文献与摘要（79）

PCB中埋入聚合物波导管的环境可靠性研究Investigation of Environmental Reliability of Optical Polymer Waveguides Embeddedon Printed Circuit Boards. 光学互联作为解决高频电信号互连的局限性的一种新技术,在可靠性方面的研究目前不多。文章通过将采用聚合物光导材料以及不同积层材料,不同结构制作的埋入光波导器件PCB,     

低损耗聚合物互连光波导的制备及性能测试

对应用于宽带光互连的光印刷电路板(OPCB)制备技术进行了研究。作为光互连系统的传输介质,我们研究了互连光波导的性能。基于紫外光刻技术,在常规PCB基底上制备了聚合物光波导,研究了光波导的制备流程以及工艺参数;并且通过不断优化工艺参数,制备得到了低损耗的光波导;通过测试光波导的传输损耗以及眼图,分析了光波导的性能。光波导在850nm波长条件下的传输损耗可以达到0.13dB/cm,实现了10Gbit/s光通信信号的传输。     

二氧化硅平面光波导器件的研究进展

二氧化硅平面光波导(PLC)器件以其低损耗、高工艺容差,以及与CMOS工艺兼容和与单模光纤模场匹配良好等优点,在光通信、光互连和集成光学中得到了广泛的应用.文章综述了二氧化硅平面光波导器件及其应用的进展,重点针对分束器、阵列波导光栅、可调光衰减器及其集成器件的最新研究进行了介绍,对未来发展趋势进行了展望.     

有机聚合物光波导制作工艺综述

有机聚合物光波导光互连已成为实现短距离计算通信设计目标的最佳解决方法。短距离光互连是未来互连方向,综合性能优良的聚合物多模光波导是光互连中的重要组成部分。有机聚合物光波导的制作工艺对光波导的性能具有重要影响,故此对有机聚合物光波导的制作工艺进行了综述,并提出了一些未来的研发方向。     

非线性有机物和聚合物在波导光互连中的应用研究

硅基底波导光互连技术具有可以充分利用成熟的半导体工艺,与VLSI电子器件工艺 相容好等特点,引起了人们极大的研究兴趣。近几年飞速发展的非线性有机物和聚合物因它们同无机材料相比具有潜在优越的光学和结构特性,用于波导光互连更显示出良好的发展前景。首先它们用于开关结构的设计,为波导光互连器件的动态控制提供了又一可能性,它涉及新工艺和理论两方面研究。其次有些有机物和聚合物的电光系数与铌酸锂的相当,有的甚至高出许多,它们在连续沉积薄膜时,其电光效应无明显的改变,制作的电光调制     

波分复用全光通信网中的光交叉互连技术

文章介绍了波分复用（WDM）技术全光网的结构及光交叉互连技术的概念，主要技术指标和功能，以及典型结构和工作原理。光交叉互连（OXC）结构和基于阵列波导光栅（AWG）的OXC结构的示意图也在文中给出。     

玻璃基片上双层多模光波导的制备

在光学玻璃基片上制作了双层掩埋式多模光波导芯片,这种芯片中的上、下两层光波导均通过熔盐离子交换和电场辅助离子迁移形成。对光波导的横截面以及输出光斑进行了观察,并进行了损耗和串扰测试。研究结果表明:双层多模光波导芯片中上、下两层光波导芯部横截面尺寸分别为29 m19 m和31 m20 m;两层波导的输出光斑尺寸相互匹配;两层波导传输损耗分别为1.000.32 dB/cm和0.780.35 dB/cm;两层光波导之间的串扰在17.7dB左右。这种玻璃基片上的双层多模光波导可以使板级光互连的互连密度增大一倍,提高EOCB的性能。     

光波导端面的准分子激光刻蚀技术研究

面向光印刷互连背板的应用需求,提出基于准分子激光消融原理对光波导的刻蚀技术进行研究,在背板上任意位置获得光波导端面实现光耦合。采用193 nm波长的准分子激光作为光源,通过方形掩模孔径投影在互连背板光波导上,研究了激光能量、激光脉冲次数与刻蚀深度、端面粗糙度等参量之间关系,通过刻蚀参数的优化,刻蚀后端面光耦合损耗增加量约1.3 d B。     

Si基芯片光互连研究进展

综述了近年来Si基光互连,尤其是和微电子工艺兼容程度较高的芯片间和芯片内的光互连的进展。Luxtera公司已经率先实现了除光源外的所有光子器件的单片集成,IBM也提出并开始实施微电子学领域的片内光互连的技术方案,但Si基光互连大部分还停留在各构建单元器件性能提高的阶段,例如Si基发光、Si波导、Si波导耦合器、Si基调制器及光开关、Si基探测器以及用于光波导器件阵列的WDM技术。此外,还对Si基光源、光纤耦合、偏振敏感性以及光子器件的热稳定性提出了看法。总之,随着各种构建单元器件的综合性能、CMOS工艺兼容度、制备成品率的提高以及光电融合单片集成工艺的突破,光互连最终会成为现实,并引发微电子技术和IC行业的下一场革命。     

光电路板技术研究进展及其应用

随着通信系统对传输速率的爆炸式增长,铜互连已经面临其发展瓶颈,光互连是实现Tbit/s量级高速互连的最优解决方案,其技术实现通常是将光波导集成到PCB中制成光电板。本文对光电板技术的研究进展进行了综述,并从关键技术、成本、可靠性等方面分析了光电板技术应用的可行性及限制条件,预测了该技术的发展前景。     

Optical interconnection using VCSELs and polymeric waveguidecircuits

We investigated the waveguide loss and transmission characteristics for optical interconnection using vertical-cavity surface-emitting lasers (VCSELs) and multimode polymeric waveguide circuits with crossings. The excess loss with 100 crossings is 2.2 dB when the image magnification from a VCSEL to a waveguide is 2.3. We obtained error-free (i.e., bit error rate <10^-11) optical interconnection at 1.0625 Gbps regardless of the number of crossings or the magnification. These results suggest the practicality of large-scale optical interconnection between VCSEL-based smart-pixel chips using multimode waveguides with more than 100 crossings     

Compact packaging of optical and electronic components for on-board optical interconnects

An optical interconnection plate was developed in order to achieve a compact and cost-effective interconnection module for an optical data link between chips on printed circuit boards. On the silica substrate, transmission lines and solder bumps are formed on the top surface of the substrate, and polymer waveguide array with 45/spl deg/ mirror planes is formed on the back side. This optical interconnection plate technique makes the alignment procedure quite simple and economical, because all the alignment steps between the optical components can be achieved in wafer processes and a high accuracy flip-chip bonding technique. We confirmed the sufficiently high coupling efficiency and low optical crosstalk using the simplified experimental setup. Flip-chip bonding of the vertical-cavity surface-emitting laser and photodiode arrays on the top surface of the optical interconnection plate was performed using indium bumps in order to avoid thermal damage of the polymer waveguide. The fully packaged optical interconnection plate showed an optical data link at rates of 455 Mb/s. Improvement of the mirror surface roughness and the mirror angle accuracy could lead to an optical link at higher rates. In addition, the interconnection system can be easily constructed by inserting the optical interconnection plate between the processing chips or data lines requiring optical links.     

Pluggable Optical Board Interconnection System With Flexible Polymeric Waveguides

Pluggable optical board interconnection system using flexible optical waveguide for direct-coupling to reduce the transmission loss is proposed and demonstrated. For the direct coupling between waveguides of boards, we use optical plug and adaptor with flexible polymeric waveguide and guide pins. Flexible polymeric optical waveguide is fabricated using hot embossing technique. Eye pattern and jitter characteristics of the backplane system is presented at 10 Gb/s.     

Optoelectronic Package Having Low-Loss Optical Waveguide Hole With Core–Clad Structure for Chip-to-Chip Interconnection

We have developed optoelectronic packages having optical waveguide holes with core–clad structures for chip-to-chip optical interconnection within computer systems. A rate of 10-Gb/s/ch chip-to-chip optical signal transmission has been demonstrated. The optoelectronic package we have developed consists of two guide pins and four-channel optical waveguide holes. The two guide pins are used to align an optical fiber connector with an optical device. The optical waveguide holes are used to transmit optical signals vertically through the optoelectronic package. Using the optical waveguide holes in the optoelectronic package, and high-quality signal transmission has been achieved.      

Experiment on deflector-selector optical switch matrix

An electro-optic switch matrix composed of planar waveguide (free-space) interconnection and deflectors is proposed. The architecture offers one solution for the interconnection problem imposed on an optical switch matrix.<>     

A novel deposit/spin waveguide interconnection (DSWI) for semiconductor integrated optics

We propose an efficient and simple optical interconnection between active semiconductor components by deposition and spin coating. Details of the waveguide design, the fabrication technique, and a promising material combination are given. Experimental results with an integrated laser-polyimide/SiOx(x sim 2) waveguide combination demonstrate low-threshold (2.0 kA/cm²) laser operation and a low-loss waveguide interconnection (81 percent coupling efficiency) on a GaInAsP/InP chip.     

有机聚合物光波导的研制

聚合物光电子器件是目前世界范围的一个研究热点,其本身所具有易于集成、响应快速、成本低廉一系列优点,在光通信方面有广泛的和极具吸引力的应用前景。介绍了制作有机聚合物光波导的工艺流程,并用两种方法制备出有机聚合物光波导。这对后续研究有很大的帮助。     

Integration of optical interconnects and optoelectronic elements on wafer-scale

The UV-reaction molding technology enabling for the fabrication of microoptical elements with rectangular, triangular or circular cross-sections (waveguides, prisms, lenses) in optical polymers is described. Multimode waveguide optical interconnects, coupling prisms and holding structures for fibers can be fabricated in one step. A three-dimensional monomode waveguide interconnection module is presented. Stability tests of the microoptical elements are reported.     

Fully embedded board-level guided-wave optoelectronic interconnects

A fully embedded board-level guided-wave optical interconnection is presented to solve the packaging compatibility problem. All elements involved in providing high-speed optical communications within one board are demonstrated. Experimental results on a 12-channel linear array of thin-film polyimide waveguides, vertical-cavity surface-emitting lasers (VCSELs) (42 μm), and silicon MSM photodetectors (10 μm) suitable for a fully embedded implementation are provided. Two types of waveguide couplers, titled gratings and 45° total internal reflection mirrors, are fabricated within the polyimide waveguides. Thirty-five to near 100% coupling efficiencies are experimentally confirmed. By doing so, all the real estate of the PC board surface are occupied by electronics, and therefore one only observes the performance enhancement due to the employment of optical interconnection but does not worry about the interface problem between electronic and optoelectronic components unlike conventional approaches. A high speed 1-48 optical clock signal distribution network for Cray T-90 super computer is demonstrated. A waveguide propagation loss of 0.21 dB/cm at 850 nm was experimentally confirmed for the 1-48 clock signal distribution and for point-to-point interconnects. The feasibility of using polyimide as the interlayer dielectric material to form hybrid three-dimensional interconnects is also demonstrated. Finally, a waveguide bus architecture is presented, which provides a realistic bidirectional broadcasting transmission of optical signals. Such a structure is equivalent to such IEEE standard bus protocols as VME bus and FutureBus