Hyperbolic Heat Conduction in a Cracked Thermoelastic Half-Plane Bonded to a Coating

In this paper, the transient temperature field around a thermally insulated crack in a substrate bonded to a coating is obtained using the hyperbolic heat conduction model. Fourier and Laplace transforms are applied, and the thermal conduction problem is reduced to solving a singular integral equation. Numerical results show that the hyperbolic heat conduction parameters, the heat conductivity of the substrate and coating, and the geometric size of the composite have significant influence on the transient temperature field. In the case of very small time scales, the results predicted by the hyperbolic model are more conservative than that by the parabolic model.     

基于非傅里叶热传导对热冲击下带裂纹厚壁圆筒的分析

随着科学技术、工业水平的发展,传统的傅里叶导热在极端条件下不再适用。基于双曲型单相延迟非傅里叶热传导方程,推导了热冲击下有限元方程,编写了有限元算法程序,研究了在热冲击载荷下含裂纹厚壁圆筒结构的热力学响应,计算出厚壁圆筒在非经典传热条件下的温度场、位移场和裂纹尖端应力强度因子的数值解,分析不同热冲击载荷、不同裂纹长度、不同相位延迟下非傅里叶热传导的波动性效应以及温度应力强度因子的变化,得到相应的结论。为非经典工程条件下,带裂纹厚壁圆筒构件的可靠性以及构件的优化设计提供了数值上的参考。     

含半椭圆表面裂纹圆柱壳体的三维热弹性动态断裂

研究了含轴向半椭圆表面裂纹的圆柱壳体在热应力与冲击载荷作用下的动态断裂情况,并应用所研制的三维动态断裂有限元程序进行了大规模的数值计算,确定了圆柱壳体的三维温度分布及热-力耦合下的动态应力强度因子,所得结果在一定程度上揭示了热-力作用下圆柱壳体的边界表面、裂纹面、物质惯性和弹性波的相互作用在结构动态断裂中的重要性。     

Transient Behavior of a Thermoelectric Device Under the Hyperbolic Heat Conduction Model

The major objective of this work is to describe the dynamic thermal behavior of thermoelectric generators and refrigerators under the effect of the hyperbolic heat conduction model. In practical situations, these devices work under transient operating conditions due to the time change in the imposed current, voltage, and hot or cold temperatures. Results for transient temperature distributions were obtained for different parameters. The coefficient of performance was obtained as a function of time for increasing current flow.     

Dynamic crack extension along the interface of materials that differ in their thermal properties: with and without thermal relaxation

Summary Moving surface stresses cause crack extension along the interface of perfectly bonded thermoelastic materials at a constant sub-critical speed. The materials differ only in their thermal properties, and are governed by coupled thermoelastic equations that admit as special cases Fourier heat conduction as well as thermal relaxation with one or two relaxation times. A dynamic steady state of plane strain is assumed. The exact transform solution for a propagating displacement and temperature discontinuity is used to find solutions to the interface crack valid away from the crack edge for low extension speeds and solutions valid at the crack edge for high speeds. Results show that Fourier heat conduction dominates the former case, but solution behavior in the latter is dependent upon the particular thermal model. Thermal mismatch is seen to by itself cause a solution behavior similar to that for bonded dissimilar isothermal elastic solids. In particular, the two-relaxation time solution exhibits both oscillatory and non-oscillatory terms, and the interface temperature at the crack edge is finite.     

The influence of thermal relaxation and thermal damping on transient processes with cyclic boundary conditions

Variants of the differential equation of heat conduction in a solid body, which follow from the Fourier and Cattaneo–Vernotte hypotheses and the Lykov equation, are considered. A boundary value problem describing temperature fields in a body (cylinder) upon cyclic heat transfer with cold and hot media is formulated. An analytical solution to the boundary value problem with a hyperbolic differential equation of heat conduction with allowance for thermal relaxation and temperature damping with cyclic boundary conditions of the third kind is given. The thermal transient processes calculated by the classical heat conductance equation and hyperbolic equation of heat conduction on the axis of the cylinder at different values of factors such as the ratio of the thermal damping time to the thermal relaxation time, the duration of cyclic periods, the Fourier relaxation number, and the Biot number are compared. A conclusion is made that the theory of regenerative air heater should be improved by taking into account thermal relaxation and thermal damping in the nozzle and measurements of the thermal relaxation and thermal damping times of the corresponding materials.     

A thermal-medium crack model

In analyzing the fracture behavior of a cracked thermoelastic material, of much importance are the effects of thermal loadings on the crack growth. Under the consideration of a medium in an opening crack, a thermal-medium crack model is proposed in this paper. The heat flux at the crack surfaces is assumed to depend on the jumps of the temperature and the elastic displacement across the crack. The thermally permeable and impermeable crack models are the limiting cases of a thermal-medium one. The proposed crack model is applied to solve the problem of a Griffith crack in a transversely isotropic material under thermal and mechanical loadings. Using two introduced displacement functions and the Fourier transform technique, the thermoelastic field and the elastic T-stress are determined in explicit forms by using elementary functions. Numerical results are presented to show the effects of the thermal conductivity inside a crack and applied mechanical loadings on the heat flux at the crack faces, the jumps of temperature across the crack and mode-II stress intensity factor in graphics respectively. The obtained results reveal that the mode-II stress intensity factor for a thermal-medium crack in a thermoelastic material depends not only on applied thermal loadings but also on applied mechanical ones.     

The central crack problem for a functionally graded piezoelectric strip

In this paper the dynamic anti-plane problem for a functionally graded piezoelectric strip containing a central crack vertical to the boundary is considered. The crack is assumed to be electrically impermeable or permeable. Integral transforms and dislocation density functions are employed to reduce the problem to Cauchy singular integral equations. Numerical results show the effects of loading combination parameter, material gradient parameter and crack configuration on the dynamic response. With the permeable assumption, the electric impact has no contribution to the crack tip field singularity. With the impermeable assumption, the direction of applied electric impact loading plays a great role in the behavior of dynamic stress intensity factor, and the existence of electric load always enhances the crack propagation. However, the crack is easier to propagate under the negative electric load than that under the positive electric load.     

均匀热流下导热裂纹Ⅱ型温度应力强度因子的解析解

研究含中心裂纹无限大板受远场均匀热流作用,热流密度方向与裂纹有一夹角的情况。当垂直于裂纹面方向有定量热流穿过裂纹时,采用复变函数理论,得出了温度、应力与位移场解析解。利用位移单值条件,确定出温度应力强度因子的解析表达式。针对铝合金LY12材料进行了数值计算,研究了裂纹导热情况与热流方向对温度场及温度应力强度因子的影响。研究表明:该文给定的温度边界条件下,只产生Ⅱ型温度应力强度因子,不产生Ⅰ型温度应力强度因子。热荷载可等效为一个远场均匀作用的剪应力。Ⅱ型温度应力场取决于热流密度沿垂直裂纹面方向的分量,平行于裂纹方向的热流分量对温度应力场没有影响。     

An elastic strip with periodic surface cracks under thermal shock

The problem of two periodic edge cracks in an elastic infinite strip located symmetrically along the free boundaries under thermal shock is investigated. It is assumed that the infinite strip is initially at constant temperature. Suddenly the surfaces containing the edge cracks are quenched by a ramp function temperature change. Very high tensile transient thermal stresses arise near the cooled surface resulting in severe damage. The degree of the severity for a subcritical crack growth mode is measured by determining the stresses intensity factors. The thermoelastic problem is treated as uncoupled quasi-static. The superposition technique is used to solve the problem. The thermal stresses obtained from the uncracked strip with opposite sign are utilized as the only external loads to formulate the perturbation problem. By expressing the displacement components in terms of finite and infinite Fourier transforms, a hypersingular integral equation is derived with the crack surface displacement as the unknown function. Numerical results for stress intensity factors are carried out and presented as a function of time, cooling rate, crack length, and periodic crack spacing.     

TRANSIENT RESPONSE OF A CRACKED INFINITE PIEZOELECTRIC STRIP UNDER ANTI-PLANE IMPACT

By using the well-established integral transform methodology, the dynamic response of stress and electric displacement around a finite crack in an infinite piezoelectric strip are investigated under anti-plane impact. The dynamic intensity factors of stress and electric displacement are obtained analytically. The results show that the dynamic electric field will promote or retard the propagation of the crack at different stages of the loading process. On the other hand, the response of the electric field is coherent with the applied electric load and independent of the external mechanical load. The result obtained for the anti-plane impact of a cracked infinite piezoelectric ceramic can be regarded as a special case of the present work when the width of the strip tends to infinity.     

Method of Measuring Thermal Relaxation in the Solid State

The differential equations of heat conduction of a solid body, which are a consequence of the Fourier, Cattaneo–Vernotte, and Lykov’s equations, are considered. A mathematical model of the transient, three-period process in a circular plate is constructed in the form of a solution to the hyperbolic boundary value problem of heat conduction with boundary conditions of the third kind. The method to determine the Bio numbers in each period of the transition process and the time of thermal relaxation is described by the results of experimental and theoretical studies of transient thermal processes in the center of round plates of different thicknesses made of polymethylmethacrylate upon their sudden immersion in hot water.     

Dynamic behavior of a crack in a functionally graded piezoelectric strip bonded to two dissimilar half piezoelectric material planes

Summary. The dynamic behavior of a crack in a functionally graded piezoelectric material (FGPM) strip bonded to two half dissimilar piezoelectric material planes subjected to combined harmonic anti-plane shear wave and in-plane electrical loading was studied under the limited permeable and permeable electric boundary conditions. It was assumed that the elastic stiffness, piezoelectric constant and dielectric permittivity of the functionally graded piezoelectric layer vary continuously along the thickness of the strip. By using the Fourier transform, the problem can be solved with a set of dual integral equations in which the unknown variables are the jumps of the displacements and the electric potentials across the crack surfaces. In solving the dual integral equations, the jumps of the displacements and the electric potentials across the crack surfaces were expanded in a series of Jacobi polynomials. Numerical results illustrate the effects of the gradient parameter of FGPM, electric loading, wave number, thickness of FGPM strip and electric boundary conditions on the dynamic stress intensity factors (SIFs).     

Transient thermo-mechanical analysis of dynamic curving cracks in functionally graded materials

Mixed-mode dynamic crack growth behavior along an arbitrarily smoothly varying path in functionally graded materials (FGMs) under transient thermo-mechanical loading is studied. An asymptotic analysis in conjunction with displacement potentials is used to develop transient thermo-mechanical stress fields around the propagating crack-tip. Asymptotic temperature field equations are derived for exponentially varying thermal properties, and later, these equations are used to derive transient thermo-mechanical stress fields for a curving crack in FGMs. The effect of the transient parameters (loading rate, crack-tip acceleration, and temperature change) and temperature gradient on the maximum principal stress and circumferential stress associated with the propagating crack-tip is discussed. Finally, using the minimum strain energy density criterion, the effect of temperature gradient, crack-tip speeds, and T-stress on crack growth directions is determined and discussed.     

A solution method for finding dynamic stress intensity factors for arbitrarily oriented cracks in transversely isotropic materials

The transient elastodynamic response of a transversely isotropic material containing a semi-infinite crack under uniform impact loading on the faces is examined. The crack lies in a principle plane of the material, but the crack front does not coincide with a principle direction. Rather, the crack front is at an angle to a principle direction and thus the problem becomes more three-dimensional in nature. Three loading modes are considered, i.e., opening, in-plane shear and anti-plane shear. The solutions for the stress intensity factor history around the crack tip are found. Laplace and Fourier transforms together with the Wiener-Hopf technique are employed to solve the equations of motion directly. The asymptotic expression of stress near the crack tip leads to a closed-form solution for the dynamic stress intensity factor for each loading mode. It is found that the stress intensity factors are proportional to the square root of time as expected. Results given here converge to known solutions in transversely isotropic materials with a crack oriented along a principle direction and isotropic materials as special cases. The results of this analysis are used to find approximate strain energy release rates for dynamically loaded penny shaped cracks.     

Analytical Prediction of Quench Energies of Cooled Superconductors Based on the Hyperbolic Heat Conduction Model

The critical energy characteristics of cooled composite superconductors is analytically predicted based on the one-dimensional hyperbolic heat conduction model. The temperature dependence of the Ohmic heat generation, the finite speed of heat transfer, and the finite duration and finite length of the thermal disturbances are taken into account in the present model. The critical energies are calculated using a model based on the analytical solution of the hyperbolic heat conduction equation by the Laplace transformation method. The computational model results show that the critical energy depends on the relaxation time and disturbance duration. It is found that the hyperbolic conduction model predicts a lower-critical energy as compared to the predictions of the parabolic heat conduction model.     

Model of Fractional Heat Conduction in a Thermoelastic Thin Slim Strip under Thermal Shock and Temperature-Dependent Thermal Conductivity

The present paper paper, we estimate the theory of thermoelasticity a thin slim strip under the variable thermal conductivity in the fractional-order form is solved. Thermal stress theory considering the equation of heat conduction based on the time-fractional derivative of Caputo of order α is applied to obtain a solution. We assumed that the strip surface is to be free from traction and impacted by a thermal shock. The transform of Laplace (LT) and numerical inversion techniques of Laplace were considered for solving the governing basic equations. The inverse of the LT was applied in a numerical manner considering the Fourier expansion technique. The numerical results for the physical variables were calculated numerically and displayed via graphs. The parameter of fractional order effect and variation of thermal conductivity on the displacement, stress, and temperature were investigated and compared with the results of previous studies. The results indicated the strong effect of the external parameters, especially the time-fractional derivative parameter on a thermoelastic thin slim strip phenomenon.     

Crack propagation in a strip of material under plane extension

The problem of a uniformly propagating finite crack in a strip of elastic material is solved using the dynamic equations of elasticity in two-dimensions. Two specific conditions of loading on the strip with finite width are discussed. In the first case, the rigidly clamped edges are pulled apart in the opposite directions. The second case considers equal and opposite tractions applied to the crack surface. By varying the strip width to the crack length ratio, the amplitude of the dynamic stresses ahead of the running crack is determined as a function of the crack velocity. The local dynamic stresses are found to be lower than the corresponding static values for the displacement loading condition and higher for the stress loading condition. This effect becomes increasingly more important as the crack length to strip width ratio is enlarged. Numerical results for the dynamic crack opening displacement are also presented.     

薄板在周期热流作用下的热响应(Ⅰ):温度响应

基于具有热流延迟相的双曲型热传导方程,研究了薄板在周期热流作用下的温度响应。首先采用分离变量法,求解了以热流矢量为基本未知量的热传导方程,得到了板内热流场分布,然后再利用能量守恒方程,获得了板内温度响应的解析表达式。通过计算,分析了板内温度响应随不同热流矢量延迟相以及边界热流频率的变化趋势,并与经典的Fourier热传导方程所得到的结果进行了比较。结果表明,在高频热流加热下,双曲型热传导模型所给出的温度响应与经典的Fourier热传导模型具有显著的差别。     

Stress intensity factors for an interface crack between a functionally graded coating and a homogeneous substrate

In this paper we consider the problem of a functionally graded coating bonded to a homogeneous substrate with a partially insulated interface crack between the two materials subject to both thermal and mechanical loading. The problem is solved under the assumption of plane strain and generalized plane stress conditions. The heat conduction and the plane elasticity equations are converted analytically into singular integral equations which are solved numerically to yield the temperature and the displacement fields in the medium as well as the crack tip stress intensity factors. A crack-closure algorithm recently developed by the authors is applied to handle the problem of having negative mode I stress intensity factors. The Finite Element Method was additionally used to model the crack problem and to compute the crack-tip stress intensity factors. The main objective of the paper is to study the effect of the material nonhomogeneity parameters, partial insulation of the crack surfaces and crack-closure on the crack tip stress intensity factors for the purpose of gaining better understanding of the thermo-mechanical behavior of graded coatings.