PBGA器件焊点的可靠性分析研究

根据PBGA器件组装特点,分析了器件焊点的失效机理,并针对实际应用中失效的PBGA器件在温度循环前后,分别使用染色试验、切片分析、X-射线分析等方法进行失效分析.分析结果显示样品PBGA焊点存在不同程度的焊接问题,并且焊接质量的好坏直接影响器件焊点抵抗外界应变应力的能力.最后,开展了PBGA器件焊接工艺研究和可靠性试验,试验结果显示焊接工艺改进后焊点的可靠性良好.     

无铅焊接高温对元器件可靠性的影响

介绍无铅工艺焊接高温对元器件可靠性的影响,指出了无铅焊接高温对元器件耐温的挑战,介绍了IPC新标准的无铅器件耐温要求,分析了无铅焊接高温带来的元器件失效问题,如"爆米花"、分层、裂纹等,以及焊接高温对器件内部连接的影响,讨论了通过实施元件热管理来解决无铅焊接高温中的热损伤与热失效的方法,对在无铅焊接工艺过程提高元器件的可靠性应用具有一定的指导意义.     

无铅焊接工艺条件下元器件的高温可靠性

本文介绍无铅工艺焊接高温对元器件可靠性的影响,指出了无铅焊接高温对元器件耐温的挑战,介绍了IPC新标准的无铅器件耐温要求,分析了无铅焊接高温带来的元器件失效问题,如摫谆 、分层、裂纹等,以及焊接高温对器件内部连接的影响,讨论了通过实施元件热管理来解决无铅焊接高温中的热损伤与热失效的方法,对在无铅焊接工艺过程提高元器件的可靠性应用具有一定的指导意义。     

热压焊接工艺优化研究

热压焊接是连接柔性电路板和刚性电路板的一种焊接工艺,作为微电子表面组装技术领域的新兴制造工艺和重要组成部分,稳定和高效的热压焊接工艺无疑是保证产品良好品质的重要环节。通过统计分析热压焊接的主要失效模式,并从材料、工艺参数及设备进行实验比对和实验设计(DOE)找出各主要失效模式的影响因素及其之间的相互关系,确定最佳工艺参数。     

某陶封FP结构器件功能失效分析及解决措施

针对国产陶封FP结构器件再流焊接工艺助焊剂残留导致功能失效问题,进行原因分析、故障复现,确认了失效机理。根据失效机理提出了两种改进方案,进行了环境试验验证,试验结果证明方案有效,对于提高该类产品的可靠性具有一定的参考价值。     

陶瓷介质滤波器焊接工艺技术研究

针对陶瓷介质滤波器装配焊接过程中出现介质胚体开裂的问题,通过对裂纹特征观察和材料物理性质分析,在金属屏蔽罩装接、印制板焊盘设计和回流焊工艺等方面进行改进。对焊接后的器件进行温度和力学等可靠性试验,产品测试合格率为100%,破坏性物理分析(DPA)剖样观察到介质滤波器不存在开裂或微裂纹的失效隐患。结果表明,该焊接工艺能解决陶瓷介质滤波器的焊接裂纹问题,实现了较高的产品可靠性。     

快恢复二极管铜迁移失效机理及应用可靠性研究

变频空调控制器柜机主板在生产过程出现大量IPM炸裂失效,IPM炸失效同步自举二极管失效,位置不集中,对主板进行分析,确定是IPM自举电路升压二极管异常导致IPM炸裂失效,经过对大量失效二极管及全检异常二极管分析,分析研究结果表明:二极管因为晶圆设计工艺结构缺陷、焊接工艺问题,导致晶圆焊接时产生高温铜迁移,抗机械应力水平下降,在实际应用中又因为器件引脚跨距设计不合理导致器件受机械应力影响加深失效程度,最终出现过电击穿失效,经大量的方案分析验证最终确定可行的方案,有效解决二极管铜迁移失效.从器件本身提高器件的应用可靠性.     

14D电路厚膜基板再流焊技术研究

本文主要从焊接原理入手,对失效样品进行了分析,并提出了新的基板焊接工艺及流程,最后对此工艺按ＧＪＢ２４３８附录Ｅ的要求进行了工艺鉴定．     

红外探测器用蓝宝石滤光片焊接工艺研究

针对某型号探测器组件上用的Al2O3蓝宝石滤光片与可伐冷头钎焊的成品率低、后期失效问题突出等问题展开研究,找到了影响滤光片焊接成品率的几个关键因素,并针对这些因素提出解决方案,并通过一系列环境试验验证其可靠性,大幅提升了宝石窗口密封焊接工艺成品率。     

国外工艺文献导读

20060301在细间隙线焊中提高工艺可靠性—YairAlcobi.Circuits Assembly,2006,17(3):46~49(英文)在线焊过程中,工艺可靠性对器件组装成本起着很重要的作用。由于焊接失效、焊接机组件问题、封装类型和工艺窗的窄小,线焊设备经常发生生产中断,导致成品率降低,影响产品质量。经过     

单片机的ESD EMP效应及加固技术研究

ESD EMP(静电放电产生的电磁脉冲)具有上升沿陡、频带宽和峰值大等特点,对电子系统具有很强的干扰和破坏作用。为研究ESD EMP对电子系统的影响,以单片机为实验对象,对单片机系统进行了ESD EMP辐照效应实验。实验表明,单片机系统在ESD EMP作用下,会出现10多种故障现象。文中在实验基础上研究了单片机加固技术。     

人工智能在客服系统的应用及关键技术

客服体系架构中,人工坐席、工单处理等环节需要大量的人工操作,成本较高,效率相对较低,而且会有一定比例的问题及故障无法找到责任方甚至无法解决。在客服体系中,引入人工智能技术后,在一定程度上可以解决这些问题,降低成本并提高客服的整体效率和效果。分析了人工智能应用于客服体系的关键技术,包括语音识别、语音合成、自然语言处理等。就新技术在运营商客服体系中的应用进行了探讨,并通过简单实例阐述了在实际应用时的效果。     

On Predicting Failures in a Future Time Period From Known Observations

The problem of a prediction interval for the number of failures of a system during a future time period knowing the failures observed during a time interval in the past is considered. It is assumed that the failures follow a Poisson process. Now, if the failures in both time intervals were known, they could be used to test the hypothesis that the two observations were generated by the same Poisson law. By appropriately inverting the inequalities for the critical region of the above test, it is possible to generate the prediction limits for the number of failures in one time interval by observing the failures in the other time interval, provided both observations are subject to the same Poisson law.     

邮电通信建筑工程若干质量事故的分析

近来，我国安全事故不断发生，中央领导极为重视，在安全事故中，地质滑坡，房屋倒塌是一个主要部分，建筑工程发生质量事故，有属于管理及设计，施工等方面的原因，对于设计方面的原因，除了设计及计算错误外，有些是技术上值得深入研究的问题，为吸取经验，防止质量事故发生，本拟结合国内重大工程事故以及若干邮电通信建筑工程质量事故进行分析，以提高设计质量，促进技术水平的发展。     

Correlation of electromigration lifetime distribution to failure mode in dual Damascene Cu/SiLK interconnects

The electromigration cumulative percent lifetime probability of dual Damascene Cu/SiLK interconnects was fitted using three, individual lognormal functions where the functional populations were grouped by void growth location determined from focused ion beam failure analysis of all 54 of the stressed structures. The early, first mode failures were characterized by small voids in the bottom of the vias. The intermediate mode failures had voids in the line and via bottom while the late mode failures had voids that formed in the line only. The three, individual lognormal functions provided good fits of the data. Failure mode population separation using comprehensive failure analysis suggested that only the first mode failures should be used in the prediction of the chip design current.     

Reliability Modeling of Hardware and Software Interactions, and Its Applications

We classify system failures into three categories: hardware failures, software failures, and hardware-software interaction failures. We develop a unified reliability model that accounts for failures in all three categories. Hardware, and software failures are accounted for with well-known modeling approaches. In this paper, we propose a modeling methodology using Markov processes to capture hardware-software interaction failures. We illustrate the combined hardware & software modeling approach by applying it to a real telecommunication system     

Z900MCM综述

介绍了Z900 MCM设计和布局,可控塌陷芯片连接(C4)工艺在Z900 MCM组装中的应用。从设计上通过加入垂直电感器及去耦电容器减小其噪声。通过基板测试和功能测试,剔除有缺陷的基板和芯片。Z900 MCM采用先进的MCM—D技术和MCM返工及冷却技术。Z900 MCM平均无故障时间高达40年。     

Using charged device model testing to eliminate real-world ESD failures

Of 30 bipolar, BiCMOS, and CMOS monolithic, integrated circuit products that were ESD classified to the socketed Charged Device Model (CDM), 27 had ≥500 V withstand voltages and experienced no real-world CDM failures. Two of the three focus products with < 500 V withstand voltages initially had numerous manufacturing-induced CDM failures. Analysis of these two products showed that both socketed and non-socketed CDM testing induced damage at the same failure sites as identified on real-world CDM failures. However, only non-socketed CDM testing consistently reproduced the subtle damage observed on the real-world failures. On one of the focus products, the more severe damage induced by socketed CDM testing resulted in an open circuit rather than the resistive short that occurred on both the non-socketed and real-world CDM failures.Once the physics of CDM failure on the three focus products were fully understood, the ESD redesigns were relatively straightforward. On all three products, diffused series resistors and/or clamping devices with fast response times were added to the pins with inadequate CDM robustness. For each product, these redesigns boosted the socketed CDM withstand voltages for the previously susceptible pins to ≥1500 V and eliminated real-world CDM failures.Based on this work, a combined socketed and non-socketed CDM test approach is proposed for classifying/evaluating products and driving CDM robustness improvements. Guidelines for CDM testing and CDM improvement programs are also provided.     

梳齿式MEMS加速度计在冲击下的失效分析

对Si基梳齿式MEMS加速度计在冲击下进行了失效分析,验证了其主要失效模式,分析了其失效机理。通过机械冲击实验并采用扫描电镜(SEM)、X射线透视系统、扫描声学显微镜(SAM)观察及电性能测试等分析技术,研究了梳齿式MEMS加速度计在冲击载荷下的结构与封装失效,运用材料力学理论加以分析论证,发现悬臂梁断裂是较为主要的失效模式,且此类器件的封装失效主要表现为气密性失效和装配工艺失效,为MEMS器件的可靠性设计提供了重要依据。