A lifetime-aware analog circuit sizing tool

Reliability of CMOS circuits has become a major concern due to substantially worsening process variations and aging phenomena in deep sub-micron devices. As a result, conventional analog circuit sizing tools have become incapable of promising a certain yield whether it is immediately after production or after a certain period of time. Thereby, analog circuit sizing tools have been replaced by better ones, where reliability is included in the conventional optimization problem. Variation-aware analog circuit synthesis has been studied for many years, and numerous methodologies have been proposed in the literature. On the other hand, to our best knowledge, there has not been any tool that takes lifetime into account during the optimization. Besides, there are a number of different issues with lifetime-aware circuit optimization. For example, aging analysis is still quite problematic due to modeling and simulation deficiencies. Furthermore, a challenging trade-off between efficiency and accuracy is revealed during lifetime estimation in the optimization loop. Relatively expensive aging analysis is carried out for each candidate solution corresponding to a large number of simulations, so it is extremely important to deal with this trade-off. With regard to aforementioned these problems, this study proposes a novel lifetime-aware analog circuit sizing tool, which utilizes a novel deterministic aging simulator with adjustable step size. Hot Carrier Injection (HCI) and Negative Bias Temperature Instability (NBTI) mechanisms are considered during the lifetime analysis, where the NBTI model was developed via accelerated aging experiments through silicon data. As case studies, two different OTA circuits are synthesized and results are provided to discuss the proposed tool.     

Statistical lifetime reliability optimization considering joint effect of process variation and aging

Aging effect degrades circuit performance in the runtime, interacts with fabrication-induced device parameter variation, and thus posing significant impact on circuit lifetime reliability. In this work, a statistical circuit optimization flow is proposed to ensure lifetime reliability of the manufactured chip in the presence of process variation and aging effects. It exploits a variation-aware gate-level statistical aging degradation model to characterize circuit lifetime reliability, identifies a set of worst duty cycles on the inputs of statistically critical gates to estimate the worst delay degradations on these gates. Based on the delay degradation information, statistical gate sizing is performed which enables the manufactured chip to satisfy lifetime reliability constraint in term of low area overhead.     

Reliability assessment of CMOS differential cross-coupled LC oscillators and a novel on chip self-healing approach against aging phenomena

In this paper, reliability of CMOS differential cross-coupled LC oscillators is examined, and a novel on chip aging detection and healing technique is developed to increase the lifetime of oscillator circuits. Aging causes degradation in several transistor parameters, such as threshold voltage, mobility, and transconductance. While these changes cause irregular timing characteristics and increased power consumption in digital circuits, the case is quite different for their analog counterparts. Analog circuits, especially nonlinear ones, show more deviations at the output due to parameter changes. In order to evaluate the aging effects on nonlinear analog circuits, two different oscillator structures (n-type and p-type) with 5 GHz oscillation frequency were designed using 0.13 μm technology. The phase noise analysis of fresh and aged oscillators was performed analytically and through simulations. Based on these analyses the robustness of oscillators was discussed. Finally, an on chip aging sensor and self recovery mechanism are proposed to increase the robustness of the CMOS LC oscillators.     

Operational-amplifier compilation with performance optimization

A method for designing analog circuits in which topological design is followed by simultaneous device sizing and layout design is described. By merging circuit and layout design into a single design process, analog circuits can be optimally designed taking layout parasitics fully into account. Using the method, a CMOS operational-amplifier compiler (OAC) has been developed. Given a set of performance specifications and process parameters, OAC generates a layout with circuit performance optimized to meet specified performance constraints. A procedural layout technique is employed to generate a compact and practical layout. A nonlinear optimization method for device sizing which relies on the results of simulations based on the circuit extracted from the layout is applied. Design experiments have shown that OAC can produce satisfactory results with respect to both circuit performance and layout density     

Enhanced analog “yields” cost-effective systems-on-chip

As device feature sizes of analog MOS circuits are reduced to the deep-submicron ranges, the effect of process variability on circuit performance and reliability is magnified. Yield is becoming more and more critical and statistical methods are required to simulate the effect of process variability to enable circuit designers to “design-in” quality through circuit robustness. More work is needed particularly in the areas of modeling and statistical CAD of submicron, low-voltage mixed-signal ICs. The characterization work needed to tune models to specific VLSI technology, implementation into the SPICE and APLAC simulators, and use in design and optimization of analog and digital VLSI circuits     

Variability aware SVM macromodel based design centering of analog circuits

Design centering is the term used for a procedure of obtaining enhanced parametric yield of a circuit despite the variations in device and design parameters. The process variability in nanometer regimes manifest into variations in these devices and design parameters. During design space exploration of analog circuits, a methodology to find design-instances with better yield is necessitated; this would ensure that the circuit will function as per specifications after fabrication, even with impact of statistical variations. We need to evaluate circuit performance for a given instance of a circuit-design identified by possessing a set of nominal values of device-design parameters. A lot of instances need be searched, having different sizes for a given circuit topology. HSPICE is very compute intensive. Instead, we employ macromodeling approach for analog circuits based on support vector machine (SVM), which enables efficient evaluation of performance of such circuits of different sizing during yield optimization loops. These performance macromodels are found to be as accurate as SPICE and at the same time, time-efficient for use in sizing of analog circuits with optimal yield. Process variability aware SVM macromodels are first trained and then used inside the Genetic algorithm loops for design centering of different circuits, subsequently resulting into sized-circuit instances having optimal yield. Post design centering, the sized circuits will be able to provide functions as per specifications upon fabrication. The application of this design centering approach as process variability analysis tool is illustrated on various circuits e.g. two stage op amp, voltage controlled oscillator and mixer circuit with layouts drawn into 90?nm UMC technology (Euro-practice).     

Automatic layout synthesis of analog ICs using circuit recognition and constraint analysis techniques

A systematic method for automatic layout synthesis of analog integrated circuit modules is presented. This method uses analog circuit recognition and critical net analysis techniques to derive proper layout constraints for analog circuit performance optimization. These layout constraints are analyzed and prioritized according to the recognized analog circuit topologies and classified net sensitivities. The weighted constraints are then used to drive the physical layout generation process to obtain a high-quality custom circuit layout. An efficient, constraint-driven analog floorplanning technique based on a zone-sensitivity partitioning algorithm is specially developed to generate a slicing floorplan incorporating the layout constraints. This layout synthesis approach has three key advantages. First, it can produce a satisfactory analog circuit performance with negligible degradation due to the layout-introduced parasitic effects. Second, it allows a complete automation for netlist-to-layout synthesis so that the layout tool can be used by VLSI system designers. Finally, this method is quite general and can be applied to handle a wide variety of analog circuits. Experimental results in CMOS operational amplifiers and a comparator are presented.     

Automated hierarchical CMOS analog circuit stack generation withintramodule connectivity and matching considerations

An efficient automated layout for CMOS transistors in analog circuits is described. The matching requirements are used as the primary constraint on the analog layout; however, parasitic capacitances and area considerations are also included. A designer-chosen arbitrary circuit partition from the schematic can be used to generate the corresponding layout as an optimum stack of transistors with complete intramodule connectivity. The transistor stack generation is performed by representing the circuit with a diffusion graph and recursively fragmenting the graph until the base constructs are reached. For each of the modules, the port structures are also created. These port structures are considered as part of the module area and parasitic optimization procedure. With aspect-ratio-related constraints, the procedure allows optimal floorplanning. The results are demonstrated through several examples     

A novel high-throughput method for table look-up based analog design automation

Analog circuit synthesis ofen requires repeated evaluations of circuit under design to reach the final design goals. Circuit simulations using SPICE can provide accurate assessment of circuit performance. Spice simulations are costly and incur significant overhead. A faster transistor-level evaluation is needed to provide higher throughput for synthesis applications. Further, miniaturization of FET’s has added physical effects into SPICE models, which complicated their equations with every generation. That complication has forced analog synthesis tool developers and circuit designers alike to perform circuit evaluations using SPICE.Analog circuit design tools largely failed in their declared goal, to take over circuit optimization tasks from human designers mainly due to over simplications using custom-developed equations for evaluating circuit performance. Since it is more and more difficult to accurately capture transistor behavior with each new generation of silicon technology, a more practical approach to analog design automation is to keep human engineers at the center of the design flow by providing them with as much needed decision-supporting data as quickly as possible. Mapping the trade-off landscape of a topology with respect to design specifications, for example, can save designers trial and error time. This approach to analog design automation requires less accuracy from the simulation sign-off tools, such as SPICE. However, it demands much faster response for circuit performance evaluations with sufficient accuracy.In this paper, a new solution to both calculation overheads and model complexity is proposed. The proposed fast evaluation method uses a novel look-up table (LUT) algorithm to extract circuit information from complex physics-based transistor models used by SPICE. The model makes use of contemporary memory space, by replacing equations with look-up tables in addition to advanced interpolation methods. The achieved improvement is over 100× throughput and complete decoupling from physical phenomena compared to SPICE run-time, in exchange for few gigabytes of data per device. Examples are shown for the effectiveness of replacing SPICE with our model in a transistor sizing flow, while keeping 99% of the samples inside the 5% error range on 180 nm and 40 nm CMOS processes. The proposed solution is not intended to replace sign-off quality tools, such as SPICE. Rather, it is intended to be used as a fast performance evaluator in analog design automation flows.     

Measuring the uniqueness and variety of analog circuit design features

Analog circuit design activity is currently a less formalized process, in which the main source for innovation is the designer's ability to produce new designs by combining basic devices, sub-circuits, and ideas from similar solutions. There are few systematic methods that can fuse and transform the useful features of the existing designs into new solutions. Moreover, most automated circuit synthesis tools are still limited to routine tasks, like transistor sizing and layout design. Developing new design techniques that can combine the existing design features requires metrics that describe the uniqueness and variety of the features. This paper evaluates for analog circuits two such general-purpose metrics proposed in [1] and [2]. Three case studies are discussed on using the metrics to characterize the design features of current mirrors, transconductors, and operational amplifiers. The two metrics and the presented study is useful in producing an overall characterization of analog circuit features. This can help in enhancing the circuit design process, training of young designers, and developing new automated synthesis tools that can explore more solution space regions that are likely to include novel design features.     

Design considerations for CMOS digital circuits with improvedhot-carrier reliability

The hot-carrier induced degradation of the transient circuit performance in CMOS digital circuit structures is investigated and modeled. Delay-time degradation as a result of transistor aging, as opposed to current degradation, is devised as a more realistic measure of long-term circuit reliability. It is shown that for a wide class of circuits, the performance degradation due to dynamic hot-carrier effects can be expressed as a function of the nMOS and pMOS transistor channel widths, and the output load capacitance. In addition, the influence of the parasitic gate-drain overlap capacitance and the resulting drain voltage overshoot upon aging characteristics is investigated. The degradation of tapered (scaled) inverter chains is modeled, and a simple design guideline based on the scaling factor (F) and the transistor aspect ratio (τ) is presented for the improvement of long-term reliability in scaled buffer structures with respect to hot-carrier induced device aging. Also, a number of simple design rules based on device geometry, circuit topology and power supply voltage are presented to ensure hot-carrier reliability     

Analysis of aging effects - From transistor to system level

Due to shrinking feature sizes in integrated circuits, additional reliability effects have to be considered which influence the functionality of the system. These effects can either result from the manufacturing process or external influences during the lifetime such as radiation and temperature. Additionally, modern technology nodes are affected by time-dependent degradation i.e. aging.Due to the age-dependent degradation of a circuit, processes on the atomic scale of the semiconductor material lead to charges in the oxide silicon interface of CMOS devices, altering the performance parameters of the device and subsequently the behavior of the circuit. With the continuous downscaling of modern semiconductor technologies, the impact of these atomic scale processes affecting the overall system characteristics becomes more and more critical. Therefore, aging effects need to be assessed during the design phase and actions have to be taken guaranteeing the correct system functionality throughout a system's lifetime.This work presents methods to investigate the influence of age-dependent degradation as well as process-variability on different levels. An operating-point dependent sizing methodology based on the g_m/I_D-method extended to incorporate aging, which aims at developing aging-resistent circuits is presented. Additionally, the sensitivity of circuit performances in regard to aging can be determined. In order to investigate the reliability of a complex system on behavioral level, a modeling method to represent the performance of system components in dependence of aging and process variability is introduced.     

A fault detection sensor for circuit aging using double-edge-triggered flip-flop

In nanoscale technology, transistor aging is one of the most critical problems that impact on the reliability of circuits. Aging sensor is a good online way to detect the circuit aging, which performs during the operating time with no influence of the normal operation of circuits. In this paper, a Double-edge-triggered Detection Sensor for circuit Aging (DSDA) is proposed, which employs data signal of logic circuits as its clock to control the sampling process. The simulation is done by Hspice using 45 nm technology. The results show that this technique is not sensitive to the process variations. The worst case of the detection precision is more than 80% under the different process variations. It can detect aging fault effectively with the 8% power cost and 30% performance cost.     

Contemporary CMOS aging mitigation techniques: Survey,taxonomy, and methods

The proposed paper addresses the overarching reliability issue of transistor aging in nanometer-scaled circuits. Specifically, a comprehensive survey and taxonomy of techniques used to model, monitor and mitigate Bias Temperature Instability (BTI) effects in logic circuits are presented. The challenges and overheads of these techniques are covered through the course of this paper. Important metrics of area overhead, power and energy overhead, performance overhead, and lifetime extension are discussed. Furthermore, the techniques are assessed with regards to ease of implementation and the ability to cope with challenges such as increase in manufacturing induced process variations. Finally, a taxonomy of the surveyed techniques is presented to facilitate generalization of the discussed approaches and to foster new inspiring techniques for this important reliability phenomenon leading to advancements in the design of defect-tolerant digital circuits.     

Application of swarm intelligence techniques to the design of analog circuits: evaluation and comparison

Swarm intelligence (SI) techniques are more and more used by analog designers in order to optimally size their circuits/systems’ performances. A particular interest is accorded to the multi-objective algorithms due to the fact that in most cases analog, mixed signal and radio-frequency sizing problems encompass at least two non-commensurable conflicting objectives. In most of the published papers, Pareto fronts are provided, and in the best cases they are compared to the tradeoff fronts obtained using other classical metaheuristics, but in a very subjective way. In this paper we present a comparison that deals with the multi-objective optimal design of analog circuits via the SI technique and other famous metaheuristics. Performance metrics are used to compare the obtained results. The paper argues and shows that SI techniques and particularly the particle swarm optimization technique is a priori the most adequate metaheuristic to use in the field of analog circuit sizing.     

Process Variation-Aware Timing Optimization for Dynamic and Mixed-Static-Dynamic CMOS Logic

The advancement in CMOS technology with the shrinking device size towards 32 nm has allowed for placement of billions of transistor on a single microprocessor chip. Simultaneously, it reduced the logic gate delays to the order of pico seconds. However, these low delays and shrinking device sizes have presented design engineers with two major challenges: timing optimization at high frequencies, and minimizing the vulnerability from process variations. Answering these challenges, this paper presents a process variation-aware transistor sizing algorithm for dynamic CMOS logic, and a process variation-aware timing optimization flow for mixed-static-dynamic CMOS logic. Through implementation on several benchmark circuits, the proposed transistor sizing algorithm for dynamic CMOS logic has demonstrated an average performance improvement in delay by 28%, uncertainty from process variations by 32%, while sacrificing an area of 39%. Also, through implementation on benchmark circuits and a 64-b parallel binary adder, the proposed timing optimization flow for mixed-static-dynamic CMOS logic has demonstrated a performance improvement in delay by 17% and uncertainty from process variations by 13%.      

Performance-reliability trade-offs in short range RF power amplifier design

In this work, trade-offs between performance and reliability in CMOS RF power amplifiers at the design stage are studied. The impact of transistor sizing, amplifier class and on-chip matching network design are explored for a 130 nm technology and the implications of design decisions in transistor gate oxide reliability are discussed and projected. A strong trade-off is observed between efficiency and reliability, mainly for different on-chip output matching architectures. A comparison between two example designs is performed via SPICE simulations that include reliability models and the effects of aging on the stress conditions of each amplifier.     

基于Pareto支配的MPRM电路面积与可靠性优化

针对MPRM（Mixed-Polarity Reed-Muller）电路的面积与可靠性折中优化问题,在逻辑级建立面积估算模型以及电路SER（Soft Error Rate）解析评价模型,并采用Pareto支配概念对MPRM电路进行面积与可靠性多目标优化.通过对MPRM电路的XOR部分进行树形异或门分解,并考虑多个输出之间异或门的共享,建立面积估算模型.采用信号概率和故障传播方法,并考虑电路中的逻辑屏蔽因素以及信号相关性,建立电路SER解析评价模型.根据所提出的面积和SER评价模型,采用极性向量的格雷码序穷举搜索MPRM的极性空间得到MPRM电路面积与可靠性的Pareto最优解集,并使用效率因子技术指标选取最终解.MCNC基准电路的实验结果表明,与面积最小MPRM电路相比,所选取的MPRM电路可以在较小面积开销的前提下获得较高电路可靠性.