Device characteristics of the GaAs/InGaAsN/GaAs p-n-p doubleheterojunction bipolar transistor

We have demonstrated the dc and rf characteristics of a novel p-n-p GaAs/InGaAsN/GaAs double heterojunction bipolar transistor. This device has near ideal current-voltage (I-V) characteristics with a current gain greater than 45. The smaller bandgap energy of the InGaAsN base has led to a device turn-on voltage that is 0.27 V lower than in a comparable p-n-p AlGaAs/GaAs heterojunction bipolar transistor. This device has shown f_T and f_MAX values of 12 GHz. In addition, the aluminum-free emitter structure eliminates issues typically associated with AlGaAs     

Quantum-well resonant tunneling bipolar transistor operating at room temperature

The first resonant tunneling bipolar transistor (RBT) is reported. The AlGaAs/GaAs wide-gap emitter device, grown by molecular beam epitaxy (MBE), contains a GaAs quantum well and two AlAs barriers between the emitter and the collector. In the common emitter configuration, when the base current exceeds a threshold value, a large drop in the collector current (corresponding to a quenching of the current gain β) is observed at room temperature, along with a pronounced negative conductance as a function of the collector-emitter voltage. These striking characteristics are caused by the quenching of resonant tunneling through the double barrier as the conduction band edge in the emitter is raised above the bottom of the first quantized subband of the well. Single-frequency oscillations are observed at 300 K. The inherent negative transconductance of these new functional devices is extremely valuable for many logic and signal processing applications.     

High-frequency current oscillations in submicron bipolar structures

The current oscillations with frequency of the order of plasma frequency in the submicron GaAs bipolar diodes are obtained by Monte Carlo simulation. It is shown that current oscillations are the result of carrier bunching, which occurs due to either the two-stream instability or optical-phonon emission.     

The effects of heavy impurity doping on AlGaAs/GaAs bipolartransistors

The effects of heavy impurity doping on the electrical performance of AlGaAs/GaAs heterojunction bipolar transistors are examined. Electrical measurements of GaAs diodes and transistors demonstrate that the electron current injected into p⁺-GaAs is unexpectedly large. These results provide evidence for a large effective bandgap shrinkage in p⁺-GaAs. The results are presented in a form suitable for device modeling. For the heavy p-type doping commonly used in the base of an n-p-n AlGaAs/GaAs heterojunction bipolar transistor, the effective bandgap shrinkage is comparable in magnitude to the bandgap variation designed into the device by its compositional variation. Two examples demonstrate that such effects must be considered when analyzing or designing such devices     

Thermalelectro-feedback model for multi-emitter finger power heterojunction bipolar transistor. Part I: Temperature profile

Poor thermal conductivity of GaAs, a self-heating phenomenon which results in the rapid rise of device temperature, is the major factor that limits and even degrades the electrical performance of GaAs-based heterojunction bipolar transistor (HBT) operated at high power densities. On the basis of this consideration, a numerical model is presented to study the interaction mechanism between the thermal and electrical behavior of AlGaAs/GaAs HBT with multiple-emitter fingers. The model mainly comprises a numerical model applicable for multi-finger HBT that solves the three-dimensional heat transfer equation. The device design parameters that influence the temperature profile and current distribution of the device are identified, and optimization concerning the device performance is made.     

A study on the photoresponses in GaAs n-channel optical detectors

The behavior of photocarriers in a GaAs planar n-channel device as an optical detector is studied. Computer simulations show that space charges of those photogenerated carriers give rise to a high-gain and high-speed amplification mechanism which results in Gunn oscillations at intense irradiations. Experiments have confirmed these oscillations. The observed results agree with theoretical computations.     

An introduction to GaAs/GaAlAs HBTs for power applications

This paper presents a brief introduction to GaAs/GaAlAs heterojunction bipolar transistors (HBTs) for microwave and millimetre-wave power applications. The theoretical advantages of the heterojunction are outlined and the benefits of its incorporation in DC, RF and power devices are discussed. The problems inherent in the realization of HBTs in terms of device design, epitaxial material growth and device fabrication are discussed and the performance characteristics for practical devices presented. The paper concludes with a look at state-of-the-art GaAs/GaAlAs HBT performance and its standing with respect to the competing technologies of the metal semiconductor field effect transistor (MESFET) and the high electron mobility transistor (HEMT).     

Experimental observations of relaxation oscillator waveforms in GaAs from less than transit-time frequency to several times transit-time frequency

The purpose of this letter is to show that almost all microwave oscillations seen in GaAs, at all frequencies, can be completely accounted for by accumulation layer mode (LSA) operation of the device and therefore only dependent on the current peak-to-valley ratio and the circuit characteristics. The electric field and space charge configurations inside the device must be considered only when they may result in avalanche breakdown. This is true for oscillations even at or below the "transit" frequency.     

基于神经网络的GaAs HBT器件模型研究

建立精确的模型是使用砷化镓异质结双极晶体管器件（GaAs HBT）设计集成电路的必要基础,传统经验模型建立过程复杂,在输出功率、增益、功率附加效率等功率特性方面的模拟精度不太高,给电路设计带来了一定的难度。本文利用径向基函数(RBF)神经网络算法和反向传播(BP)神经网络算法分别建立GaAs异质结双极晶体管器件的大信号模型。这些模型的训练和测试数据分别来自于测试的双端口散射参数,以及测试的直流特性和功率特性数据。然后将模型数据与实测结果进行对比,结果发现,基于神经网络的器件模型能够精确地模拟器件特性,而且RBF神经网络模型相比BP神经网络模型,误差更小,预测更精确。     

Collector-up HBT's fabricated by Be+and O+ion implantations

A novel collector-up (C-up) GaAs/AlGaAs heterojunction bipolar transistor (HBT) has been developed and initial device results presented. This device has its extrinsic base defined by Be + and O + implantations. The combination of Be + / O + implantations and heat-pulse annealing is leading to a considerable reduction in the parasitic current and capacitance in the extrinsic base region. Improved device structure and performance expected from this device are discussed in detail.     

用于单片集成光接收机前端的GaAs基InP/InGaAs HBT

实现了一种可用于单片集成光接收机前端的GaAs基InP/InGaAs HBT。借助超薄低温InP缓冲层在GaAs衬底上生长出了高质量的InP外延层。在此基础上,只利用超薄低温InP缓冲层技术就在半绝缘GaAs衬底上成功制备出了InP/InGaAsHBT,器件的电流截止频率达到4.4GHz,开启电压0.4V,反向击穿电压大于4V,直流放大倍数约为20。该HBT器件和GaAs基长波长、可调谐InP光探测器单片集成为实现适用于WDM光纤通信系统的高性能、集成化光接收机前端提供了一种新的解决方法。     

AlGaAs/GaAs heterojunction bipolar transistors for power applications: issues of thermal effect and reliability

AlGaAs/GaAs heterojunction bipolar transistor (HBT) has the advantages of superior switching speed, wide linearity, and high current handling capability. As a result, the device has gained popularity in designing power amplifiers for RF and microwave applications. However, the high power in the HBT, together with the poor thermal conductivity of GaAs, gives rise to significant thermal effect and reduced reliability in such a device. This paper presents an overview on the simulation, modeling, and reliability of AlGaAs/GaAs HBTs. Emphasis will be placed on the effects of thermal–electrical interacting behavior on the dc and ac performance of the HBT. The thermal-induced degradation process in the HBT will also be addressed and analyzed.     

Comparison of heterostructure-emitter bipolar transistors (HEBTs) with InGaAs/GaAs superlattice and quantum-well base structures

The characteristics of InGaP/GaAs heterostructure-emitter bipolar transistors (HEBTs) including conventional GaAs bulk base, InGaAs/GaAs superlattice-base, and InGaAs quantum-well base structures are presented and compared by two-dimensional simulation analysis. Among of the devices, the superlattice-base device exhibits a highest collector current, a highest current gain and a lowest base–emitter turn-on voltage attributed to the increased charge storage of minority carriers in the InGaAs/GaAs superlattice-base region by tunneling behavior. The relatively low turn-on voltage can reduce the operating voltage and collector–emitter offset voltage for low power consumption in circuit applications. However, as to the quantum-well base device, the electrons injecting into the InGaAs well are blocked by the p⁺-GaAs bulk base and it causes a great quantity of electron storage within the small energy-gap n-type GaAs emitter layer, which significantly increases the base recombination current as well as degrades the collector current and current gain.     

Epitaxial GaAs p-n junction field-effect transistors

Structure and fabrication of single-gate GaAs p-n junction field-effect transistors is described. The devices employ n-type GaAs layers grown epitaxially on semi-insulating substrates of GaAs. Experimental devices indicate a cutoff frequency of approximately 2 GHz. Optimized device geometries promise operation at microwave frequencies as amplifiers and oscillators. Negative resistance oscillations above a field of approximately 3 × 10³V/cm have been observed.     

Sulfur passivation of semi-insulating GaAs: Transition from Coulomb blockade to weak localization regime

The sulfur passivation of the semi-insulating GaAs bulk (SI GaAs) grown in an excess phase of arsenic is used to observe the transition from the Coulomb blockade to the weak localization regime at room temperature. The I–V characteristics of the SI GaAs device reveal nonlinear behavior that appears to be evidence of the Coulomb blockade process as well as the Coulomb oscillations. The sulfur passivation of the SI GaAs device surface results in enormous transformation of the I–V characteristics that demonstrate the strong increase of the resistance and Coulomb blockade regime is replaced by the electron tunneling processes. The results obtained are analyzed within frameworks of disordering SI GaAs surface that is caused by inhomogeneous distribution of the donor and acceptor anti-site defects which affects the conditions of quantum- mechanical tunneling. Weak localization processes caused by the preservation of the Fermi level pinning are demonstrated by measuring the negative magnetoresistance in weak magnetic fields at room temperature. Finally, the studies of the magnetoresistance at higher magnetic fields reveal the h/2e Aharonov–Altshuler–Spivak oscillations with the complicated behavior due to possible statistical mismatch of the interference paths in the presence of different microdefects.     

GaAlAs/GaAs heterojunction bipolar phototransistors grown by LPE with a current gain of 50 000

A simple mesa GaAlAs/GaAs heterojunction bipolar phototransistor fabricated by LPE growth technique is presented. A high current gain of the order of 50 000 has been obtained and is believed to be the highest ever reported for a bipolar device. The corresponding high sensitivity is about 15 000 A/W for an 800 nm illumination wavelength.     

Variable Frequency Microwave and Convection Furnace Curing of Polybenzoxazole Buffer Layer for GaAs HBT Technology

Photosensitive polybenzoxazole (PBO) film has been used in GaAs heterojunction bipolar transistor (HBT) technology for stress buffer and mechanical protection layer applications. However, this film needs to be cured at high temperatures for a long period of time in order to obtain its desired excellent material characteristics. High-temperature curing can result in degradation to the electrical characteristics and performance of the underlying GaAs devices due to limited thermal budget. In this paper, we have characterized the effects of curing the PBO film on GaAs HBT wafers using a conventional convection furnace and using a variable frequency microwave (VFM) furnace. The results show that a VFM cure can achieve similar excellent physical, mechanical, thermal, and chemical material characteristics at a lower curing temperature and in a much shorter time, as compared to convection furnace curing, therefore resulting in minimal GaAs device degradation. Based on these results, an optimum curing condition using the VFM method can be obtained that satisfies both stress buffer layer material and device requirements for GaAs HBT technology.     

4.9-GHz low-phase-noise transformer-based superharmonic-coupled GaInP/GaAs HBT QVCO

The low-phase-noise GaInP/GaAs heterojunction bipolar transistor (HBT) quadrature voltage controlled oscillator (QVCO) using transformer-based superharmonic coupling topology is demonstrated for the first time. The fully integrated QVCO at 4.87GHz has phase noise of -131dBc/Hz at 1-MHz offset frequency, output power of -4dBm and the figure of merit (FOM) -198dBc/Hz. The state-of-the-art phase noise FOM is attributed to the superior GaInP/GaAs HBT low-frequency device noise and the high quality transformer formed on the GaAs semi-insulating substrate.     

异质结双极晶体管的能带设计

异质结双极晶体管(HBT)是一种新型的超高速、微波与毫米波半导体器件,可以有效地解决同质结双极晶体管中高速度与高放大的关系。本文以AlGaAs/GaAs npn HBT为例,讨论了HBT能带设计中的有关问题,并简要介绍了HBT的研究现状与发展方向。     

Low 1/f noise characteristics of AlGaAs/GaAs heterojunction bipolartransistor with electrically abrupt emitter-base junction

It is shown that the use of an electrically abrupt emitter-base junction considerably reduces the 1/f noise of self-aligned AlGaAs/GaAs heterojunction bipolar transistor (HBT). Although this device does not have depleted AlGaAs ledge passivation layer, the low-frequency noise spectra show a very low 1/f noise corner frequency of less than 10 kHz, which is much lower than previously reported value of about 100 kHz from conventional passivated or unpassivated AlGaAs/GaAs HBT's. Except for a residual generation-recombination (g-r) noise component, the noise power is comparable to that of Si BJT. It is also found that the low-frequency noise power of the AlGaAs/GaAs HBT is proportional to the extrinsic GaAs base surface recombination current square. Unlike the other HBT's reported, the noise sources associated with interface state and emitter-base (E-B) space charge region recombination are not significant for our device