A low power 48-dB/stage linear-in-dB variable gain amplifier for direct-conversion receivers

In this paper, a low power Variable Gain Amplifier (VGA) circuit with an approximation to exponential gain characteristic is presented. It is achieved using current mirrors to generate appropriate current signals to bias the input stage of the VGA circuit working in triode region, and the output stage working in saturation region, respectively. The VGA circuit presented herein comes with a 549 μW maximum power consumption given a 1.8 V supply. Most important of all, it has a linear-in-dB 48-dB dynamic gain range per stage. The effect of the input trasconductance and the output resistance on the linearity of gain control is also discussed. This circuit is fabricated using a 0.18 μm standard CMOS process with a core area of 0.0045 mm².     

An inductorless wideband common-gate LNA with dual capacitor cross-coupled feedback and negative impedance techniques

A wideband common-gate (CG) low-noise amplifier (LNA) with dual capacitor cross-coupled (CCC) feedback and negative impedance techniques is presented for multimode multiband wireless communication applications. Double CCC technique boosts the input transconductance of the LNA, and low power consumption is obtained by using current-reuse technique. Negative impedance technique is employed to alleviate the correlation between the transconductance of the matching transistors and input impedance. Meanwhile, it also allows us to achieve a lower noise figure (NF). Moreover, current bleeding technique is adopted to allow the choice of a larger load resistor without sacrificing the voltage headroom. The proposed architecture achieves low noise, low power and high gain simultaneously without the use of bulky inductors. Simulation results of a 0.18-μm CMOS implementation show that the proposed LNA provides a maximum voltage gain of 25.02 dB and a minimum NF of 2.37 dB from 0.1 to 2.25 GHz. The input-referred third-order intercept point (IIP3) and input 1-dB compression point (IP_1dB) are better than –7.8 dBm and –19.2 dBm, respectively, across the operating bandwidth. The circuit dissipates 3.24 mW from 1.8 V DC supply with an active area of 0.03 mm².     

A 0.1–1 GHz low power RF receiver front-end with noise cancellation technique for WSN applications

A low power 0.1–1 GHz RF receiver front-end composed of noise-cancelling trans-conductor stage and I/Q switch stage was presented in this paper. The RF receiver front-end chip was fabricated in 0.18 µm RF CMOS. Measurement results show the receiver front-end has a conversion gain of 28.1 dB at high gain mode, and the single-sideband (SSB) noise figure is 6.2 dB. In the low gain mode, the conversion gain of the receiver front-end is 15.5 dB and the IP1dB is −12 dBm. In this design, low power consumption and low cost is achieved by current-reuse and inductor-less topology. The receiver front-end consumes only 5.2 mW from a 1.8 V DC supply and the chip size of the core circuit is 0.12 mm².     

Feed-forward Output Swing Prediction AGC design with Parallel-Detect Singular-Store Peak Detector

This paper presents an Automatic Gain Control (AGC) circuit design with 200–530 μW average power consumption given a 1 V supply. The Variable Gain Amplifier (VGA) therein comes with 0.9 V input range and output stages with a swing of 0.9 V and a minimum bandwidth of 100 MHz. Feed-forward Output Swing Prediction is used to adjust the gain of the VGA corresponding to the signal envelope detected by a Parallel-Detect Singular-Store Peak Detector. At a maximum refresh-rate of 4 MHz, the AGC is capable of adjusting the gain of the VGA within less than 250 ns when the input signal envelope is reduced by 20 dB, and 100 ns when raised by 20 dB. The circuit design is carried out using a 0.18 μm standard CMOS process with a core area of 0.0024 mm².     

A mixed-signal pulse width modulator for portable SMPS applications

This paper presents a design for a mixed-signal pulse width modulator (MSPWM) integrated circuit that targets the digital control of high-frequency switched-mode DC–DC power supplies (SMPS). Previous designs consider digital pulse width modulators (DPWM) implementations that encounter important design issues, such as power consumption, non-linearity, layout dependency, trimming capability and temperature dependency. This work presents effective solutions, suitable for large-scale production of ICs, since it combines high-precision, high-linearity and temperature-independent standard analog circuits, which are commonly offered by the semiconductor industry, with the simplicity and reuse of digital PID compensation as input. The 8-bit prototype designed for a 0.18-μm CMOS process operates at switching frequency of 2 MHz, draws only 96.25 μA from a 1.8 V supply and takes 0.029 mm², including the non-overlapping control logic of SMPS power devices.     

A low power and small area digital self-calibration technique for pipeline ADC

A digital self-calibration implementation with discontinuity-error and gain-error corrections for a pipeline analog-to-digital converter (ADC) is presented. In the proposed calibration method, the error owing to each reference unit capacitor of the multiplying D/A converter is measured separately using a calibration capacitor and an enhanced resolution back-end pipeline ADC acting as an error quantizer. The offset and finite open loop DC-gain of the operational amplifier and capacitor mismatches, the reference voltage mismatch can all be calibrated. The calibration can be achieved by that only used addition and subtraction. Hence, it needs low power and area consuming. A prototype ADC with the proposed calibration was fabricated on a 0.5 μm double-poly triple-metal CMOS process. The power consumption and area of the calibration circuit are only 10.1 mW and 1.05 mm², respectively. At a sampling rate of 30 MS/s, the calibration improves the DNL and INL from 2.59 LSB and 14.98 LSB to 0.72 LSB and 1.82 LSB, respectively. For a 1.25 MHz sinusoidal signal, the calibration improves the signal-to-noise-distortion ratio and spurious-free dynamic range from 43.1 dB and 52.1 dB to 75.51 dB and 83.61 dB, respectively. The 12.25 effective number of bits at 30 MS/s ADC consumes a total power of 136 mW.     

New EEPROM concept for single bit operation

A new 0.56 μm² dual-gate EEPROM transistor is presented in this paper. To optimize the cell layout, a new model based on previous work has been developed. This concept allows single bit memory operations with high density; new cell programming conditions has been defined to optimize electrical behavior. Concept has been validated in an EEPROM standard technology from STMicroelectronics and allows a cell area reduction of above 50%. With appropriate potentials, the cell produces a programming window of 4 V. Moreover, this dual-gate transistor in static mode becomes an adjustable threshold voltage transistor which can be used in logic circuit or RFID applications.     

Voltage reference architectures for low-supply-voltage low-power applications

This paper presents a voltage reference generator architecture and two different realizations of it that have been fabricated within a standard 0.18 μm CMOS technology. The architecture takes the advantage of utilizing a sampled-data amplifier (SDA) to optimize the power consumption. The circuits achieve output voltages on the order of 190 mV with temperature coefficients of 43 ppm/°C and 52.5 ppm/°C over the temperature range of 0 to 120°C without any trimming with a 0.8 V single supply. The power consumptions of the circuits are less then 500 nW while occupying an area of 0.2 mm² and 0.08 mm², respectively.     

Low power high gain CMOS LNA based on inverter cell and self-body bias for UWB receivers

A low-power low-noise amplifier (LNA) utilized a resistive inverter configuration feedback amplifier to achieve the broadband input matching purposes. To achieve low power consumption and high gain, the proposed LNA utilizes a current-reused technique and a splitting-load inductive peaking technique of a resistive-feedback inverter for input matching. Two wideband LNAs are implemented by TSMC 0.18 μm CMOS technology. The first LNA operates at 2–6 GHz. The minimum noise figure is 3.6 dB. The amplifier provides a maximum gain (S₂₁) of 18.5 dB while drawing 10.3 mW from a 1.5-V supply. This chip area is 1.028×0.921 mm². The second LNA operates at 3.1–10.6 GHz. By using self-forward body bias, it can reduce supply voltage as well as save bias current. The minimum noise figure is 4.8 dB. The amplifier provides a maximum gain (S₂₁) of 17.8 dB while drawing 9.67 mW from a 1.2-V supply. This chip area is 1.274×0.771 mm².     

A 1 V, 69–73 GHz CMOS power amplifier based on improved Wilkinson power combiner

A 1 V, 69–73 GHz CMOS power amplifier based on improved Wilkinson power combiner is presented. Compared with the traditional one, the proposed Wilkinson power combiner could lower down the insertion loss and reduce the die area by eliminating the quarter-wavelength transmission lines while preserving the characteristics of Wilkinson power combining and good port isolation. The presented power amplifier has been implemented in 65 nm CMOS process and achieves a measured saturated output power of 10.61 dBm and a peak power added efficiency of 8.13% at 73 GHz with only 1 V power supply. The die area including pads is 1.23×0.45 mm², while the power combiner only occupies 200×80 μm².     

Low-power MicroVrms noise neural spike detector for implantable interface microsystem device

In this paper, an ultra-low-power and low-noise spike detector is proposed for massive integration in the implantable multichannel brain neural recording device. The detector circuit with nonlinear energy operator (NEO) algorithms achieves the spike detecting from action potential including complex noise. The spike detector circuit consists of a differentiator with a fully-differential structure and a multiplier based on CMOS translinear using sub-threshold technique. The differentiator has the steepness of a transmission function with frequency +20 dB/dec, frequency response from 10 Hz to 10.5 kHz. The linear range of multiplier is from −0.9 V to 0.9 V at V_DD = ±1.65 V. The spike detector is implemented in 0.35 μm technology with fully-CMOS process. One detector die size is 0.0187 mm² and its total current consumption of 825 nA. As is demonstrated by measured results, the proposed circuit has detected the instantaneous energy of the input real spike signals well, which the noise of small than 218 μV_rms over a nominal bandwidth of 500–10.5 kHz.     

Dual-resonance concurrent oscillator

This paper studies a new dual-band CMOS class-C voltage-controlled oscillator (VCO). The oscillator consists of a dual-resonance LC resonator in shunt with two pairs of capacitive cross-coupled nMOSFETs. The proposed oscillator has been implemented with the TSMC 0.18 μm CMOS technology, and it shows a frequency tuning range with two frequency bands and a small tuning hysteresis is measured. The oscillator can generate differential signals at 2.4 GHz and 6.9 GHz and it also can generate concurrent frequency oscillation while the circuit is biased around the bias with frequency tuning hysteresis. With the supply voltage of V_DD = 1.1 V, the VCO-core current and power consumption of the oscillator are 2.90 mA and 3.19 mW, respectively. The die area of the class-C oscillator is 0.9 × 0.97 mm². Overvoltage stress is applied to the oscillator, measurement indicates the concurrent oscillation is sensitive to overvoltage stress.     

A low power current controllable single-input three-output current-mode filter using MOS transistors only

A novel circuit configuration for the realization of low power single-input three-output (SITO) current mode (CM) filters employing only MOS transistors are presented. The proposed circuit can realize low-pass (LP), band-pass (BP) and high-pass (HP) filter functions simultaneously at three high impedance outputs without changing configuration. Despite the other previously reported works, the proposed circuit is free from resistors and passive capacitors. Instead of passive capacitors; the gate-source capacitor of MOS transistor is used making the proposed circuit ideally suitable for integration. Compared to other works, the proposed filter has also the lowest number of transistors and lowest power consumption. The proposed circuit exhibits low-input and high-output impedances, which is highly desirable for cascading in CM signal processing. Moreover, it is center frequency can be electronically adjusted using a control current without a significant effect on quality factor (Q) granting it the highly desirable capability of electronic tunability. Transfer functions of the LP, BP and HP outputs are derived and the performance of the proposed circuit is proved through pre layout and post layout simulations at supply voltage of 1.8 V and using 0.18 μm CMOS process parameters. The power consumption and the required chip area are only 0.5 mW and 77.4 μm × 70.2 μm, respectively.     

Sub-1 V,pico-watt subthreshold CMOS voltage reference circuit with dual temperature compensation

A pico-watt CMOS voltage reference is developed using an SK Hynix 0.18 µm CMOS process. The proposed architecture is resistorless and consists of MOSFET circuits operated in the subthreshold region. A dual temperature compensation technique is utilized to produce a near-zero temperature coefficient reference output voltage. Experimental results demonstrate an average reference voltage of 250.7 mV, with a temperature coefficient as low as 3.2 ppm/°C for 0 to 125 °C range, while the power consumption is 545 pW under a 420 mV power supply at 27 °C. The power supply rejection ratio and output noise without any filtering capacitor at 100 Hz are −54.5 dB and 2.88 µV/Hz^1/2, respectively. The active area of the fabricated chip is 0.00332 mm².     

A low power dissipation high-speed CMOS image sensor with column-parallel sigma–delta ADCs

A 60frames/s CMOS image sensor with column-parallel inverter-based sigma–delta (ΣΔ) ADCs is proposed in this paper. In order to improve the robustness of the inverter, instead of constant power supply, two buffers are designed to provide power supply for inverters. Instead of using of an operational amplifier, an inverter-based switch-capacitor (SC) circuit is adopted to low-voltage low-power ΣΔ modulator. Detailed analysis and design optimization are provided. Due to the use of the inverter-based ΣΔ ADCs, the conversion speed is improved while reducing the area and power consumption. The proposed CMOS image sensor has been fabricated with 0.18 μm CMOS process. The measurement results show that the random noise (RN) is 7e_rms⁻, the pixel conversion gain is 100 μV/e⁻. Since the measured full well capacity of the pixel is 25000e⁻, the CMOS image sensor achieves a 71 dB dynamic range (DR). The total power consumption at 60frame/s is 58.2 mW.     

An 8 bit, 100 kS/s,switch-capacitor DAC SAR ADC for RFID applications

An 8 bit switch-capacitor DAC successive approximation analog to digital converter (SAR-ADC) for sensor-RFID application is presented in this paper. To achieve minimum chip area, maximum simplicity is imposed on capacitive DAC; replacing capacitor bank with only a one switch-capacitor circuit. The regulated dynamic current mirror (RDCM) design is introduced to provide stabilized current. This invariable current from RDCM, charging or discharging the only capacitor in circuit is controlled by pulse width modulated signal to realize switch capacitor DAC. The switch control scheme is built using basic AND gates to generate the control signals for RDCM. Only one capacitor and reduced transistor count in digital part reduces the silicon area occupied by the ADC to only 0.0098 mm². The converter, designed in GPDK 90 nm CMOS, exhibits maximum sampling frequency of 100 kHz & consumes 6.75 µW at 1 V supply. Calculated signal to noise and distortion ratio (SNDR) at 1 V supply and 100 kS/s is 48.68 dB which relates to ENOB of 7.79 bits. The peak values of differential and integral nonlinearity are found to be +0.70/−0.89 LSB and +1.40/−0.10 LSB respectively. Evaluated figure of merit (FOM) is 3.87×10²⁰, which show that the proposed ADC acquires minimal silicon area and has sufficiently low power consumption compared to its counterparts in RFID applications.     

Resonant amplifier-based sub-harmonic mixer for zero-IF transceiver applications

This paper describes a novel low voltage low power resonant amplifier-based sub-harmonic mixer using current-reuse-bleeding technique for zero-IF transceiver systems applications. The novel resonant amplifier-based sub-harmonic balun is designed and used in the mixer, which can double the frequency of the local oscillation (LO) signal. Moreover, the sub-harmonic balun can provide a pair of double frequency LO signals, unlike the conversional mixers, the novel sub-harmonic requires only one low power LO input. The proposed mixer delivers a remarkable conversion gain of 14.5 dB with local oscillator (LO) power of −2 dBm, and its power consumption is 0.65 mW with 0.8 V supply voltage. The input-referred third-order intercept point (IIP3) of the mixer is 1 dBm, and the chip area is only 0.52 mm².     

Silicon-on-insulator power integrated circuits

A power integrated circuit process has been developed, based on silicon-on-insulator, which allows intelligent CMOS control circuitry to be placed alongside integrated high-voltage power devices. A breakdown voltage of 335 V has been obtained by using a silicon layer of 4 μm thickness together with a buried oxide layer of 3 μm thickness. The respective LDMOS specific on-resistance and LIGBT on-state voltage for this breakdown voltage were 148 mΩ cm² and 3.9 V, respectively.     

An LP/CBP reconfigurable analog baseband circuit for software-defined radio receivers in 65 nm CMOS

A low pass (LP) and complex band pass (CBP) reconfigurable analog baseband circuit for software-defined radio (SDR) receivers is presented. It achieves 1–15 MHz LP bandwidth, 2–8 MHz CBP bandwidth and 0–36 dB gain range with 1 dB step. Nulling-resistor Miller feed-forward (NRMFF) differential-mode compensation, passive left half-plane (LHP) zero common-mode compensation and Quasi-Floating Gate (QFG) technique are proposed to improve the high frequency performance and driving capability of the embedded fully differential operational amplifier (Op-Amp). The analog baseband circuit has been implemented in 65 nm CMOS. It achieves 15.2 dB m/27.1 dB m IB/OB-IIP3, −2 dB m IP1dB and 71 dB m IIP2 while consuming 3.6–9.1 mW from a 1.2 V power supply and 0.75 mm² chip area.     

A low-power wide tuning-range CMOS current-controlled oscillator

This paper presents a low-power, small-size, wide tuning-range, and low supply voltage CMOS current-controlled oscillator (CCO) for current converter applications. The proposed oscillator is designed and fabricated in a standard 180-nm, single-poly, six-metal CMOS technology. Experimental results show that the oscillation frequency of the CCO is tunable from 30 Hz to 970 MHz by adjusting the control current in the range of 100 fA to 10 µA, giving an overall dynamic range of over 160 dB. The operation of the circuit is nearly independent of the power supply voltage and the circuit operates at supply voltages as low as 800 mV. Also, at this voltage, with control currents in the range of sub-nano-amperes, the power consumption is about 30 nW. These features are promising in sensory and biomedical applications. The chip area is only 8.8×11.5 µm².