纳米切削加工模型的研究

从分析建立传统切削加工模型的理论基础和分析方法入手,指出该模型应用于纳米切削加工的不合理性,应用分子动力学仿真建立了纳米切削的加工模型.研究表明,在纳米切削过程中,当切削深度小于最小切削深度时,工件材料只发生了弹塑性变形,没有形成切屑.     

单晶铝纳米切削过程分子动力学模拟技术研究

运用分子动力学模拟技术建立单晶纳米切削模型,对纳米切削过程进行模拟,从分子间作用力和位错的角度对切屑形成过程和纳米加工表面的形成机理进行分析,并对切削刃刃口半径的大小和刀具磨损对已加工表面质量的影响进行研究。     

光学玻璃超精密切削加工裂纹的离散元仿真研究

通过力学性能的数值模拟实验及校准,建立了光学玻璃的离散元模型和超精密切削加工的模型,并对其微切削过程进行了模拟;分析了在不同刀具前角、切削深度及切削速度加工条件下对加工后表面裂纹形成的影响。结果表明:加工表面的裂纹数目和裂纹最大深度随切削深度的增大而增大,而随刀具前角的增大而减小;加工表面的裂纹数目随切削速度的增大而减小,裂纹最大深度随切削速度的增大而增大。     

微纳米切削装置及实验研究

目前超精密加工领域的进一步发展在一定程度上受到纳米加工机理缺乏深入研究的限制,用建立在连续介质力学基础上的有限元方法和传统加工的剪切模型来解释纳米切削机理显然是不合适的,虽然有人用分子动力学计算和仿真纳米切削过程,但由于计算规模不够大,而相应级别的切削实验困难,还不能相互验证.为此,文中搭建了可以实现微纳米切削的实验装置,从实验的角度研究纳米切削机理,为民用工业和国防工业中高精度零件和元器件的超精密和纳米加工提供必要的实验数据支撑.     

基于Kriging模型的数控机床空间切削稳定性

针对机床加工点空间位姿的改变,导致切削稳定性预测具有复杂性和不确定性问题,提出一种基于Kriging模型的机床空间切削稳定性研究方法。该方法以机床最小极限切削深度为研究对象,首先,通过构建描述其与加工位姿间数学关系的Kriging模型,预测其在加工空间的演化规律;其次,引入改进粒子群算法,计算具有最小极限切削深度极大值的加工位置,并结合切削实验和能量分布理论确定机床易颤振模态及对应的薄弱结合部,通过优化结合部动刚度以提高最小极限切削深度值。以一台立式加工中心主要加工任务中耗时较多的工序进行实例验证,建立该工序最小极限切削深度的Kriging模型,阐明加工位置变化对切削稳定性有较大影响,并提出结合部动刚度优化方案,提高了最小极限切削深度。     

主轴滚子轴承铣削加工中切削深度优化量算

为了提高铣削加工的工艺水准,需要进行切削深度优化量算模型设计。提出一种基于多轴联动加工切削深度误差修正的主轴滚子轴承铣削加工中切削深度优化量算方法,采用响应面分析法构建铣削参数与主轴滚子轴承加工质量之间的数学模型,以顶隙系数、切齿深度和切削深度为目标优化参量,建立多目标优化模型,在切削速度和进给速度多轴联动约束下进行切削深度误差修正,实现主轴滚子轴承铣削加工参量的优化解算。仿真结果表明,采用该方法进行主轴滚子轴承铣削加工参量量算,加工工艺参数的全局优化性能较好,切削精度较高,加工误差收敛性较好。     

氧化铝陶瓷生坯切削加工裂纹的离散元仿真研究

利用离散元软件PFC2D建立了氧化铝陶瓷生坯的二维离散元模型,并通过力学性能数字模拟试验对该模型进行校准,使其物理和力学性能参数与氧化铝陶瓷生坯的实际参数相匹配。基于该模型对氧化铝陶瓷生坯切削加工进行了动态模拟,分析了低速切削时,切削速度和切削深度对切削力及加工后表面裂纹的影响。结果表明:用离散元的方法模拟陶瓷生坯材料的切削过程可行,加工后表面裂纹的数目及平均深度随切削深度的增大而增大,并随切削速度的增大而减小。     

超声椭圆振动切削硬质合金脆性-延性转变临界条件研究

为了实现硬质合金的高效延性加工,联系硬脆材料表面生成裂纹的临界载荷与超声椭圆振动切削硬质合金的主切削力,建立超声椭圆振动切削硬质合金脆性-延性转变的临界切削深度模型,研究切削速度、刀具圆弧半径、椭圆振动频率、振幅、硬质合金的硬度、断裂韧性与临界切削深度的关系;通过仿切削刻划试验,验证了切削速度与硬质合金的硬度、断裂韧性对临界切削深度的影响规律;对比普通切削,超声椭圆振动切削有利于提高硬质合金的临界切削深度,在改善加工表面质量及精度的前提下,提高了加工效率。     

高速切削钛合金稳定性模型及极限切深预测

针对TC4钛合金高速加工过程中颤振及切削稳定性问题进行了研究。首先根据闭环加工系统的动力学模型,建立了高速切削过程的稳定性模型,并通过解析计算的方法得到了加工过程中稳定切削极限深度与转速之间的关系。然后采用力锤敲击方法获取了刀具的频响函数,为切削稳定性模型的建立奠定了基础,最后采用切削实验验证了模型的准确性。结果表明:采用高速切削方式加工TC4钛合金能更好的避免加工过程的颤振现象,建立的稳定模型能很好地预测加工过程的稳定性。     

磷锗锌晶体脆塑转变临界切削深度的研究

为实现磷锗锌(ZnGeP2)晶体超精密切削,提高表面加工质量,获得纳米级的超光滑表面,基于纳米压痕实验计算出磷锗锌晶体表面脆塑转变临界深度.在此深度内切削材料产生脆塑转变,并以塑性方式去除.在此基础上,采用单点金刚石飞切机床DFC600A开展磷锗锌晶体超精密切削.通过控制切削深度低于磷锗锌晶体脆塑转变临界深度,使材料表面仅发生塑性变形,实现了晶体表面纳米级光滑表面加工,表面粗糙度达1.01 nm,达到了对磷锗锌晶体表面的加工要求,验证了方法的有效性.     

NANOSCALE CUTTING OF MONOCRYSTALLINE SILICON USING MOLECULAR DYNAMICS SIMULATION

It has been found that the brittle material, monocrystalline silicon, can be machined in ductile mode in nanoscale cutting when the tool cutting edge radius is reduced to nanoscale and the undeformed chip thickness is smaller than the tool edge radius. In order to better understand the mechanism of ductile mode cutting of silicon, the molecular dynamics (MD) method is employed to simulate the nanoscale cutting of monocrystalline silicon. The simulated variation of the cutting forces with the tool cutting edge radius is compared with the cutting force results from experimental cutting tests and they show a good agreement. The results also indicate that there is silicon phase transformation from monocrystalline to amorphous in the chip formation zone that can be used to explain the cause of ductile mode cutting. Moreover, from the simulated stress results, the two necessary conditions of ductile mode cutting, the tool cutting edge radius are reduced to nanoscale and the undeformed chip thickness should be smaller than the tool cutting edge radius, have been explained.     

Study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer

In cutting of brittle materials, experimentally it was observed that there is an upper bound of tool cutting edge radius, beyond which, although the undeformed chip thickness is smaller than the tool cutting edge radius, the ductile mode cutting cannot be achieved. However, why there is an upper bound of tool cutting edge radius in nanoscale ductile mode cutting of brittle materials has not been fully understood. In this study, based on the tensile stress distribution and the characteristics of the distribution obtained from molecular dynamics simulation of nanoscale ductile cutting of silicon, an approximation for the tensile stress distribution was obtained. Using this tensile stress distribution with the principles of geometrical similarity and fracture mechanics, the critical conditions for the crack initiation have been determined. The result showed that there is a critical tool cutting edge radius, beyond which crack initiation can occur in the nanoscale cutting of silicon, and the chip formation mode is transferred from ductile to brittle. That is, this critical tool cutting edge radius is the upper bound of the tool cutting edge radius for ductile mode cutting of silicon.     

Study on advanced nanoscale near-field photolithography

At present, applying a near-field optical microscope to photolithographic line segment fabrication can only obtain nanoscale line segments of equal cutting depths, and cannot result in 3D shape fabrication. This study proposes an innovative line segment fabrication model of near-field photolithography that adjusts an optical fiber probe's field distance to control the exposure energy density, and moreover constructs an exposure energy density analysis method of the innovative photolithographic line segment fabrication. During the exposure simulation process of the innovative line segment fabrication model of near-field photolithography, the near-field distance between the optical fiber probe and the photoresist surface increases gradually, whereas the exposure energy density distribution decreases gradually. As a result, the cutting depth becomes shallower and the full-width at half maximum (FWHM) increases. The results of this study can serve as a theoretical reference for developing advanced nanoscale near-field photolithography techniques, to which an important and groundbreaking contribution is made.     

纳米级超精密切削表面粗糙度若干影响因素分析

介绍了W-M函数和分形分维数的结构函数法求法,采用分形理论对影响纳米级超精密切削表面质量的若干因素进行了初步分析,并进行了相关的试验和统计分析,特别是对其中主要的影响因素及其影响程度进行了分析,得出并验证了集合与子集的分维数求法及其影响关系,并对将上述理论应用于设计实际的相关问题进行了探讨。     

Development of cutting tools with microscale and nanoscale textures to improve frictional behavior

We developed novel cutting tools that had either microscale or nanoscale textures on their surfaces. Texturing microscale or nanoscale features on a solid surface allowed us to control the tribological characteristics of the tool. The textures, which had pitches and depths ranging from several hundreds of nanometers to several tens of micrometers, were fabricated utilizing the ablation and interference phenomena of a femtosecond laser. The effect of the texture shape on the machinability of an aluminum alloy was investigated with a turning experiment applying the minimum quantity lubrication method. The texture decreased the cutting force due to the corresponding reduction in the friction on the rake face. This effect strongly depended on the direction of the texture; lower cutting forces were achieved when the texture was perpendicular to the chip flow direction rather than parallel. This effect was only observed at high cutting speeds over 420 m/min. These results indicate that the developed tools effectively improved the machinability of the alloy.     

Controller design for high-frequency cutting using a piezo-driven microstage

Controller design consists of a feedforward and a feedback controller to support a microstage with flexure hinge structure driven by piezoelectric ceramic actuator for high-frequency nanoscale cutting is developed in this article. The feedforward controller is designed based on a hysteresis dynamic model in order to reduce the nonlinear hysteresis effect of piezoelectric actuator. The position feedback controller is designed based upon an exponentially weighted moving average (EWMA) method embedded in an internal model control (IMC) structure constructing a run-to-run IMC (RtR-IMC) control scheme in order to deal with system bias or modeling inaccuracy. Also, disturbance due to temperature rise will influence actuator's performance, hence an additional compensator is included in the IMC structure. Surfaces dimple micro-machining utilizes piezoelectric-driven microstage for high-speed cutting is selected as an example to investigate system performance. The developed control algorithm is implemented on a DSP-based system to provide 1 kHz operating speed. In experiment, the proposed feedforward and feedback controller is verified to be able to overcome those negative factors efficiently and preserve good positioning accuracy.     

Nanowire cutting by an ultrasonically vibrating micro tool

Cutting of a nanoscale workpiece is useful in nano testing and fabrication, and novel cutting methods with little gasification of cut nano samples and simple device structures are needed for practical applications. In this paper, an ultrasonic nanowire cutting strategy is demonstrated, in which the linear and elliptical vibration of the tip of a micro cutting tool and the adhesion force between a substrate and nanowire are employed to cut and fix the nanowire, respectively. With this strategy, cutting of individual silver nanowires with a diameter from 50 nm to 400 nm is implemented, in which the vibration velocity amplitude of the micro cutting tool’s root is from 18 to 220 mm/s, and the working frequency is about 96.9 kHz and 45.2 kHz, respectively. The dependency of the minimum cutting velocity and optimum cutting velocity range’s lower limit on the AgNW diameter is experimentally clarified. Also, the cutting principle is analyzed, which can well explain the incision morphology and cutting characteristics.     

Nanometric cutting in a scanning electron microscope

A nanometric cutting device under high vacuum conditions in a scanning electron microscope (SEM) was developed. The performance, tool-sample positioning, and processing capacity of the nanometric cutting platform were studied. The proposed device can be used to realize a displacement of 7 μm, with a closed-loop resolution of 0.6 nm in both the cutting direction and the depth direction. Using a diamond cutting tool with an edge radius of 43 nm formed by focused ion beam (FIB) processing, nanometric cutting experiments on monocrystalline silicon were performed on the developed cutting device under SEM online observation. Chips and machining results of different depths of cut were studied during the cutting process, and cutting depths of less than 10 nm could be obtained with high repeatability. Moreover, the cutting speed was found to exhibit a strong relationship with the brittle–ductile transition depth on brittle material. The experimental results of taper cutting and sinusoidal cutting indicated that the developed device has the ability to perform multiple degrees of freedom (DOFs) cutting and to study nanoscale material removal behaviour.     

Low-temperature machining in a fully submerged cryogenic environment

The role of an immersive cryogenic environment in affecting material response in machining was explored using dynamometry, calorimetry, electron microscopy, and microindentation. Effects of tool rake angle on energy dissipation, stored energy of cold work, deformed microstructure, and hardening were evaluated for machining under a fully submerged cryogenic cutting environment and a dry cutting environment. Sustained immersion of the cutting zone in liquid nitrogen resulted in greater energy dissipation and hardening in the work and machined subsurface. This increased hardening at low temperature was directly linked to greater microstructure refinement and a lower fraction of dissipated energy stored in the form of added defects and grain boundaries. Various microstructure types with domain sizes from microscale to nanoscale were developed in the machined chips, depending on the rake angle and temperature used.     

Al/TiN软硬交替多层膜的制备及摩擦磨损性能研究

软硬交替的多层膜体系具有超硬、强韧、耐磨、自润滑的优势,能大大提高金属切削刀具在现代加工过程中的耐用度和适应性。设计Al/TiN软硬交替纳米多层膜体系,并采用直流磁控溅射和阴极弧磁过滤等离子体沉积相结合的技术,室温下在单晶硅Si（100）衬底上制备一系列不同TiN层厚度纳米多层膜,研究其结构、形貌、力学及摩擦磨损性能。结果表明：该涂层具有良好的多层结构,多层膜中Al呈非晶态或纳米晶态,TiN结晶质量随其厚度增加得到提高;Al/TiN多层膜硬度均高于混合法则计算的硬度值,出现了硬度增强效应;该多层膜体系虽具有较高的摩擦因数,但表现出较好的韧性。