Numerical simulation and experimental research on the wheel brush sampling process of an asteroid sampler

To examine the environmental characteristics of the microgravity force and the weathered layer on an asteroid surface, a symmetric wheel brush asteroid sampler is proposed for the collection of particles on the asteroid surface. To study the influence of the wheel brush rotation speed on the sampling efficiency and the driving torque required for the wheel brush, the contact dynamics model between particles and sampling wheel brushes is established and a simulation and experimental verification of the sampling process are conducted. The parameter calibration of the sampled particles is studied first, and the calibrated particle parameters are used in the numerical simulation of the sampling process. The sampling results and the particle stream curves are obtained for the working conditions of different rotation speeds, and the effects of different parameter settings on the sampling efficiency are analyzed. In addition, a set of rotating symmetrical sampling wheel brush devices is built for the ground test, and the dynamic torque sensor is used to test the torque change of the wheel brush during the sampling process. The relationship between the speed of the wheel brush and the driving torque of the wheel brush motor is determined by comparing the simulation results with the test results. Results indicate that when the rotating speed of the wheel brush is faster, the sampling efficiency is higher, and the driving torque required for the sampling wheel brush is greater. Moreover, a numerical simulation analysis of the sampling process of the wheel brush sampler in a microgravity environment is conducted to determine the optimal speed condition, and the brushing test of the wheel brush sampler in the microgravity environment is verified with the drop tower method. This research proposes the structural optimization design and motor selection of a wheel brush asteroid sampler, which provides important reference value and engineering significance.     

Adhesion-Induced Instability in Asperities

Adhesive forces between two approaching asperities will deform the asperities, and under certain conditions this will result in a sudden runaway deformations leading to a jump-to-contact instability. We present finite element-based numerical studies on adhesion-induced deformation and instability in asperities. We consider the adhesive force acting on an asperity, when it is brought near a rigid half-space, due to van der Waals interaction between the asperity and the half-space. The adhesive force is considered to be distributed over the volume of the asperity (body force), thus resulting in more realistic simulations for the length scales considered. Iteration scheme based on a “residual stress update” algorithm is used to capture the effect of deformation on the adhesion force, and thereby the equilibrium configuration and the corresponding force. The numerical results are compared with the previous approximate analytical solutions for adhesion force, deformation of the asperity and adhesion-induced mechanical instability (jump-to-contact). It is observed that the instability can occur at separations much higher, and could possibly explain the higher value of instability separation observed in experiments. The stresses in asperities, particularly in case of small ones, are found to be high enough to cause yielding before jump-to-contact. The effect of roughness is considered by modeling a spherical protrusion on the hemispherical asperity. This small-scale roughness at the tip of the asperities is found to control the deformation behavior at small separations, and hence are important in determining the friction and wear due to the jump-to-contact instability.     

不同粒度纳米金刚石抛光微晶玻璃的研究

选用4种不同粒度的纳米金刚石抛光微晶玻璃,考察了纳米金刚石磨料的粒度对抛光速率和表面粗糙度的影响。采用AFM分析不同抛光表面的微观形貌,讨论了纳米金刚石与微晶玻璃的作用机制。结果表明:采用纳米金刚石抛光微晶玻璃可获得亚纳米级的表面粗糙度;随纳米金刚石粒度的降低,纳米金刚石的抛光速率减小,微晶玻璃表面平均粗糙度降低;微晶玻璃表面晶粒的不同断裂方式影响抛光后的表面粗糙度。     

On the mechanism of material removal by free abrasive grinding of glass and fused silica

The dependence of the rate of material removal from glass and fused silica specimens on the carrier fluid used in free abrasive grinding was observed and other abrasion parameters, i.e. surface roughness, bed thickness and drag force, were measured. The similarity between the damage produced by silicon carbide particles during free abrasive grinding and that found after indentation with a sharp point encouraged the formulation of a rotation/ indentation model of abrasion. This semi-quantitative model showed good agreement with the experimental data.     

Mathematical slip-line field solutions for ploughing a hard particle over a softer material

Wear mechanisms and friction in metals can be investigated by the analysis of the unit event represented by the interaction of a hard particle or asperity with a softer surface. Effective friction is the result of the interaction of many such asperities which constitute the roughness of the harder of the solid surfaces. Three types of plastic deformation at the metal surface can be identified: ploughing, edge formation and chip formation. Each mode of plastic deformation can be analysed using the slip-line field plasticity theory which requires as inputs the geometry of the hard particle and some information on the interface between the harder and the softer surfaces. The classical and the recent chord solution by Oxley assumes a sharp edge sliding against a metal surface but does not consider a curved roughness profile. However, the profiles of real asperities are more like waves with rounded summits. In the present work a new model for the asperities interaction is shown, using the slip-line field theory to calculate the friction forces, depth of sheared layer, average contact pressure and friction coefficient for a cylindrical hard particle sliding over a softer surface. The theoretical results are presented as friction graphs and maps in which the regions of elastic deformations are shown using the Hertz theory while the region of plastic strains is obtained from the present analysis. Present model results are in good agreement with experimental data obtained by Busquet et al. and are quite different from the Oxley chord model for sliding a circular particle.     

粗糙表面微凸体对液黏传动的影响

为研究液黏传动过程中粗糙表面的承载特性,将分形理论引入到两粗糙表面摩擦过程之中,分析传动过程中混合摩擦和边界摩擦两阶段的微凸体承载过程,考虑微凸体弹塑性变形,对M-B模型进行修正,建立修正的微凸体承载模型。建立基于修正M-B模型的微凸体承载模型。通过数值仿真得到有效面积系数、分形参数对液黏调速离合器传动过程的影响规律;对修正的微凸体承载模型的计算结果与M-B模型的计算结果进行对比分析。结果表明:微凸体接触载荷和传递转矩随着面积比的增大而增大,当有效面积系数与尺度系数增大时,接触载荷与传递转矩均有所增大;分形维数为1.5时,微凸体接触载荷与传递转矩最小且随面积比的变化最为缓慢;在整个接触区域内,弹性变形区域的面积、接触载荷以及传递转矩最大,其次是弹塑性变形区域,塑性变形区域最小;考虑弹塑性变形时,微凸体接触载荷与传递转矩均有所下降;修正M-B模型和M-B模型间的修正系数范围在25%以内,修正系数随着有效面积系数、尺度系数的增大而增大,随着分形维数的增大而减小。     

An analytical model of the material removal rate between elastic and elastic-plastic deformation for a polishing process

This paper develops an analytical model for the material removal rate during specimen polishing. The model is based on the micro-contact elastic mechanics, micro-contact elastic-plastic mechanics and abrasive wear theory. The micro-contact elastic mechanics between the pad-specimen surfaces used the Greenwood and Williamson elastic model. The micro-contact elastic-plastic mechanics between specimen and particle, as well as the micro-contact elastic mechanics between particle and pad, are also analyzed. The cross-sectional area of the worn groove in the specimen is considered as trapezoidal area. A close-form solution of material removal rate from the specimen surface is the function of average diameter of slurry particles, pressure, the specimen/pad sliding velocity, Equivalent Young’s modulus, RMS roughness of the pad, and volume concentration of the slurry particle.     

Laser surface cleaning and potential applications in disk drive industry

Laser cleaning has emerged as an effective cleaning technique for removing contaminants from solid surfaces. Dry laser cleaning and steam laser cleaning have been developed recently, relying on pulsed laser heating of the surface without and with the presence of a thin liquid coating. A cleaning model was established for removal of particles from solid surfaces by taking Van der Waals force, capillary force and cleaning force into account. The model can not only explain the influence of laser fluence on cleaning efficiency, but also predict the cleaning thresholds. Laser-induced removal of film-type contaminants from solid surfaces has been studied. Laser cleaning mechanisms and its applications in disk drive industry will be discussed in this article.     

Simulation study on chip formation mechanism in grinding particle reinforced Cu-matrix composites

Based on the coupling method of finite element method and smoothed particle hydrodynamics method, the process of single abrasive grain cutting particles reinforced Cu-matrix composites with small volume fraction of particle phase is simulated, and the chip formation mechanism of particle reinforced Cu-matrix composites was analyzed. It can be concluded that the plastic removal of the Cu-matrix is still the main removal form of the composite, but the existence of the reinforced particle phase affects the cutting deformation behavior and the chip morphology. During the cutting process, the interfaces between part of reinforced particles and the Cu-matrix are broken, and resulting in the particles falling off into chips, but most of the particles will form continuous mixed chips with copper alloy, with the plastic deformation of the Cu-matrix. The extrusion of abrasive particles leads to pile-up of dislocation producing in Cu-matrix around the reinforced particle, which interferes with the continuous plastic deformation of Cu-matrix, thus affects the cutting force and cutting temperature of the abrasive grain. The simulation results show that with the increase of cutting speed, the cutting force decreases, but the cutting temperature increases. As the cutting depth increases, the cutting force and cutting temperature increase. The increase of reinforced particle content will lead to the increase of cutting force and cutting temperature.     

Effects of particle size, polishing pad and contact pressure in free abrasive polishing

The objective of this research is to better understand the mechanisms of material removal in the free abrasive polishing process. Experiments were carried out to understand the effects of particle size, polishing pad and nominal contact pressure on the wear rate and surface roughness of the polished surface. A theoretical model was developed to predict the relationship between the polishing parameters and the wear rate for the case of hard abrasive particles sandwiched between a soft pad and a workpiece (softer than the abrasive particles). Experimental results and theoretical predictions indicate that the wear rate increases with an increase in particle size, hardness of polishing pad and nominal contact pressure, and with a decrease in elastic modulus of the polishing pad. Surface roughness increases with an increase in particle size and hardness of polishing pad, and nominal contact pressure has little effect on the roughness. A dimensionless parameter, wear index which combines all of the preceding parameters, was introduced to give a semi-quantitative prediction for the wear rate in free abrasive polishing. It is also suggested that when polishing hard material, in order to achieve a high materials removal rate and a smooth surface, it is preferable to use diamond as the polishing particles because of their high deformation resistance.     

The influence of surface roughness on abrasive wear

Analyses are given of the mechanism of friction and abrasive wear and of the effect of surface roughness on them. Theoretical expressions are derived for ploughing, adhesion and the total friction coefficient of hard conical asperities ploughing a soft metal surface, with the assumption that the asperities of the hard metal are cones with randomly distributed slopes, the mean value of which varies with surface roughness. Simple expressions for the abrasive wear rate and the mean wear particle size are also derived on the basis of a ploughing mechanism of the hard conical asperities on the soft metal surface.A comparison of calculated values based on these theories with experimental data of single-pass wear tests for various soft metals such as copper, cadmium, lead and zinc sliding on low carbon steel plates shows good agreement. The effects of surface roughness on the tangential forces under unlubricated and lubricated conditions as well as the mean wear particle size are theoretically discussed and the theoretical results are compared with experimental data.     

一种保洁机器人的设计

针对工业用大型炉膛及炉体内腔的清洗问题,设计一种腔体内的清洁设备,它相当于一个保洁机器人,主要由基础板、升降组件、旋转组件、水喷洗组件等组件组成,工作过程由升降运动、旋转运动和高压水喷射运动三个运动来完成,这三个运动可以同时进行,也可以任选其二,或独立进行,动作类似于保洁工人的操作,类手臂拖动鬃刷或保洁棉纱,运动灵活,上下左右360°圆周作业。在高压水射流的作用下,臂杆伸出,球形喷头的脑袋同时使其高压水五面喷射,冲刷欲清洁的内腔壁,并滋润着臂杆上舞动的棉纱。它可以为大型设备内腔壁的清洁提供机械化操作,且清洁效果极佳。     

A numerical method for the calculation of lubricant pressures in bearings with mixed lubrication

A model for mixed lubrication, assuming that the total normal load applied to the plane of the lubricated surfaces is carried partly by the hydrodynamic action of the lubrication film and partly by asperity contacts and that the total friction force between the lubricated surfaces is partly due to viscous friction and partly to asperity contacts, was used to develop a numerical solution for pressure distribution in a bearing experiencing mixed lubrication. The geometry treated and the pressure distribution obtained were for a simple slider bearing, but the method could easily be extended to other shapes. The model is based on measured roughness of a real surface. Real load carrying capacity and drag can therefore be determined since they are related directly to bearing pressure distribution     

Effect of interfacial friction force on material removal in full aperture continuous polishing process

Full aperture continuous polishing using pitch lap is a key process of finishing large flat optical workpiece. The friction force of the workpiece and pitch lap interface significantly affects material removal. In this work, the friction force was determined by a measurement system that uses force transducers to support the workpiece. Experimental and theoretical analyses have been carried out to investigate the evolution of friction force with polishing time and its effect on material removal. Our results show that the friction coefficient of the workpiece/lap interface decreases during polishing, which is due to surface smoothing of the viscoelastic pitch lap by loading conditioner. In addition, the spatial average and uniformity of material removal rate (removal coefficient) increases with the increase of friction coefficient, which is due to rough lap surface, provides more sharp asperities to charge the polishing particles.     

Mechanisms of Chemical-Mechanical Polishing of SiO2 Dielectric on Integrated Circuits

One of the fundamental mechanisms of chemical-Mechanical polishing (CMP) is the mechanical interaction between the wafer and polishing pad. This interaction was simulated in experiments. The vertical displacement of the wafer with respect to the polishing pad, the fictional drag of the wafer against the pad, and the pressure of the slurry trapped between the wafer and pad were measured. These experiments were performed over a range of commercially common CMP conditions. In addition, polishing rates were measured for CMP performed under induced hydrodynamic conditions where the wafer was separated from the pad by a film of slurry.

It was found that no appreciable polishing occurred under hydrodynamic CMP conditions. Under commercial CMP conditions, it was found that the wafer contacts the polishing pad asperities as evidenced by near-zero wafer displacement and high friction coefficients (?0.4). It was also found that pad conditioning (intentional roughening) causes a suction force to develop between the wafer and pad. This suction force draws the wafer into further contact with the pad, by as much as 20 μm, and corresponds to peak slurry vacuum pressures of 12 kPa (1.7 psi).     

硅晶片的液流悬浮超光滑加工机理与实验

建立了基于机器人的液流悬浮超光滑加工系统。配置出了适用的悬浮加工液,通过对硅晶片的大量加工实验研究,得到了加工时间、工具转速和粒子浓度对工件表面质量的影响规律。实验结果表明:当加工时间在60 min、工具转速为6 000 r/min上下、粒子浓度为30 g/L左右时,加工效果最佳。加工后的硅晶片表面粗糙度Ra能达到1.55 nm。深入分析了液流悬浮超光滑加工的去除机理,硅晶片的液流悬浮超光滑加工是机械冲击作用和化学作用的综合结果,加工液中的磨料颗粒有对工件表面的机械冲击作用和对化学反应的催化作用。理论分析和实验结果表明,通过采用液流悬浮加工新技术,可以实现对半导体材料硅晶片的纳米水平的超光滑加工,获得表面无塑性变形和晶格缺陷的纳米精度表面。     

Determining dynamically active abrasive particles in the media used in centrifugal force assisted abrasive flow machining process

Abrasive flow machining (AFM) is a relatively new non-traditional process in which a semisolid media consisting of abrasive particles and a flexible polymer carrier is extruded through or across the component to be machine finished. This process is capable of providing excellent surface finishes on a wide range of simple as well as intricated shaped components. Low material removal rate happens to be one major limitation of this process, because during machining not all the abrasive particles participate in removing material from the work piece. Limited efforts have hitherto been directed towards improving the efficiency of the process so as to achieve higher material removal rates. An effort has been made towards the performance improvement of this process by applying centrifugal force on the abrasive media with the use of a rotating centrifugal force generating (CFG) rod introduced in the work piece passage. The modified process is termed as centrifugal force assisted abrasive flow machining (CFAAFM). This paper presents a mathematical model developed to calculate the number of dynamics active abrasive particles participating in the finishing operation in the AFM and CFAAFM process. The analysis of results show that there is great enhancement of number of dynamic active abrasive particles in CFAAFM as compared to the AFM process, which seems to be the contributing factor for the increase in material removal and % improvement in surface roughness for a given number of cycles in CFAAFM. The results of experiments conducted to validate the model show a close agreement between the analytical and experimental results.     

A THRESHOLD MODEL FOR LASER CLEANING OF LARGER SILICON WAFERS

High cleaning quality for silicon wafers without damage is a challenge in laser cleaning technologies. Laser cleaning of Al₂O₃ micro-particles, which are the main contaminants of silicon wafer lapping and polishing solutions used in industry, from silicon wafers was studied for determining laser energy for high efficient particle removal while not causing damage to the wafers. As the cleaning force is generated from laser-energy absorption and conduction of the wafer, heat-conduction model on silicon wafer was developed during laser irradiation using a finer finite element method, from which cleaning force exerting on the particles greater than the adhesion force between the particle and the substrate, but less than the wafer damage energy of laser input was determined. Calculations of the laser energy threshold values for both particle cleaning and wafer damage were conducted for silicon wafers of 200 mm in diameter and 0.2 mm in thickness, and they were found to be about 60 mJ/cm² and 320 mJ/cm², respectively. The laser energy threshold model was finally verified experimentally using a KrF Excimer laser and found to be in good agreement with the experimental data. With the cleaning parameters from the model, the cleaning efficiency of as high as 98% has been achieved.     

水力旋流器内科里奥利力的量级分析研究

科里奥利力是在旋转坐标系中由于物体相对于旋转坐标系运动所产生的一种惯性力,简称科氏力。水力旋流器的内部流场是高速旋转的离心分离流场。本研究采用计算流体力学方法模拟水力旋流器内高浓度分散相的分布,对颗粒受到的科氏力进行分析。RSM模型用于描述流场的湍动特性,LPT模型对颗粒相的运动进行追踪,模拟结果与试验数据的吻合性较好。结果表明,在水力旋流器内,由于锥体段的湍流强度较高,科氏力的方向具有较强的随机性。在切向方向,随粒径增大,曳力和压力梯度力递减而科氏力递增,当粒径增大到52μm时,科氏力的量级与曳力相当,此时科氏力的作用是不可忽略的。     

Modeling and simulation of magnetic abrasive finishing process

Magnetic abrasive finishing (MAF) is one of the advanced finishing processes, which produces a high level of surface quality and is primarily controlled by a magnetic field. In MAF, the workpiece is kept between the two poles of a magnet. The working gap between the workpiece and the magnet is filled with magnetic abrasive particles. A magnetic abrasive flexible brush (MAFB) is formed, acting as a multipoint cutting tool, due to the effect of the magnetic field in the working gap. This paper deals with the theoretical investigations of the MAF process. A finite element model of the process is developed to evaluate the distribution of magnetic forces on the workpiece surface. The MAF process removes a very small amount of material by indentation and rotation of magnetic abrasive particles in the circular tracks. A theoretical model for material removal and surface roughness is also proposed accounting for microcutting by considering a uniform surface profile without statistical distribution. Numerical experiments are carried out by providing different routes of intermittent motion to the tool. The simulation results are verified by comparing them with the experimental results available in the literature.