行星式研磨抛光机传动机构改造及试验

针对传统双面抛光机存在的抛光过程中的加载均匀性问题,对抛光机传动机构进行优化改进设计,并在此抛光机上对硅晶片进行抛光加工试验,通过试验研究了不同加工参数对硅晶片表面粗糙度和材料去除率的影响。试验研究结果表明:传动机构优化设计提高了行星式研磨抛光机床的精度和系统性能;在相同的加工速度下,改造前后抛光机的加工效率接近,改造后对工件加工的表面粗糙度约为改造前的1/3。该设备的改造设计对提高抛光机的加工精度有重要意义。     

轴类工件抛光工具

一般外圆磨床或曲轴磨床加工轴类工件的表面粗糙度,只能达到R_α0.63～0.32μm。为改善工件轴颈(例如内燃机曲轴主轴颈和曲柄销轴颈)的表面粗糙度,以提高其疲劳强度,我们采用了粒度较细的油石进行抛光。由于缺乏专用的抛光机,所以我们设计了简易的轴类工件抛光工具,配上必要的夹具后,就可在普通车床上进行外圆抛光了。     

MS-6BC型精密双面抛光机的研制

光电子信息产业的快速发展,要求蓝宝石、单晶硅等材料高效率、超光滑表面加工,精密双面抛光加工是得到这些材料超光滑表面的主要加工方法之一.本文介绍了新研制的MS-6BC型精密双面抛光机,介绍了其结构及其特点,并论述了双面抛光加工的主要工艺因素和过程.最后通过试验验证了MS-6BC型精密双面抛光机具有加工精度高,控制性能好的特点,适用于蓝宝石、单晶硅等人工晶片的超精密加工.     

螺旋曲面数控抛光技术的研究

针对目前国内螺旋曲面螺杆抛光后其表面粗糙度不能很好地满足实际需要的现状,对螺旋曲线的数控抛光技术进行了研究.建立了数控抛光机床磨头的数学模型,给出了工件螺旋面的方程,研制了一种新型的螺旋曲面数控抛光机床,极大地提高了数控抛光的加工效率和工件的表面质量.     

基于PLC的平面抛光机设计

抛光是加工中重要的工序,一般是去除前道工序的加工刀痕、毛刺等,要求工件表面的材料去除均匀,以获得粗糙值较低的光亮表面。研制基于PLC技术的平面抛光机,是为了实现表面抛光自动化、保证工件质量,提高拋光加工的效率。     

二级行星磨料抛光机运动轨迹仿真分析

针对二级行星磨料抛光机的加工特点,采用Adams对其二级行星机构进行模拟仿真,研究分析工件运动轨迹的主要影响因素,得出抛光转速、抛光时间以及各级齿轮的传动比等参数对工件上任一点的运动轨迹的影响规律。结果表明,对于二级行星磨料抛光机,在确定其各级齿轮传动比后,工件任一点的运动轨迹已经确定,抛光时间、抛光转速均无法改变工件的运动轨迹;各级齿轮传动比是决定工件的运动轨迹的唯一因素,并且在各级齿轮中心距不变的条件下,第Ⅰ级齿轮传动比越大,第Ⅱ级齿轮传动比越小,抛光工件运动轨迹分布越均匀。     

表面光整加工技术及其应用（下）

3．水合抛光 水合抛光是利用在工件界面上产生的水合反应的新型高效、超精密抛光方法。主要特点是不使用磨粒和加工液,而加工装置又与当前使用的抛光机类似,只是在水蒸气环境中进行加工。为此,要尽量避免使用能与工件产生固相反应的材料作抛光盘。     

名词解释

<正>水合抛光水合抛光法是一种利用在工件界面上生成水合化学反应的研磨方法,其主要特点是不使用磨粒和加工液,而加工装置又与当前使用的研磨盘或抛光机相似,只是在水蒸气环境中进行加工。因此,要极力避免使用能与工件产生固相反应的材料作研具。悬浮抛光悬浮抛光技术旨在进行电子材料无畸变的超精密加工而开发的,是应用于高密度磁性薄膜及磁性材料加工的唯一     

大口径平面抛光机精密转台设计

抛光是获得超精密表面的重要手段。在平面抛光过程中,抛光垫类型对应不同的抛光工艺参数,抛光垫的修整精度直接影响工件面形精度,转台对抛光垫的精度具有重要影响,因此,转台系统精度成为衡量一台平面抛光机床的重要技术指标。文中对适用于大口径平面抛光机的精密转台部件进行了优化设计,该转台具有高精度、高稳定性等特点。检测结果及实际应用表明,文中设计的精密数控转台能够满足大口径平面元件高精度、高效率抛光的需要。     

孔用抛光工具

这种高效率圆柱内孔表面抛光工具,由于采用了内装式磁铁,因而能形成稳定的切削比压,这是与一般抛光工具不同的地方。加工薄壁套筒内孔表面用的旋转抛光工具如图1所示。该工具安装在抛光机或车床的主轴1上,而被加工的工件5,则装夹在具有径向夹紧的刀架上。半     

Study on the inner surface finishing of irregular spatial elbow pipe by the centerline reconstruction

Due to the compact space structure of aerospace engine, the structure of the inner spatial elbow pipe of the engine exhibits irregular geometric characteristics, which makes the inner surface of the curved pipe difficult to polish, especially the bending place’s surface quality cannot be ensured. It is centerline reconstruction that can be a good solution to this problem, which measures the outer surface contour line and generates the spatial point cloud of the elbow pipe and thus, the irregular geometric centerline of the spatial elbow pipe is rebuilt. Furthermore, the polishing path of the spatial elbow pipe is calculated and optimized. At the same time, using of magnetic abrasive finishing (MAF) has well in flexible machining characteristics, the outer space of the elbow pipe is loaded with rotating magnetic field, so as to get form a “magnetic abrasive brush” inside the tube, achieve the purpose of bending the inner surface finishing. Under the same processing time, compared with the pure manual measuring magnetic grain processing, the reconstruction of the center line of the magnetic processing can make the space bend surface roughness lowered to 0.11 μm, which improves the processing quality of the tube surface and the processing efficiency.     

模具型面快速数控抛光研究

针对模具型面的特点,提出一种快速数控抛光工艺方法.通过对抛光轮和抛光装置的柔性设计,使得与普通数控机床相联的抛光工具能够随着模具表面形貌的变化,作出一定范围内的姿态调节,从而保持了抛光过程的一致性,能够获得均匀的抛光效果.通过抛光实验,初步验证了抛光工具对曲面的加工能力,并从实验数据中总结出抛光加工的去除模型.     

提高圆孔光整工艺性能的措施

以活塞内孔加工为研究对象,针对圆孔光整加工工艺中存在的缺憾,用一系列的实验和数据,分析了圆孔拉削工艺的优势与存在的问题。通过专用圆孔拉刀结构改进试验的对比,展示解决圆孔光整加工质量问题的思路,推出一款改进型专用圆孔拉刀和拉削光整加工相关参数确定的计算方法,为提高圆孔表面精度质量,减小表面粗糙度,提出了切实可行的措施与方法。     

提高活塞表面光洁度的叶轮抛光工艺

通过对剪板机、折弯机产品活塞杆表面质量、加工原理分析及阐述,提出了"叶轮"抛光加工工艺及其在生产中的广泛应用。实践证明,"叶轮"抛光工艺能很好地满足活塞杆等高精度表面零件的设计要求。     

Configuration design and accuracy analysis of a novel magnetorheological finishing machine tool for concave surfaces with small radius of curvature

Magnetorheological finishing (MRF) is a computer-controlled deterministic polishing technique that is widely used in the production of high-quality optics. In order to overcome the defects of existing MRF processes that are unable to achieve concave surfaces with small radius of curvature, a configuration method of a novel structured MRF machine tool using small ball-end permanent-magnet polishing head is proposed in this paper. The preliminary design focuses on the structural configuration of the machine, which includes the machine body, motion units and accessory equipment, and so on. Structural deformation and fabrication accuracy of the machine are analyzed theoretically, in which the reasonable structure sizes, manufacturing errors and assembly errors of main structural components are given for configuration optimization. Based on the theoretical analysis, a four-axes linkage MRF machine tool is developed. Preliminary experiments of spot polishing are carried out and the results indicate that the proposed MRF process can achieve stable polishing area which meets requirement of deterministic polishing. A typical small-bore complex component is polished on the developed device and fine surface quality is obtained with sphericity of the finished spherical surfaces 1.3 µm and surface roughness Ra less than 0.018 µm.

     

氮化硅陶瓷回转曲面零件化学机械抛光工艺实验研究

在数控坐标磨床上应用化学机械抛光(Chemo-mechanical polishing,CMP)技术,对氮化硅陶瓷回转曲面零件进行超精密加工工艺实验研究.分析了氮化硅陶瓷化学机械抛光原理,并搭建化学机械抛光实验平台.通过实验研究了水基CeO2抛光液浓度、抛光液流量、抛光轮转速等主要工艺参数对氮化硅陶瓷零件抛光的表面质量的影响规律,根据实验结果对抛光工艺参数进行了优选.结果表明:在抛光液浓度为20%,抛光液流量为0.6 L/min,抛光轮转速为6 000 r/min的条件下,能获得较好的抛光表面质量,其表面粗糙度Rα达12 nm.     

变速感应淬火的示教再现控制

针对机床轴类工件外锥面或内锥孔进行连续感应淬火时存在的淬火硬度和有效硬化层不均匀等质量问题，采用电液比例阀调节淬火移动速度的方法保持淬火加热温度并通过示教再现控制保证工艺的稳定性与再现性。     

RESEARCH ON POLISHING PROCESS OF A SPECIAL POLISHING MACHINE TOOL

In this paper, a serial-parallel hybrid special polishing machine tool based on the elastic polishing theory is developed, which is used for polishing mould surface by using bound abrasives. This machine tool mostly consists of parallel mechanism of three-dimensional moving platform, series rotational mechanism of two degrees of freedom and elastic polishing tool device. The parallel mechanism controls the spatial position of the polishing tool. The series mechanism controls the pose of the polishing tool. The elastic polishing tool system can realize active control by a pneumatic servo system and passive conformity by a spring. The main process parameters that have influence on surface roughness and polishing efficiency are tool speed, feed rate, force, pose angle and polishing number of times. Optimal combination of process parameters is presented by the Taguchi and grey relational analysis, which provide a choice of parameters as a basis for free-form surface polishing in practice.     

Corrective polishing of complex ceramics geometries

High quality surfaces in terms of low roughness and high form accuracy are achieved by polishing as the essential finishing step. Polishing of brittle materials is an established process in science and industry. However, the machining is limited to planar or spherical geometries. The objective of this paper is to present first results to overcome this limitations indicated by processing advanced ceramics.In order to finish complex surfaces, a technological transfer of known parameters and conditions of 2-dimensional to zonal polishing is undertaken. To shorten the development of stable and reproducible processes the knowledge and understanding of the complex interactions of the 2-dimensional process is used. The applicability of these conditions is evaluated by extensive research on the zonal polishing setup. The used machine tool is capable of adjusting significant process factors, such as free controlled force and heterodyne velocity profiles. By use of a small tool the material removal is only affecting a zonal area of a complex surface. Based on preliminary investigations concerning the material removal function the scientific insight on zonal processes is extended. This first approach will be used for corrective polishing of zonal form deviations.     

硅晶片抛光加工工艺的实验研究

双面抛光已成为硅晶片的主要后续加方法,但由于需要严格的加工条件,很难获得理想的超光滑表面.设计了硅片双面抛光加工工艺新路线,并在新研制的双面抛光机上对硅晶片进行抛光加工,实验研究了不同加工参数对桂晶片表面粗糙度和材料去除率的影响.采用扫描探针显微镜和激光数字波面干涉仪分别对加工后的硅晶片进行测量,实验结果表明:在优化实验条件下硅晶片可以获得表面粗糙度0.533nm的超光滑表面.