ITO玻璃衬底上PLZT铁电薄膜的制备与电性能

用sol-gel法在掺Sn的In2O3导电透明膜(ITO)衬底上,制备了La掺杂的PbZr0.5Ti0.5O3(PLZT)铁电薄膜。研究了La掺杂量对薄膜的铁电、介电和漏电性质的影响。结果表明,x(La)为5%的PLZT薄膜经650℃退火,有优良的铁电特性,外加15V电压下,剩余极化强度为35.4×10–6C/cm2,矫顽场强为111×103V/cm。100kHz时的εr和tgδ分别为984和0.13。在外加电场小于9V时,薄膜的漏电流密度不超过10–8A/cm2。     

PZT铁电厚膜声纳换能器

综述了 PZT厚膜单元声纳换能器和 8× 8阵列声纳换能器的制备方法、结构和性能 ,并介绍了 PZT厚膜声纳换能器的应用及发展前景。该厚膜是利用改进的 sol- gel工艺制备的 ,厚度为 4～ 12 μm。4μm厚的 PZT厚膜的纵向压电系数 d3 3 为 140～ 2 40 p C/ N,剩余极化强度 Pr为 2 8× 10 - 6 C/ cm2 ,矫顽场强 EC为 30× 10 3 V/ cm,相对介电系数 εr为 140 0。     

LSMCD法制备梯度BST铁电薄膜的工艺研究

研究了利用液态源雾化化学沉积(LSMCD)法制备梯度钛酸锶钡(BST)薄膜的工艺。该方法既可以较精确的控制薄膜的化学计量比及掺杂浓度,又可采用控制超声雾化沉积的时间和次数来有效的控制膜厚及晶粒的大小。X-射线衍射(XRD)和扫描电镜(SEM)分析表明:沉积8次,采用常规退火方式,在Pt/Ti/SiO2/Si衬底上能成功制备出具有钙钛矿结构的、晶粒粒径约80 nm、厚约850 nm的梯度BST薄膜。该BST梯度薄膜在常温下介电常数达526,介电损耗约为0.06,矫顽场强约为100 kV/cm,剩余极化强度约为10μC/cm2,饱和极化强度约为20μC/cm2,在各个领域都具有广阔的应用前景。     

采用氧化物复合底电极的BTO薄膜结构和性能

用球磨法制备Bi4Ti3O1(2BTO)靶材。用PLD法在Pt/TiO2/SiO2/Si基片上先分别以三种氧化物SrRuO(3SRO)、LaSrCoO3(LSCO)、LaNiO3(LNO)和Pt生成复合底电极,再在其上生长了外延取向的BTO薄膜。分析了薄膜的结构和性能。结果表明,这种BTO薄膜的c轴取向得到抑制,其极化强度从0.45×10–6C/cm2提高到0.9×10–6C/cm2;矫顽场强从90×103V/cm下降到50×103V/cm。     

金属有机盐热分解法制备铌酸钾钠无铅压电薄膜

选用乙醇铌、乙酸钾、乙酸钠为原料,通过金属有机盐热分解法制备了Na0.5K0.5NbO3(NKN)无铅压电薄膜。研究了不同退火温度对NKN薄膜的晶体结构和形貌的影响。结果表明:当退火温度低于500℃时,所制NKN薄膜为无定形结构。650℃制备的NKN薄膜具有(100)晶面生长的择优取向;该薄膜的表面致密,颗粒尺寸分布均匀,10kHz的相对介电常数为258,介电损耗为0.05。该薄膜具有铁电体典型的电滞回线,剩余极化强度(Pr)和矫顽场强(EC)分别为3.45×10–6C/cm2和160×103V/cm。     

0.7BiFeO_3-0.3PbTiO_3薄膜结构与电学性能的厚度效应

以溶胶–凝胶法在Pt/Ti/SiO2/Si(111)基底上制备了厚度为30~1 110 nm的0.7BiFeO3-0.3PbTiO3(0.7BFO-0.3PT)薄膜,研究了薄膜厚度对0.7BFO-0.3PT薄膜的结构与电学性能的影响。结果表明,随着膜厚的增加,晶格常数c与a的比值c/a以及晶粒尺寸都呈现先增大后减小的趋势,但其剩余极化强度及介电常数却均与薄膜厚度呈正比。厚度为180 nm的0.7BFO-0.3PT薄膜具有最大的矫顽场(2.99×105V/cm)和晶粒均匀度(42 nm),同时其晶格常数比c/a也达到最大,为1.129 9。     

掺钕钛酸铋铁电陶瓷靶的研制

用添加晶种的方法制备了掺钕钛酸铋(BNT)铁电陶瓷靶材。通过XRD及SEM研究了烧结工艺对铁电陶瓷BNT晶相结构的影响,用RT66型铁电测试仪测定铁电材料BNT的电滞回线。结果表明,采用在800℃预烧、保温2h,1100℃烧结、保温12h的烧成工艺,所得的BNT铁电陶瓷具有良好的c轴取向,具有较好电滞回线(Pr-Ec)。在应用电压为5V,测试频率为1MHz下,BNT铁电陶瓷的剩余极化强度(Pr)及矫顽场强(Ec)可分别达到2.2×10–6C/cm2和5×103V/cm。     

Au/PLT/Pt铁电薄膜电容的电学性能

用 Sol- Gel方法研制了 PL T[(Pb0 .83 L a0 .17) Ti O3 ]铁电薄膜 ,结合非挥发性铁电存储器对铁电电容的要求 ,研究了 Au/ PL T/ Pt铁电电容和漏电流、剩余极化、疲劳、开关特性和揭电常数等性能。对厚度为 0 .4 μm的薄膜 ,5 V时的剩余极化强度 Pr=2 2 μC/ cm2 ,矫顽场强度 Ec=6 0k V/ cm,相对介电常数约 130 0 ,漏电流 Id=3.2× 10 -8A/ mm2 ,开关特性优良。疲劳测试表明 ,对Vpp=10 V的锯齿信号 ,经 4 .5× 10 11周期后 ,剩余极化强度衰减 2 0 %。上述性能表明 ,该 PL T膜能用于非挥发性铁电存储器的试制     

玻璃基LSCO/PZT/LSCO电容器的制备和铁电性能

采用磁控溅射法制备La0.5Sr0.5CoO3(LSCO)薄膜、sol-gel法制备Pb(Zr0.4Ti0.6)O3(PZT)薄膜,在玻璃和Ti-Al/Si衬底上构架了LSCO/PZT/LSCO电容器,研究了衬底对LSCO/PZT/LSCO电容器结构和铁电性能的影响。研究发现:虽然生长在两种衬底上的PZT薄膜均为钙钛矿结构多晶薄膜,但是,生长在玻璃衬底上的LSCO/PZT/LSCO电容器具有更好的铁电性能。玻璃基LSCO/PZT/LSCO电容器的剩余极化强度(Pr)为28×10–6C/cm2,矫顽电压(Vc)为0.96V;而硅基LSCO/PZT/LSCO电容器的Pr为25×10–6C/cm2,Vc为1.05V。     

非制冷红外焦平面阵列BST铁电薄膜的制备及性能研究

采用改进的溶胶-凝胶方法,在Pt／Ti／SiO2／Si基片上成功地制备出不同组分,具有钙钛矿型结构的BST铁电薄膜。BST5、BST10和BST15铁电薄膜的介电系数εr,分别为375、400和425,介电损耗tgδ分别为0．041、0．024和0．010,剩余极化强度Pt分别为2μc／cm^2、2.5／μc／cm^2和1．7μc／cm^2,矫顽场Ec分别为40kV／cm、50kV／cm和35kV／cm,是制备非制冷红外焦平面阵列的优选材料。     

Structural and Electrical Characters of Ba0.6Sr0.4TiO3/La0.5Sr0.5CoO3 Thin Films by Plus Laser Deposition

Epitaxial Ba0.6Sr0.4TiO3 (BST) thin films were deposited on LaAlO3 (LAO) substrates with the conductive metallic oxide La0.5Sr0.5CoO3 (LSCO) film as a bottom electrode by pulsed laser deposition (PLD). X-ray diffraction ~2 and Ф scan showed that the epitaxial relationship of BST/LSCO/LAO was [001] BST//[001] LSCO//[001] LAO. The atomic force microscope (AFM) revealed a smooth and crack-free surface of BST films on LSCO-coated LAO substrate with the average grain size of 120 nm and the RMS of 1.564 nm for BST films. Pt/BST/LSCO capacitor was fabricated to perform CapacitanceVoltage measurement indicating good insulating characteristics. For epitaxial BST film, the dielectric constant and dielectric loss were determined as 471 and 0.03, respectively. The tunabilty was 79.59% and the leakage current was 2.6310-7 A/cm2 under an applied filed of 200 kV/cm. Furthermore, it was found that epitaxial BST (60/40) films demonstrate well-behaved ferroelectric properties with the remnate polarization of 6.085 C/cm2 and the coercive field of 72 kV/cm. The different electric properties from bulk BST (60/40) materials with intrinsic paraelectric characteristic are attributed to the interface effects.     

Structural and Electrical Characters of Ba0.6Sro.4TiO3/La0.5Sr0.5CoO3 Thin Films by Plus Laser Deposition

Epitaxial Ba0.6Sr0.4TiO3 (BST) thin films were deposited on LaAlO3 (LAO) substrates with the conductive metallic oxide La0.5Sr0.5CoO3 (LSCO) film as a bottom electrode by pulsed laser deposition (PLD). Xray relationship of BST/LSCO/LAO was [001] BST//[001]LSCO//[001] LAO. The atomic force microscope (AFM)revealed a smooth and crackfree surface of BST films on LSCOcoated LAO substrate with the average grain size of 120 nm and the RMS of 1.564 nm for BST films.Pt/BST/LSCO capacitor was fabricated to perform CapacitanceVoltage measurement indicating good insulating characteristics. For epitaxial BST film, the dielectric constant and dielectric loss were determined as 471 and 0.03, respectively. The tunabilty was 79.59% and the leakage current was 2.63×107 A/crm2 under an applied filed of 200 kV/cm. Furthermore, it was found that epitaxial BST (60/40) films demonstrate wellbehaved ferroelectric properties with the remnate polarization of 6.085 μC/cm2 and the coercive field of 72 kV/cm. The different electric properties from bulk BST (60/40)materials with intrinsic paraelectric characteristic are attributed to the interface effects.     

Co掺杂对BST薄膜介电性能的影响

用sol-gel法在Pt/Ti/SiO2/Si(100)衬底上制备了掺Co的钛酸锶钡(BST)薄膜,研究了Co的掺杂量x(Co)对BST薄膜的晶相结构和电学性能的影响。结果表明:随着x(Co)的增加,BST薄膜的介电常数εr,介质损耗tgδ和漏电流密度JL均降低;当x(Co)为5%时,BST薄膜的εr、tgδ、JL、可调性和品质因子分别为:228.3、0.013、3.69×10–7 A/cm2、15.4%、12.03。     

Dielectric Characteristics of Ba0.65Sr0.35TiO3 Thin Films by Sol-Gel Method

Ferroelectric Ba0.65Sr0.35TiO3 (BST) thin films on the Pt/Ti/SiO2/Si substrate have been successfully prepared by sol-gel. Such films have approximately 300 nm thicknesses with a remnant polarization of about 2.95 C/cm2 and a coercive field of about 21.5 kV/cm. The investigations of X-ray diffraction and atomic force microscopy show that the BST films annealed at 650 ℃ exhibit a tetragonal structure and that the films dominantly consist of large column or grains of about 89 nm in diameter. The curves of the temperature dependence of dielectric coefficient in different frequencies display the curie transition at the temperature around 23 ℃. The dielectric loss tangent of BST thin films at 100 kHz is less than 0.04. As a result, the BST thin films are more applicable for fabrication of infrared detector compared with the BST thin films reported previously.     

Dielectric Characteristics of Ba_(0.65)Sr_(0.35)TiO_3 Thin Films by Sol-Gel Method

Ferroelectric Ba0.65Sr0.35TiO3(BST) thin films on the Pt/Ti/SiO2/Si substrate have been successfully prepared by sol-gel. Such films have approximately 300 nm thicknesses with a remnant polarization of about 2.95 μC/cm2 and a coercive field of about 21.5 kV/cm. The investigations of X-ray diffraction and atomic force microscopy show that the BST films annealed at 650 °C exhibit a tetragonal structure and that the films dominantly consist of large column or grains of about 89 nm in diameter. The curves of the temperature dependence of dielectric coefficient in different frequencies display the curie transition at the temperature around 23 °C. The dielectric loss tangent of BST thin films at 100 kHz is less than 0.04. As a result,the BST thin films are more applicable for fabrication of infrared detector compared with the BST thin films reported previously.     

Electrical properties of sputtered (Ba, Sr)TiO3 thin films prepared by two-step deposition method

The influence of two-step deposition on the electrical properties of sputtered (Ba,Sr)TiO₃ thin films was investigated. BST thin films with thickness 40 nm were deposited by a simple two-step radio frequency-magnetron sputtering technique, where the BST thin film consisted of a seed layer and a main layer. The dielectric constant was strongly dependent on the thickness of seed layer, but there was no dependence on deposition temperature of the seed layer. For a 2 nm seed layer, the dielectric constants were higher by about 29% than those of single-step BST thin films due to higher crystallinity and the leakage current was nearly the same as that of a single-step sample in bias voltage from −2 to 2.5 V. However, an improvement of the dielectric constant was not observed for samples having above 4 nm thick seed layers. A 40 nm thick BST film with 2 nm thick seed layer deposited by a two-step method exhibited a SiO₂ equivalent thickness of 0.385 nm and a leakage current density of 2.74 × 10⁻⁸A/cm²at+1.5V after post-annealing under an atmosphere of flowing N₂ for 30 min at 750°C.