等离子体显示器件中氧化镁膜的制备和测试

等离子体显示器（PDP）是最有发展前景的新一代显示器件，MgO膜是其制造工艺中的一个瓶颈。本文结合PDP的发展，综述了近年来MgO膜层镀制与测试工艺的进展，讨论了PDP对保护膜性能的要求。PDP市场的进一步扩大亟需在生产上建立一个能取得共识的对MgO膜层性能进行评价的标准。     

PDP用红色荧光粉的研究进展

简要介绍了目前研究和使用的PDP用红色荧光粉的研究现状,综述了国内外PDP用红色荧光粉的合成研究进展,最后展望了PDP用红色荧光粉的发展前景.     

门式刚架轻型钢结构工业厂房最优柱距研究

<正>1概述门式刚架轻型钢结构是单层工业厂房中一种常见的结构形式。特别是近十多年来,随着我国经济建设的迅速发展,由于生产的需要,这类结构以其用钢量低,重量轻,造价低,适用范围广等优点而获得广泛的应用。不仅国外的轻钢生产厂家纷纷将整套的厂房结构体系推向国内市场,国内的轻钢生产厂家、设计单位也也纷纷转向这类结构的生产和设计。     

中科院应化所PDP荧光粉取得创新性成果

北京有色金属研究总院、中科院长春应化所、中科院光机与物理所、有研稀土新材料股份有限公司经多年的联合攻关，突破了彩色等离子显示屏（PDP）用荧光体产业化关键技术，开发出了具有我国独立知识产权的PDP用高效荧光粉，所得产品主要性能达国际先进水平。     

PDP用蓝色荧光粉的研究进展

综述了近年来等离子体平板显示器(PDP)用蓝色荧光粉的研究进展,介绍了PDP蓝色荧光粉的种类和制备方法,分析了现有PDP蓝色荧光粉存在的问题和不足,并展望了PDP蓝色荧光粉未来的发展趋势。     

新型建材与涂料

首钢红冶钢厂试轧成功F型钢填补国内空白日前，首钢红冶钢厂在轧二车间试轧成功F型钢，为国内型钢市场填补了一项空白。F型钢是一种建筑行业用新型型材，主要用于建筑行业制造模板用。用F型钢制造的模板使用操作简单、美观大方、使用寿命长。国内现通常用的建筑模板一般使用寿命在3～5次。而用F型钢制造的模板使用寿命可达20次，韩国在汉城亚运会建设场馆上已大量使用，经济效益可观。目前，韩商已在我国国内建厂，生产这种模板，原料从韩国进口。为了降低成本，韩商想从我国国内寻找生产厂家。该厂了解到这一信息后，及时找到韩商进行洽…     

ESCALAB MK Ⅱ型电子能谱仪数据系统改造

介绍对目前国内占主导地位的VG系列谱仪的数据收集及处理系统的改造方法。主要采用当今流行的IBM－PC机（8086－80586系列）与工业及实验室用PCL－812控制卡取代原谱仪所带的PDP－11／73为主的数据系统。改造后各项指标均达到原谱仪水平，数据收集及处理方面还有些改进。由于以APPLE　Ⅱ系列微机为数据系统的VG谱仪的微机／谱仪接口与以PDP－11微机数据系统的基本相同，所以该方法对前者的改造同样适用。     

彩色PDP用蓝色荧光粉体的纳米化工艺研究

介绍了一种彩色PDP用蓝色荧光粉体的纳米化工艺，通过此方法，可以制备出比传统的PDP蓝色荧光粉体发光效率更高的纳米级蓝色荧光粉体，同时有效的降低了制备过程的烧结温度。制备的蓝色荧光粉体完全适用于PDP显示设备中。另外，纳米化的小颗粒也为进一步的表面包覆以防止衰减奠定了基础。     

中国稀土新材料市场:稳步壮大中走向应用高端

未来稀土永磁材料产品变化将显示出很强的市场导向性,特别是钕铁硼产品为适应汽车电机、电脑音圈、手机等高端应用产品变化需求,产品将向更高磁能积、更好均匀性和一致性、更高质量的镀层等方向发展。新型显示器件用稀土荧光粉材料,PDP三基色荧光粉将逐渐成为该市场新的产品热点。随着PDP彩电市场的快速崛起,PDP三基色荧光粉将继CRT荧光粉之后,成为稀土显示器荧光粉材料市场主流产品。另外,节能灯用三基色荧光粉会成为另一个增长迅速的荧光粉材料。未来几年,贮氢合金及稀土抛光粉市场,在生产技术和产品应用趋于成熟的前景下,目前行业生产分散、规模经营小的状况将向集约化、产业化生产方向发展。     

一种磷螺环阻燃剂的制备及其应用试验

本文介绍采用二步法合成一种磷螺环阻燃剂。在第一步合成中间体为苯基二氯磷酸酯（PDP）的蒸馏采用普通设备及普通蒸馏条件，因此可以较短时间、高效率低成本生产出PDP。用此中间体再与季戊四醇反应制得收率〉81％，纯度〉93．5％，酸值〈0．4KOHmg／g的最终产物磷螺环阻燃剂，将该阻燃剂6．5wt％用于ABS树脂，可制得UL94V-2（3．2mm）级阻燃效果，且试样表面无泛黄变色问题。     

Modeling the effects of temperature on the rheology of solder pastes and flux system

Solder paste is one of the most important process materials today in surface mount technology. Stencil printing of solder paste onto PCBs constitutes an important stage in the reflow soldering of surface mount devices. A high proportion of the solder-related defects can be attributed to the stencil printing process. This is likely to continue with the trend toward miniaturization and the implementation of die-size packages. To achieve repeatable solder deposits from board-to-board and pad-to-pad requires an understanding of the paste rheology. One of the key factors that influences solder paste rheology is temperature. A change in temperature will cause the viscosity of the solder paste to change. This change could be ambient or from the stencil printing process itself. This is likely to impact on the performance of the solder paste. In this paper, we present the effect of temperature on the rheological properties of solder paste and the flux vehicle system. Current models show a single variable dependence of viscosity with temperature. The model presented here incorporates shear rates and can be used for any solder paste or non-Newtonian material. The effects of temperature on solder paste flux medium, particle size and distribution, and metal alloy content are also presented.     

陶瓷散热片用铜浆玻璃相的制备

厚膜陶瓷散热片的制备工艺一般为丝网印刷铜浆、烧结、化学镀镍3部分。目前印刷在散热片上的铜浆,经化学镀镍工艺后附着力下降,因此研究制备导电性好、导热性优和附着力高的铜浆是制备陶瓷散热片的关键。通过对铜浆玻璃相的制备、玻璃软化温度的测定和玻璃釉在化学镀镍液中的耐蚀性测试,得到了耐蚀性较好的玻璃釉,其玻璃相成分为40%SiO₂-31%Bi₂O₃-5%B₂O₃-3%Al₂O₃-5%TiO₂-3%CaO-4%SrO-5%Na₂O-5%K₂O（质量分数,下同）。     

基于RSM的Al2O3陶瓷膏体配方优化

为采用低成本在低温下实现复杂陶瓷零件的成型,研究Al2O3陶瓷膏体的配方对其成型过程以及成型后物理机械性能的影响.采用中心组合方法设计实验方案,考察了p H值、粘结剂和分散剂三因素对Al2O3陶瓷膏体黏度的影响,运用响应面方法(RSM)对影响Al2O3陶瓷膏体黏度的工艺参数进行详细分析,建立了Al2O3陶瓷膏体黏度的响应模型,进行响应曲面分析,根据满意度函数(DFM)确定最佳陶瓷膏体黏度值对应的工艺参数,试验表明,所建立的模型能实现相应的黏度值预测.     

Flow processes in solder paste during stencil printing for SMT assembly

Solder paste is used for reflow soldering of Surface Mount Devices (SMDs). In this paper we discuss how the various stages of the stencil printing cycle affect the rheological properties of the solder paste. First the heat generated in the paste roll is examined to see what effect it has on solder paste rheology, then we analyse in detail the process of paste withdrawal from a metal mask stencil and discuss those properties of solder paste that lead to a good print in terms of the size and shape of the solder paste particles, and their packing. In order to do this, we review some of the experiments and phenomena that have been shown to occur in dense suspensions, and see what aspects of that work are applicable to solder paste printing.     

碳化与氯盐复合作用下水泥浆体的微结构演变

为了阐明碳化与氯盐复合作用下硬化水泥浆体的微结构,基于X射线计算机断层扫描成像(X-CT)和电子探针微区分析(EPMA)技术探明了氯盐对水泥浆体碳化速率的影响,测定了碳化作用下水泥浆体内Cl、S和Na元素的浓度分布。结果表明:氯盐可细化养护龄期为28d的水泥浆体孔结构,提高其密实度并减缓碳化速度;碳化作用下水泥浆体的碳化区易出现裂缝,二氧化碳气体通过这些裂缝扩散到水泥浆体内部进行碳化,致使水泥浆体碳化深度不均匀;碳化过程中Cl、S和Na元素向非碳化区迁移和浓缩,初始均匀分布的元素在碳化区含量减少,在非碳化区含量升高。所得结论为混凝土结构耐久性设计提供科学的理论依据。     

表面贴装技术的工艺参数对共晶SnPb焊料与铜焊接界面的影响

采用扫描电镜与能谱分析方法,研究了表面贴装技术的工艺参数（包括恒温区保温时间、传送带速度、锡膏粘度和锡膏模板厚度等）对共晶SnPb焊料与铜焊接界面的影响.结果显示,表面贴装技术工艺参数并不明显影响焊接界面金属间化合物（IMCs）层的组成（IMCs层的主要成分为Cu6Sn5相）,但影响IMCs层的形貌,其中传送带速度会影响Cu6Sn5相的平均直径,而锡膏模板厚度与恒温区保温时间则对IMCs层的形态与厚度影响较大.     

丝网印刷nano-SiC薄膜阴极的电子特性的研究

研究了低成本大面积丝网印刷在玻璃衬底上均匀的纳米碳化硅(nano-SiC)薄膜的场致发射特性。提出了机械分散团聚的nano-SiC的方法,实验了适合导电玻璃衬底上制备nano-SiC薄膜的浆料配方,摸索导电玻璃衬底上nano-SiC薄膜的烧结工艺,研究了不同nano-SiC含量的薄膜的场发射特性,得到了最佳场致发射特性的配方比例。对样品进行微观分析和表征。具有稳定均匀场致发射性能的nano-SiC薄膜可作为显示器器件的阴极材料。     

Linking fresh and durability properties of paste to SCC mortar

In the last years many approaches to design SCC have been developed, but it remains a very complex process since it is necessary to manipulate several variables and understand their effects on concrete behaviour (fresh and hardened state). The prediction of concrete or mortar behaviour based on paste properties will be a significant contribution to simplify SCC design. With this purpose, two statistical experimental designs were carried out, one at paste level and the other at mortar level, to mathematically model the influence of mixture parameters on fresh and durability properties. The derived numerical models were used to define an area, labelled by self-compacting zone at paste level (SCZ), where fresh properties of the paste enable the design of SCC mortar. Furthermore, in order to extend this link to durability properties, the effect of including aggregate in cement paste was evaluated by means of the electrical resistivity test.     

微电子封装领域焊膏回流曲线的优化研究

对电子封装工业生产中无铅焊料的回流曲线工艺进行了研究,焊料的回流曲线影响界面处的金属间化合物的生成,通过引入加热因子开展研究,同时也进行了焊料的剪切强度实验用于评价封装的可靠性,研究结果表明:较厚的金属间化合物会降低焊球的剪切强度,而回流曲线的优化对焊料焊接的质量,可靠性有很强的实践意义.     

Implementation of the pin-in-paste process in a contract manufacturing environment

The pin-in-paste process was developed and validated for a contract manufacturing PCB assembly environment. A systematic approach was used to implement this process in a production environment. The sequence used for process development included solder paste volume calculations for through hole components (THCs), stencil aperture design for the pin-in-paste application, solder paste deposition through stencil printing, reflow profile development, inspection, and testing. A series of experiments were conducted to identify the 'process window' associated with each process step. The required volume of solder paste was computed using a set of empirical equations. The stencil printing process was 'optimized' using a 'design of experiments' based approach. Response surfaces were plotted and used to identify the 'optimal' print parameters. Thermal profiles were developed for reflow soldering the THCs in conjunction with the surface mount components (SMCs) in a single reflow pass. The assemblies were built using the 'optimized' process parameters. The assemblies were then inspected under an X-ray system to check for solder voiding. Electrical testing was then done to check for solder shorts and open connections. The shape of the solder joints was similar to a wave soldered joint, voiding was minimal, and there was no instance of solder shorts or an open connection. The solder joints were then cross-sectioned as a part of destructive testing. The cross sections showed the formation of good positive fillets (both top and bottom fillet), the solder paste had filled the plated through hole (PTH) completely, and voiding was minimal.