Bias voltage dependence properties of Nb-doped indium tin oxide thin films by RF magnetron sputtering at room temperature

Niobium doped indium tin oxide (ITO:Nb) thin films were fabricated on glass substrates by RF magnetron sputtering from one piece of ceramic target material at room temperature. The bias voltage dependence of properties of the ITO:Nb films were investigated by adjusting the bias voltage. Structural, electrical and optical properties of the films were investigated using X-ray diffraction (XRD), atomic force microscopy (AFM), UV–visible spectroscopy, and electrical measurements. XRD patterns showed a change in the preferential orientations of polycrystalline crystalline structure from (222) to (400) crystal plane with the increase of negative bias voltage. AFM analysis revealed that the smooth film was obtained at a negative bias voltage of -120 V. The root mean square (RMS) roughness and the average roughness are 1.37 nm and 1.77 nm, respectively. The films with the lowest resistivity as low as 1.45×10⁻⁴ Ω cm and transmittance over 88% have been obtained at a negative bias voltage of −120 V. Band gap energy of the films, depends on substrate temperature, varied from 3.56 eV to 3.62 eV.     

Growth of ITO thin films on polyimide substrate by bias sputtering

Transparent conducting indium tin oxide thin films were deposited on polyimide substrates by RF bias sputtering of ITO target. The influences of bias voltage on the structural and electrical properties of the films were investigated. In order to correlate the material characteristics with the plasma parameters during sputtering, we employed Langmuir probe and optical emission spectral studies. The films deposited onto positively biased substrates were poorly crystalline. An improvement in crystallinity was observed with increase in negative bias. The films deposited at a bias voltage of ?20 V showed a preferred orientation in the [1 1 1] direction and has minimum resistivity compared to films grown at other biasing conditions. The measured plasma parameters were correlated to the film properties. The ITO films thus grown have been used as the channel layer for the fabrication of thin film transistor.     

High power impulse magnetron sputtered p-type γ-titanium monoxide films: Effects of substrate bias and post-annealing on microstructure characteristics and optoelectrical properties

In view of wide potential use as p-type oxide semiconductor of titanium monoxide (TiO), it is deposited in this work by using high power impulse magnetron sputtering (HIPIMS), which is known to provide less hysteresis effect in reactive sputtering and better control in stoichiometry. A strong correlation among the preparation parameters on the microstructure and optoelectrical characteristics of the obtained Ti-O films are investigated.Experimental results show that the crystallinic cubic γ-TiO can be directly grown on unheated glass substrate. In regard to the effects of substrate bias and post-annealing, the as-grown γ-TiO transfers into rutile (R-TiO₂) at a critical substrate bias voltage of −125 V or post-annealing temperature of 500 °C. For the purpose of p-type channel layer in transistor, the optimum γ-TiO film exhibiting a high hole mobility of 8.2 cm²/V s is grown at the substrate bias voltage of −25 V and followed by the post-annealing at 400 °C.     

Effect of substrate biasing and temperature on AlN thin film deposited by cathodic arc ion

Aluminum nitride (AlN) films have been grown in pure N₂ plasma using cathodic arc ion deposition process. The films were prepared at different substrate bias voltages and temperatures. The aim was to investigate their influence on the Al macro-particles, structural and optical properties of deposited films. X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FTIR), Raman spectroscopy, Scanning electron microscope (SEM) and Rutherford backscattering spectrometry (RBS) were employed to characterize AlN thin films. XRD patterns indicated the formation of polycrystalline (hexagonal) films with preferential orientation of (002), which is suppressed at higher substrate bias voltage. FTIR and Raman spectroscopic analysis were used to assess the nature of chemical bonding and vibrational phonon modes of AlN thin films respectively. FTIR spectra depicted a dominant peak around 850 cm^?1 corresponding to the longitudinal optical (LO) mode of vibration. A shift in this LO mode peak towards higher wavenumbers was observed with the increase of substrate bias voltage and temperature, showing the upsurge of nitrogen concentration in the deposited film. Raman spectra illustrated a peak at 650 cm^?1 corresponding to E₂ (high) phonon mode depicting the c-axis oriented (perpendicular to substrate) AlN film. SEM analysis showed the AlN film deposited at higher substrate bias voltage contains fewer amounts of Al macro-particles.     

Carbon ions irradiation induced modifications in structural and electrical resistivity characteristics of ZrN thin films

Zirconium nitride (ZrN) thin films are irradiated with 800 keV energetic carbon (C) ions in a 5UDH-Pelletron accelerator and the ions irradiation induced effects are investigated. The films are irradiated at various C ions fluences, ranging from 10¹³ to 10¹⁵ ions/cm². The scanning electron microscopy study of the films indicates the development of zirconium (Zr) nanoparticles at ions irradiated region. X-ray diffraction (XRD) patterns of C ions irradiated films also show the formation of (100) and (002) oriented nanocrystalline metallic Zr phases. The irradiated films spectra depict a shift in ZrN peaks towards higher 2θ values, exhibiting that C ions bombardment induces compressive stress in the irradiated films. The appearance of C related peaks in Fourier transform infrared (FTIR) spectra confirms the incorporation of C atoms into ZrN film. Compressive stress has been calculated from the IR peak shift which indicates that higher ion dose (≥5×10¹⁴ ions/cm²) produce lower compressive stress relative to the lower ions fluences. Effect of ion dose on the film resistivity is also reported.     

Characteristics of pulse plated copper indium telluride films

Copper Indium Telluride films were deposited for the first time by the pulse electrodeposition technique at different duty cycles in the range of 6–50% at room temperature and at a constant potential of −0.66 V(SCE). The films exhibited single phase copper indium telluride. The grain size increased with increase of duty cycle. Optical band gap of the films varied in the range of 0.98–1.02 eV. Atomic force microscopy studies indicated that the grain size and surface roughness vary from 15 nm to 30 nm and 1.0 nm to 1.5 nm, respectively with increase of duty cycle. Capacitance voltage measurements indicated the films to exhibit n-type behavior. The flat band potential was −0.76 V(SCE) and carrier density was in the range of 10¹⁶ cm⁻³.     

Influence of Cu doping on physical properties of sol-gel processed SnS thin films

Copper-doped tin sulfide thin films (Cu-SnS) with different Cu doping concentrations were prepared by using the spin coating technique and their structural, electrical, and optical properties were studied. All the prepared films were polycrystalline and exhibited diffraction peaks corresponding to orthorhombic SnS with the preferred (111) orientation. The XRD spectra revealed improvement in the preferential orientation and crystalline quality with up to 4% Cu doping concentration, whereas Cu doping concentrations above 4% deteriorate the preferential orientation and crystalline quality. It has been observed that upon Cu doping the band gap decreased significantly from 1.46 eV (pure SnS) to 1.37 eV (4% of Cu-doped SnS). Hall measurements revealed the p-type semiconducting nature of the SnS thin films. The observations revealed that doping of SnS with Cu causes a noticeable drop in the room-temperature resistivity value from 10⁵ Ω-cm for pure SnS to 10³ Ω-cm for 4% Cu-doped SnS.     

Memory effects in hybrid silicon-metallic nanoparticle-organic thin film structures

We report on the electrical behaviour of metal–insulator–semiconductor (MIS) structures fabricated on silicon substrates and using organic thin films as the dielectric layers. These insulating thin films were produced by different methods, including spin-coating (polymethylmethacrylate), thermal evaporation (pentacene) and Langmuir–Blodgett deposition (cadmium arachidate). Gold nanoparticles, deposited at room temperature by chemical self-assembly, were used as charge storage elements. In all cases, the MIS devices containing the nanoparticles exhibited hysteresis in their capacitance versus voltage characteristics, with a memory window depending on the range of the voltage sweep. This hysteresis was attributed to the charging and discharging of the nanoparticles from the gate electrode. A maximum memory window of 2.5 V was achieved by scanning the applied voltage of an Al/pentacene/Au nanoparticle/SiO₂/p-Si structure between 9 and −9 V.     

Diffusion barrier performance of Zr–N/Zr bilayered film in Cu/Si contact system

Zr–N/Zr bilayered film as a diffusion barrier between Cu and Si is evaluated. The thermal stability of the diffusion barrier is investigated by annealing the Cu/Zr–N/Zr/Si samples in N₂ for an hour. XRD, SEM and AES results for the above contact systems after annealing at 700 °C show that Cu film has preferential (1 1 1) crystal orientation and no diffraction peaks of Cu₃Si and a Cu–Zr–Si ternary compound are observed for all Cu/Zr–N/Zr/Si contact systems. In addition, the atomic distribution of Zr and Si is evident and grows with increasing temperature up to 700 °C, which corresponds to the Zr–Si phase having low contact resistivity. Low contact resistivity and high thermal stability diffusion barrier can be expected by the application of the Zr–N/Zr bilayered film as a diffusion barrier between Cu and Si.     

Power law behavior of magnetoresistance in tris(8-hydroxyquinolinato)aluminum-based organic light-emitting diodes

Long-term current drift and dielectric relaxation in organic thin films of a single-layer structure pose a serious problem for the accurate measurement of magnetoresistance at low magnetic fields. A new measurement scheme was devised to minimize errors and to report that the magnetoresistance in tris(8-hydroxyquinolinato)aluminum obeys a power law on the magnetic field at 300, 100, and 4.2 K in an entire range from 1 to 140 mT. The exponent of the power increases gradually from 0.47 for a bias voltage of 3 V to 0.58 for a bias voltage of 8 V. The magnetoresistance was observable above the threshold voltage only and its sign was always negative.     

Effect of rapid thermal annealing on properties of thermally evaporated nanostructured CdTe thin film treated with CdCl2

The effects of rapid thermal annealing on properties of crystalline nanostructured CdTe films treated with CdCl₂ and prepared by vacuum evaporation are described. X-ray diffraction confirmed the crystalline nature of post-treated films with high preferential orientation around 23.7°, corresponding to a (1 1 1) diffracted plane of cubic phase. Optical band gap of CdTe films increased from 1.4 eV to 1.48 eV after annealing at 500 °C for 90 s. Atomic force microscopy of annealed films revealed an increase in root mean square roughness and grain size with increased annealing time. Electrical measurements of as-grown and annealed films are consistent with p-type; film resistivity has decreased significantly with increased annealing time.     

Floating active inductor based Class-C VCO with 8 digitally tuned sub-bands

A fully integrated floating active inductor based voltage-controlled oscillator (VCO) is presented. The active inductor employs voltage differencing transconductance amplifier (VDTA) as a building block. The designed VCO achieves frequency tuning by varying the bias current through the VDTA and utilizes a Class-C topology for improving the phase noise performance. The inductor-less VCO is designed and implemented in a 45-nm CMOS process and its performance is estimated using Virtuoso ADE of Cadence. Operating at a supply voltage of ±1 V, the proposed VCO consumes 0.44–1.1 mW corresponding to the oscillation frequency of 1.1–1.8 GHz thereby exhibiting a tuning range of 48.27%. The phase noise of the VCO lies in the range of −94.12 to −98.37 dBc/Hz at 1 MHz offset resulting in a FOM of −172.14 to −176.69 dBc/Hz.     

Effect of substrate temperature on the properties of ZnO thin films prepared by spray pyrolysis

Sprayed ZnO films were grown on glass at different substrate temperatures from 200 °C to 500 °C and their structural, optical and electrical properties were investigated. All films are polycrystalline with hexagonal wurtzite structure. ZnO films at substrate temperatures above 400 °C appear to be better crystalized with (002) plane as preferential orientation. Optical transmission spectrum shows that ZnO films have high transmission (above 80%) in visible region for substrate temperatures above 400 °C. Photoluminescence spectra at room temperature show an ultraviolet emission and two visible emissions at 2.82 eV and 2.37 eV. The resistivity of ZnO films increases with increasing substrate temperatures (above 400 °C). The ZnO film deposited at 400 °C shows highest figure of merit.     

Direct observation of changes in the effective minority-carrier lifetime of SiNx-passivated n-type crystalline-silicon substrates caused by potential-induced degradation and recovery tests

We directly observed reductions in the effective minority-carrier lifetime (τ_eff) of n-type crystalline silicon (c-Si) substrates with silicon-nitride passivation films caused by potential-induced degradation (PID). We prepared PID-test samples by encapsulating the passivated substrates with standard photovoltaic-module encapsulation materials. After PID tests applying − 1000 V to the c-Si samples from the glass surface, the τ_eff was decreased, which probably pertains to Na introduced into the c-Si. After PID tests applying + 1000 V, the sample, on the other hand, showed a considerably rapid τ_eff reduction, probably associated with the surface polarization effect. We also performed recovery tests of predegraded samples, by applying a bias opposite to that used in a degradation test. The τ_eff of a sample predegraded by applying + 1000 V was rapidly completely recovered by applying − 1000 V, while those of predegraded by applying − 1000 V show only slight and insufficient τ_eff recovery.     

Novel organic inverters with dual-gate pentacene thin-film transistor

We report on the fabrication and characterization of dual-gate pentacene organic thin-film transistors (OTFTs) with plasma-enhanced atomic-layer-deposited (PEALD) 150 nm thick Al₂O₃ as a bottom-gate dielectric and PEALD 200 nm thick Al₂O₃ as a top-gate dielectric. The V_th of dual-gate OTFT has changed systematically with the application of voltage bias to top-gate electrode. When voltage bias from −10 V to 10 V is applied to top gate, V_th changes from 1.95 V to −9.8 V. Two novel types of the zero drive load logic inverter with dual-gate structure have been proposed and fabricated using PEALD Al₂O₃ gate dielectrics. Because the variation of V_th due to chemical degradation and the spatial variation of V_th are inherent in OTFTs, the compensation technology by dual-gate structure can be essential to OTFT applications.     

Reliability of Diode-Integrated SiC Power MOSFET(DioMOS)

Status of the reliability study on silicon carbide (SiC) power MOS transistors is presented. The SiC transistors studied are diode-integrated MOSFETs (DioMOS) in which a highly doped n-type epitaxial channel layer formed underneath the gate oxide acts as a reverse diode and thus an external Schottky barrier diode can be eliminated. The novel MOS device can reduce the total area of SiC leading to potentially lower cost as well as the size of the packaging. After summarizing the issues on reliability of conventional SiC MOS transistors, the improvements by the newly proposed DioMOS with blocking voltage of 1200 V are presented. The I–V characteristic of the integrated reverse diode is free from the degradation which is typically observed in conventional pn-junction-based body diode in SiC MOS transistors. The improved quality of the MOS gate in the DioMOS results in very stable threshold voltage within its variation less than 0.1 V even after 2000 h of serious gate voltage stresses of + 25 V and − 10 V at 150 °C. High temperature reverse bias test (HTRB) shows very stable off-state and gate leakage current up to 2000 h under the drain voltage of 1200 V at 150 °C. These results indicate that the presented DioMOS can be applied to practical switching systems free from the reliability issues.     

Characterization of CdSe thin films deposited by chemical bath solutions containing triethanolamine

Cadmium selenide (CdSe) thin films were prepared by chemical bath deposition on glass substrates at different temperatures beginning at room temperature (25 °C) upto 80 °C from an aqueous alkaline medium using a precursor solution containing cadmium acetate, 2,2′,2′′-nitrilotriethanol (triethanolamine), ammonia and sodium selenosulphate. The pH of bath was kept constant around 10.50±0.10. Energy dispersive analysis of X-rays confirmed that the films are nearly stoichiometric in composition. The structural and surface morphological properties have been studied by X-ray diffraction, Scanning electron microscopy and Atomic force microscope techniques. X-ray diffraction study reveals a cubic structure with preferential orientation along (111) direction. The dependency of structural parameters such as crystallite size, strain and dislocation density with different bath temperatures for CdSe thin films are calculated. X-ray peak broadening was used to evaluate the crystallite size and lattice strain by the Williamson–Hall plots. Optical properties are studied by photoluminescence spectra which shows blue shift in peak position and reduction in luminescence intensity were observed for films deposited at different bath temperatures.     

Structural,optical, and photocatalytic properties of the spray deposited nanoporous CdS thin films; influence of copper doping,annealing, and deposition parameters

Nanoporous thin films of Cd_1−xCu_xS (0≤x≤0.06) were grown on a heated glass substrate employing a home-made spray pyrolysis technique. The influences of [Cu]/[Cd] and the annealing in the range 300–500 °C on the structural and morphological properties of the films were investigated by X-ray diffraction (XRD), Fourier transformation infrared spectroscopy (FTIR), field emission scanning electron microscope (FE-SEM) and atomic force microscopy (AFM). The influences of Cu doping ratio, solution flow rate, and the deposition time on the optical properties and photocatalytic activity of these films are also reported. The films are of polycrystalline nature and hexagonal structure. Increasing the Cu doping ratio and annealing temperature improve the (1 0 1) preferential orientation. The crystallite size is ranged from 23.82 to 32.11 nm. XRD and FTIR reveal the formation of CdO in the 6% Cu-doped CdS film annealed at 400 °C and in all films annealed at 500 °C. The pure CdS film is of a porous structure and the close-packing and porosity of the films increase with increasing Cu%. Also, the pore diameter can be controlled from 50 to 15 nm with the increase of Cu content. The films showed transmittance below 70%. The optical band gap of the films is decreased from 2.43 to 1.82 eV with increasing Cu% and flow rate/deposition time. Additionally, the refractive indices and dispersion parameters of the films are also affected by the deposition conditions. Cu doping enhanced the films' photostability as well as the photocatalytic removal of methylene blue (MB).     

Effect of co-doping concentration on structural,morphological, optical and electrical properties of aluminium and indium co-doped ZnO thin films deposited by ultrasonic spray pyrolysis

In this work, we reported a chemical approach to prepare aluminium and indium co-doped ZnO thin films (AIZO) by ultrasonic spray pyrolysis. Film depositions were carried out on soda lime glass substrates at 425 °C by using a spray solution containing zinc acetate as zinc precursor, aluminium acetylacetonate as Al dopant source and indium (III) acetate as In dopant source. Physical properties such as structural, morphological, optical and electrical properties were studied with respect to the equal variations in co-dopants concentration (0.5–3 at%). X-ray diffraction patterns proved that films are poly crystalline with (002) preferential orientation. Scanning electron microscopy analysis showed that AIZO films grown like hexagonal nanopyramids, elongated grains and irregular trigonals. Optical transmittance ~85% and a minimum resistivity of 1.3×10⁻³ Ω cm, are achieved for films when co-doped with 1.5 at% of Al and 1.5 at% of In, confirm that AIZO films are suitable for transparent conductive oxide (TCO) applications.     

Residual strain and electrical resistivity dependence of molybdenum films on DC plasma magnetron sputtering conditions

Sputter deposited molybdenum (Mo) thin films are used as back contact layer for Cu(In_1−xGa_x)(Se_1−yS_y)₂ based thin film solar cells. Desirable properties of Mo films include chemical and mechanical inertness during the deposition process, high conductivity, appropriate thermal expansion coefficient with contact layers and a low contact resistance with the absorber layer. Mo films were deposited over soda-lime glass substrates using DC-plasma magnetron sputtering technique. A 2³ full factorial design was made to investigate the effect of applied power, chamber pressure, and substrate temperature on structural, morphological, and electrical properties of the films. All the films were of submicron thickness with growth rates in the range of 34–82 nm/min and either voided columnar or dense growth morphology. Atomic force microscope studies revealed very smooth surface topography with average surface roughness values of upto 17 nm. X-ray diffraction studies indicated, all the films to be monocrystalline with (001) orientation and crystallite size in the range of 4.6–21 nm. The films exhibited varying degrees of compressive or tensile residual stresses when produced at low or high chamber pressure. Low pressure synthesis resulted in film buckling and cracking due to poor interfacial strength as characterized by failure during the tape test. Measurement of electrical resistivity for all the films yielded a minimum _value of 42 μΩ cm for Mo films deposited at 200 W DC power.