40nm SiC in Ni-SiC coating obtained in the electrolyte containing SDS is superior that containing CTAB (cetyltrimethyl ammonium bromide). CTAB increases the content of 40 nm SiC particles in the Ni-SiC coating, but the uniformity of 40 nm SiC particles in Ni-SiC composite coating is poor. SiC particles are still agglomerated. Compared with the anionic surfactant SDS and the cationic surfactant CTAB, surfactant SDS makes the particles better dispersed. But the contribution of surfactant SDS for co-deposition amount of SiC particles is negligible. The cationic surfactant CTAB can effectively improve the suspension performance of SiC particles and promote the co-deposition of SiC particles and metallic nickel. But there is still some reunion of SiC.     

Cu/SiC_P材料的复合电铸制备工艺

研究了采用复合电铸工艺制备碳化硅颗粒(SiCP)增强铜基复合材料中添加剂、颗粒粒径、电流密度、施镀温度、搅拌强度等工艺参数对Cu/SiCP复合材料中SiCP含量的影响.结果表明,优化各工艺参数可有效促进SiCP与铜离子的共沉积,提高复合材料中增强固体颗粒的含量.在此基础上研究开发了一种可有效促进助SiC颗粒与铜共沉积的混合添加剂,可获得SiCP含量较高的Cu/SiCP复合材料.     

Tribological properties of SiC/Cu composite at high temperature

SiC/Cu composites were prepared by hot pressing. The high temperature tribological properties of the composites were investigated. XRD, SEM techniques were carried out to characterize the samples. It is found that the friction coefficient of SiC/Cu composites increases with the increasing SiC content. The SiC reinforcement particles are worn down other than removed by pulling out during the wear test. Oxidation of Cu debris leads to the smooth contacting surface. Ring crack is formed under the cyclic wear test. The crack propagates through the damaged matrix and along the brittle interface between SiC particles and Cu matrix.     

钎焊温度对SiC/YG8接头微观组织的影响

在保温时间为5min、钎焊温度为940~990℃条件下,采用CuMnNi钎料钎焊SiC陶瓷与YG8硬质合金.利用金相显微镜、扫描电镜和能谱仪对接头的微观组织进行分析,研究钎焊温度对接头微观组织的影响.结果表明:在靠近SiC一侧生成一层带状反应层,主要由Cu基固溶体、硅化物、碳和碳化物组成;焊缝主要由基底Cu基固溶体以及Mn、Si、Co、Cu、Ni元素形成的化合物组成.随着钎焊温度的增加,焊缝的宽度减少,焊缝中心的Cu基固溶体基底减少,而化合物相增多.     

SiC／Cu粉团聚状态对SiC沉积率的影响

采用亚音速火焰喷涂技术制备了SiC／Cu金属基复合材料,研究了碳化硅与铜喷涂前团聚状态对碳化硅沉积率的影响．与未经团聚处理粉相比,SiC／Cu经团聚处理后沉积层中碳化硅沉积率高出1倍多．     

机械合金化法制备W-Cu合金粉末的研究

将W80Cu20（n（W）：n（Cu）=4：1）混合粉末在QM-BP式行星式高能球磨机中球磨进行机械合金化,研究了不同球磨时间对W-Cu混合粉末组织的影响.采用XRD和SEM对不同球磨时间的粉末进行分析,结果显示随着球磨时间的增加,混合粉末产生合金化效果不断增强,Cu固溶于W中,并且晶粒尺寸得到一定的细化.     

SiCp/Cu复合材料高温抗氧化性能研究

采用粉末冶金方法制备了SiCp/Cu复合材料,研究了复合材料在恒温氧化和循环氧化条件下的抗氧化性能。结果表明：在400—700℃时,SiCp/Cu复合材料具有比纯铜优良的抗氧化性能;在温度一定的条件下,SiC体积分数为20%时,复合材料的抗氧化性能最好;在循环氧化条件下,随着氧化时间延长,复合材料氧化增重率逐渐增大,而且呈现近抛物线变化规律;对相同SiC颗粒含量的SiCp/Cu复合材料,SiC颗粒越细,试样的抗氧化性能越好。     

纳米颗粒弥散强化铜基复合材料的显微组织与性能

采用粉末冶金的方法,以Al2O3,SiO2,SiC和MgO等纳米颗粒为增强相,制备出4种不同颗粒的纳米复合材料,研究了各增强相对复合材料显微组织与性能的影响.结果表明:在相同的质量分数(ω)和制备工艺下,不同弥散相颗粒的弥散强化铜合金显微组织不同,铜基体上大体均匀地分布着细小的弥散相颗粒,但部分区域仍存在偏聚现象.4种复合材料的电导率相近,抗拉强度方面Cu/Al2O3与Cu/SiO2的性能要略好于Cu/SiC与Cu/MgO.