卫生陶瓷激光补釉用填料的研究展望

本文阐述了卫生陶瓷激光补釉用填料的研究情况;分析了激光局部成釉技术对填料的要求;讨论了为了适应激光局部成釉技术及修复的要求,修复卫生陶瓷表面缺陷所使用的填缝料及釉料的特点、性能要求、加工工艺及研究趋势。     

卫生瓷激光补釉用低温无铅无镉釉料的研究

研究了用激光局部成釉修复卫生瓷表面缺陷及使用的低温无铅镉熔块釉组成、制备工艺和性质。     

合成工艺对Cr-Ca-Sn-(Si)系列紫红色料呈色的影响

研究了铬锡红色料呈色的主要工艺影响因素,如添加剂种类、色料合成反应历程及工艺、基础釉成分等,并成功合成了系列色调变化的紫红色料.实验中采用X-ray衍射仪、色度仪等对所制色料进行测试与分析,探讨了其形成机理及对釉的适应性规律.     

卫生陶瓷激光补釉用低温无Pb,Cd填缝料的研究

根据卫生陶瓷激光补釉的要求，首先研究了低温无Ｐｂ，Ｃｄ填缝料的化学组成及制备工艺，并利用各种测试对填缝料的性能进行测试，确定了适合卫生陶瓷激光补釉用无Ｐｂ，Ｃｄ低温填缝料的组成。     

玻璃粉在日用瓷中的应用研究

1 引言 传统星点釉产品生产有两种方式:一种是使用喷枪,将特制釉浆手工在釉坯上喷点而成,该工艺生产率低,星点效果不均匀;另一种是制作专用颗粒,再将颗粒添加到釉浆中,直接施釉而成,该工艺生产效率较高,星点效果均匀,美观自然,适合大规模生产.     

日用艺术陶瓷装饰用新型大红釉的研制

研制一种适用于日用瓷及艺术瓷装饰用新型大红色釉，用包裹型镉硒红色料为着色剂，基釉为石灰－碱透明生料釉，氧化焰下一次焰成，烧成温度在1250－1300℃范围。主要探讨了基釉组成，工艺条件，烧成制度等因素对色釉呈色的影响，优化获得了使色料呈色稳定，发色鲜艳，热膨胀数小，显微硬度大的基础釉组成和合适的制备工艺。     

铅-锌-锰系中温析晶虹彩釉的研制

对铅-锌-锰系中温析晶虹彩釉的形成机理、形成条件以及制作工艺进行了研究。寻找到最佳的釉料配方组成及工艺制度。釉料配方、釉料细度、釉层厚度、烧成制度等是决定虹彩效果的重要因素。通过偏光显微镜和反光显微镜观察试样釉层的显微结构，发现虹彩釉在成釉过程中釉层表面析出了针状的黑锰矿晶体。     

河南平顶山应国墓地出土料珠和料管的分析

为了探明我国早期(西周至春秋时期)料珠和料管的材质和制作方法,利用外束质子激发x射线荧光、X射线衍射、激光Raman光谱及扫描电子显微镜等测量技术,对河南省平顶山应国墓地出土的西周早期至春秋早期的料珠和料管进行了系统地分析研究.结果表明:西周早期的料珠是发生了晶态转变为非晶态、非晶态包裹晶态现象的硅酸镁质玉石,而西周中期至春秋早期料珠和料管系人工用较纯的石英砂添加少量青铜冶炼后的炉渣或矿渣,在低温(700～800℃)烧制而成的釉砂(石英砂,faience),是古玻璃的前身.此前一般笼统地认为中国釉砂起源于西周至春秋时期,截至目前中国釉砂最早可追溯到西周中期.     

生料铁金星釉的研究

金星釉是一种名贵釉料,其特征为在透明玻璃质釉中悬浮着金色板状晶体或金属状粉粒,在光线照射下闪烁异彩.传统金星釉的制备过程中的毒性及使用过程中的铅溶出量较高,且必须使用熔块,制备工艺复杂,在高温下结晶难以控制,因而金星釉显得非常名贵.本文以Fe2O3、硼砂、石英、长石等为主要原料,采用普通釉料制备工艺,研究了低温环保无铅无毒的生料铁金星釉的组成及工艺.通过研究釉料的组成、施釉厚度、烧成温度与保温时问对结晶效果的影响,得出了结晶效果优异的铁金星釉的配方和合理的制备工艺参数.     

釉里红多彩结晶釉的研制

在硅酸锌结晶釉的基础上加入色料,对基础结晶釉的组成、颜料的组成和添加量、制备工艺条件等进行了系统的试验研究.通过采用适宜的生产工艺,成功研制出烧成温度为1310℃的新型结晶釉--釉里红多彩结晶釉,并探讨了各组成及工艺制度对结晶尺寸的影响,确定了最佳的工艺条件,分析了影响结晶效果的诸因素.     

聚醚醚酮的激光加工研究进展

综述了激光增材制造、激光扫描透射焊接、激光刻蚀等激光加工技术在聚醚醚酮及其复合材料加工制备领域中的应用及研究进展，并将该技术与传统加工方法进行比较，进一步说明激光加工技术的原理、优点以及现存的一些亟待解决的问题，最后展望了该技术广阔的发展前景。     

A review on laser drilling and cutting of silicon

Silicon is the most widely used material in numerous fields. Traditional mechanical machining methods have been unable to meet the higher requirements of processing quality. Laser machining is especially suitable for processing hard and brittle materials due to the non-contact processing characteristics. This article summarizes the nanosecond, picosecond, femtosecond laser drilling and cutting technologies of silicon according to the classification of laser pulse widths. For the most typical field assisted machining technology, liquid-assisted laser drilling and cutting are also discussed. In consideration of the heat generated during laser processing is likely to cause stress in the material, resulting in micro-cracks and other processing defects. Laser induced thermal crack propagation cutting technology (LITP) successfully uses the cracks produced in laser machining to achieve the high cutting quality of silicon. As a new way of material internal processing, laser stealth dicing is the most promising method in the field of wafer cutting. The mechanism and processing characteristics of laser stealth dicing are described. At the end of paper, a summary and outlook are provided.     

Mechanisms of carbon dioxide laser stereolithography in epoxy-based materials

We present in this article the use of infrared laser radiation to achieve localized curing in thermosensitive epoxy resin compounds. In stereolithography, the objective is to cure a localized region in a material by precisely confining the laser energy to the area that is to be cured. Industry already uses ultraviolet laser radiation at 352 nm to fabricate three-dimensional structures. Via infrared laser curing, we demonstrate the viability of a completely thermal localized curing process. In our experiment, we have focused the beam from a carbon dioxide (CO₂) laser onto a sample composed of epoxy resin, diethylene triamine, and silica powder. Such resins typically cure, or solidify, when heated to moderately high temperatures, and our results show that we can confine the heating of the material, and, therefore, its curing in all three dimensions. We present a physical and a chemical model to describe the process and measure the curing rate as a function of temperature. In order to model the flow of heat in our sample as a result of infrared laser irradiation, we solved the time-dependent heat equation in cylindrical coordinates using the Crank-Nicholson finite-difference method. The results allow us to predict the curing behavior of the sample as a function of laser irradiation conditions, and we find good agreement with our preliminary experimental observations. © 1996 John Wiley & Sons, Inc.     

塑料加工最新技术——激光加工

简要介绍了塑料加工技术——激光加工技术的起源、发展过程及应用领域。详细介绍了塑料的激光焊接技术、激光打孔技术、激光标志技术和激光切割技术的应用技术、方法特点和发展趋势。     

Femtosecond laser micro-milling dental glass ceramics: An experimental analysis and COMSOL finite element simulation

Dental glass ceramic materials are widely used in all-ceramic restoration technology. In order to effectively solve the problems existing in the process of traditional diamond cutter milling dental glass ceramic materials, such as severe needle loss, large tool wear and general milling efficiency, a new method of ultrafast laser milling dental glass ceramics is proposed. In this paper, 1030 nm femtosecond laser with pulse width of 600fs was used to micro-mill dental glass ceramics. Confocal laser microscopy was used to measure the milling depth and surface roughness of single-layer milling under selected laser processing parameters. The pre-layered milling software was developed to control the z-axis lifting and to compensate the focal length synchronously. Scanning electron microscope (SEM), Raman spectrometer and Vickers micro-hardness tester were used to characterize the dental glass ceramics after femtosecond laser milling. The results showed that under the specific laser processing parameters, the infrared femtosecond laser milling system can achieve a good processing morphology without changing the surface composition and surface hardness of dental glass ceramics. This new dental glass ceramics processing method based on ultrafast laser technique indicated a new direction for further chair processing of dental all-ceramic restoration technology.     

Micromachining porous alumina ceramic for high quality trimming of turbine blade cores via double femtosecond laser scanning

Turbine blade cores are made of porous alumina ceramic and determine the molding accuracy of the cavity of turbine blades, which strongly affect thermal diffusion performance and service life of turbine engines. To get a high quality ceramic core, accurate trimming for a preliminarily processed core is needed and therefore, micromachining porous alumina ceramic, which differs from general alumina substrates, is crucial. This paper dealt with a processing technology for the special material via double femtosecond laser scanning. The materials ablation threshold was firstly determined through parameter fitting and then this material was machined at a combination of different laser processing parameters. Considering the produced debris blocks the lasers further propagation into the material, double femtosecond laser scanning was newly proposed and experimentally verified with the comparison of gas jet assist and underwater laser processing ways. The removal profiles of the machined material were characterized in terms of cutting width, cutting depth, deviation of linearity and surface morphology, which exhibited high dependence on the femtosecond laser processing parameters. The optimal laser operating window was identified and high quality laser cutting of the porous alumina ceramic was demonstrated. The developed processing technology has potential application in trimming for ceramic casting cores. In addition, it might also give a novel view for high quality laser micromachining another materials.     

Laser drilling of structural ceramics—A review

Structural ceramics are becoming widely popular in numerous fields because of high mechanical and physical properties. It is of great difficulty for conventional techniques to machine brittle and hard materials. As one of nontraditional machining methods, laser beam machining has emerged as an effective technique for drilling of ceramics. This paper reviews the research work on laser drilling of structural ceramics from its different pulse width. Lasers have been discussed to understand effects of critical experimental parameters on the quality characteristics and physical mechanisms involved in drilling ceramics. In addition, it is held that heat and liquid-assisted laser processing serves as a useful method to improve processing quality. Computational approaches of ANSYS and COMSOL are used to predict laser input parameters’ effects on quality of hole and describe the physical phenomena during processing. Comments on laser drilling of ceramics developments and future directions are provided at the end.     

Laser-Induced, Polarization Dependent Shape Transformation of Au/Ag Nanoparticles in Glass

Bimetallic, initially spherical Ag/Au nanoparticles in glass prepared by ion implantation have been irradiated with intense femtosecond laser pulses at intensities still below the damage threshold of the material surface. This high-intensity laser processing produces dichroism in the irradiated region, which can be assigned to the observed anisotropic nanoparticle shapes with preferential orientation of the longer particle axis along the direction of laser polarization. In addition, the particle sizes have considerably been increased upon processing.     

Ultrafast laser micromachining the ultra-low expansion glass-ceramic: Optimization of processing parameters and physical mechanism

To fulfill the precise requirements of laser gyroscope for inertial navigation, using the mean surface roughness, taper angle and circularity degree as indicators, we optimize the processing parameters about ultrafast laser micromachining a commercial ultra-low expansion glass-ceramic (ULGC). Furthermore, through careful characterizations, we identify the sequential appearance of photo-darkening, crystalizing, melting, foaming and vaporizing regions during the interactions of ultrafast laser with ULGC. Especially, the foaming region is identified to effectively mediate the thermal stress at the interfaces between different regions. Originated from the Gaussian distribution of energy, poor processing quality by a Gaussian beam is mainly ascribed to the formation of various regions. By using a Bessel beam, higher surface quality could be obtained due to the possibility of the occurrence of only a foaming region in irradiated regions. This discovery gives us an important clue to optimize processing parameters to obtain high-quality ultrafast laser micromachining surface.     

Fabrication of 4H-SiC piezoresistive pressure sensor for high temperature using an integrated femtosecond laser-assisted plasma etching method

The processing, particularly, etching of brittle, hard, and anti-corrosion materials represented by the third-generation wide bandgap semiconductor silicon carbide (SiC), is a significant challenge. Although SiC has excellent electrical, mechanical, and chemical properties, the difficulty of processing limits its application in various sensor devices. To solve this problem, in this study, an integrated processing method of femtosecond laser-assisted SiC dry etching is proposed, which realizes high surface quality and high rate etching of the SiC microstructure. Specifically, the effects of different laser processing parameters on the processing effect were first studied through orthogonal experiments. Experiments indicate that compared with laser power and laser scan times, laser processing speed has a more obvious impact on the processing effect. Subsequently, considering the elastic modulus anisotropy of SiC, a 5 MPa piezoresistive pressure sensor chip was designed. Using the proposed composite processing method, a chip sensitive diaphragm was obtained. The diaphragm thickness and diameter are 76 μm and 1700 μm respectively. The overall sensor chip dimension was 4000 μm × 4000 μm × 350 μm. Static tests demonstrated that the sensor have excellent performance with sensitivity of 6.8 mV/MPa, linearity of 0.69% FS, and repeatability of 0.078% FS. In addition, by designing high-temperature packaging, the sensor achieved a pressure test at 400 °C. This study verifies the feasibility of the composite processing method, realizes the fabrication and measurement of high-temperature pressure sensors, and provides a reference for the micro-and nanostructure processing of various SiC sensors.