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1.
一种基于MMIC技术的宽带左手非线性传输线二次倍频器   总被引:1,自引:1,他引:0  
董军荣  黄杰  田超  杨浩  张海英 《半导体学报》2011,32(9):095003-4
本文首次报道了基于MMIC技术的左手非线性传输线宽带二次倍频器。理论上分析了左手非线性传输线的二次谐波产生原理。在GaAs半绝缘衬底上制作了4节左手非线性传输线,面积为5.4mm*0.8mm。当输入信号为20dBm时,该倍频器在26.4GHz处获得最大二次谐波输出功率为6.33dBm,对应的-6dB带宽为24GHz~43GHz。实验结果与仿真结果吻合良好。以低频放大器作为激励,该倍频器可用于低成本,有效的毫米波甚至THz信号源系统。  相似文献   

2.
A monolithic microwave integrated circuit (MMIC) chip set consisting of a power amplifier, a driver amplifier, and a frequency doubler has been developed for automotive radar systems at 77 GHz. The chip set was fabricated using a 0.15 µm gate‐length InGaAs/InAlAs/GaAs metamorphic high electron mobility transistor (mHEMT) process based on a 4‐inch substrate. The power amplifier demonstrated a measured small signal gain of over 20 dB from 76 to 77 GHz with 15.5 dBm output power. The chip size is 2 mm × 2 mm. The driver amplifier exhibited a gain of 23 dB over a 76 to 77 GHz band with an output power of 13 dBm. The chip size is 2.1 mm × 2 mm. The frequency doubler achieved an output power of –6 dBm at 76.5 GHz with a conversion gain of ?16 dB for an input power of 10 dBm and a 38.25 GHz input frequency. The chip size is 1.2 mm × 1.2 mm. This MMIC chip set is suitable for the 77 GHz automotive radar systems and related applications in a W‐band.  相似文献   

3.
This paper presents the design and performance of a broadband millimeter-wave frequency doubler MMIC using active 0.15 μm GaAs PHEMT and operating at output frequencies from 20 to 44 GHz. This chip is composed of a single ended-into differential-out active Balun, balanced FETs in push-push configuration, and a distributed amplifier. The MMIC doubler exhibits more than 4 dB conversion gain with 12 dBm of output power, and the fundamental frequency suppression is typically -20 dBc up to 44 GHz. The MMIC works at VDD = 3.5 V, VSS = -3.5 V, Id = 200 mA and the chip size is 1.5 ×1.8 mm2.  相似文献   

4.
Details on a broadband MMIC frequency doubler targeting the MVDS market are presented. The design evolution from an individual pHEMT device to the complete practical doubler realisation is discussed. The doubler MMIC, which has been fabricated using the GMMT H40 GaAs process, has been evaluated in a customised package. An output power of +10 dBm at 40 GHz has been achieved with an associated conversion gain of 1.5 dB. The measured and predicted performance responses are compared. This chip is ideally suited to use in a number of emerging mm-wave applications.  相似文献   

5.
基于GaAs pHEMT工艺,设计了一个6~18 GHz宽带有源倍频器MM IC,最终实现了较高的转换增益和谐波抑制特性。芯片内部集成了输入匹配、有源巴伦、对管倍频器和输出功率放大器等电路。外加3.5 V电源电压下的静态电流为80 mA;输入功率为6 dBm时,6~18 GHz输出带宽内的转换增益为6 dB;基波和三次谐波抑制30 dBc。当输出频率为12 GHz时,100 kHz频偏下的单边带相位噪声为-143 dBc/Hz。芯片面积为1 mm×1.5 mm。  相似文献   

6.
In this paper, a MMIC frequency doubler based on an InP HEMT and grounded CPW (GCPW) technology is reported. The doubler demonstrated a conversion loss of only 2 dB and output power of 5 dBm at 164 GHz. The 3 dB output power bandwidth is 14 GHz, or 8.5%. This is the best reported result for a MMIC HEMT doubler above 100 GHz  相似文献   

7.
研制了一款60~90 GHz功率放大器单片微波集成电路(MMIC),该MMIC采用平衡式放大结构,在较宽的频带内获得了平坦的增益、较高的输出功率及良好的输入输出驻波比(VSWR)。采用GaAs赝配高电子迁移率晶体管(PHEMT)标准工艺进行了流片,在片测试结果表明,在栅极电压为-0.3 V、漏极电压为+3 V、频率为60~90 GHz时,功率放大器MMIC的小信号增益大于13 dB,在71~76 GHz和81~86 GHz典型应用频段,功率放大器的小信号增益均大于15 dB。载体测试结果表明,栅极电压为-0.3 V、漏极电压为+3 V、频率为60~90 GHz时,该功率放大器MMIC饱和输出功率大于17.5 dBm,在71~76 GHz和81~86 GHz典型应用频段,其饱和输出功率可达到20 dBm。该功率放大器MMIC尺寸为5.25 mm×2.10 mm。  相似文献   

8.
基于标准的平面肖特基二极管单片工艺设计了一款平衡式亚毫米波倍频单片集成电路。依据二极管实际结构进行电磁建模,提取了器件寄生参数,并与实测的器件本征参数相结合获得了二极管非线性模型;依据该模型,采用平衡式拓扑结构以实现良好的基波抑制,设计了三线耦合巴伦电桥,并与肖特基二极管集成在同一芯片上,实现了单片集成,提高了设计准确度。芯片在片测试结果表明,在输入功率17 dBm 下,输入频率75~105 GHz范围内,倍频器芯片峰值输出功率达到2.67 dBm。芯片整体尺寸为0.80 mm×0.50 mm。  相似文献   

9.
Highly integrated transmitter and receiver MMICs have been designed in a commercial 0.15 /spl mu/m, 88 GHz f/sub T//183 GHz f/sub MAX/ GaAs pHEMT MMIC process and characterized on both chip and system level. These chips show the highest level of integration yet presented in the 60 GHz band and are true multipurpose front-end designs. The system operates with an LO signal in the range 7-8 GHz. This LO signal is multiplied in an integrated multiply-by-eight (X8) LO chain, resulting in an IF center frequency of 2.5 GHz. Although the chips are inherently multipurpose designs, they are especially suitable for high-speed wireless data transmission due to their very broadband IF characteristics. The single-chip transmitter MMIC consists of a balanced resistive mixer with an integrated ultra-wideband IF balun, a three-stage power amplifier, and the X8 LO chain. The X8 is a multifunction design by itself consisting of a quadrupler, a feedback amplifier, a doubler, and a buffer amplifier. The transmitter chip delivers 3.7/spl plusmn/1.5 dBm over the RF frequency range of 54-61 GHz with a peak output power of 5.2 dBm at 57 GHz. The single-chip receiver MMIC contains a three-stage low-noise amplifier, an image reject mixer with an integrated ultra-wideband IF hybrid and the same X8 as used in the transmitter chip. The receiver chip has 7.1/spl plusmn/1.5 dB gain between 55 and 63 GHz, more than 20 dB of image rejection ratio between 59.5 and 64.5 GHz, 10.5 dB of noise figure, and -11 dBm of input-referred third-order intercept point (IIP3).  相似文献   

10.
A MMIC 77-GHz two-stage power amplifier (PA) is reported in this letter. This MMIC chip demonstrated a measured small signal gain of over 10 dB from 75 GHz to 80 GHz with 18.5-dBm output power at 1 dB compression. The maximum small signal gain is above 12 dB from 77 to 78 GHz. The saturated output power is better than 21.5 dBm and the maximum power added efficiency is 10% between 75 GHz and 78 GHz. This chip is fabricated using 0.1-/spl mu/m AlGaAs/InGaAs/GaAs PHEMT MMIC process on 4-mil GaAs substrate. The output power performance is the highest among the reported 4-mil MMIC GaAs HEMT PAs at this frequency and therefore it is suitable for the 77-GHz automotive radar systems and related transmitter applications in W-band.  相似文献   

11.
基于0.7μm InP HBT工艺,设计实现了一种高功率高谐波抑制比的W波段倍频器MMIC。电路二倍频单元采用有源推推结构,通过3个二倍频器单元级联形成八倍频链,并在链路的输出端加入输出缓冲放大器,进一步提高倍频输出功率。常温25℃状态下,当输入信号功率为0 dBm时,倍频器MMIC在78.4~96.0 GHz输出频率范围内,输出功率大于10 dBm,谐波抑制度大于50 dBc。芯片面积仅为2.22 mm2,采用单电源+5 V供电。  相似文献   

12.
5~22GHz平坦高增益单片低噪声放大器   总被引:1,自引:1,他引:1  
使用0.25μm G aA s PHEM T工艺技术,设计和制造了性能优良的5-22 GH z两级并联反馈单片低噪声放大器。在工作频率5-22 GH z内,测得增益G≥18 dB,带内增益波动ΔG≤±0.35 dB,噪声系数N F≤3.2 dB,输入输出驻波V SW R≤1.7,最小分贝压缩点输出功率P1dB≥10.5 dBm,电流增益效率达2.77 mA/dB。测试结果验证了设计的正确性。  相似文献   

13.
采用0.25μm AlGaAs/InGaAs/GaAs PHEMT工艺技术,研制出了6~18GHz三级MMIC全匹配宽带功率放大器单片.在6~18GHz的工作频率下,放大器的平均功率增益为19dB,输出功率大于33.3dBm,在10GHz处有最大输出功率34.7dBm,输入回波损耗S11低于-10dB,输出回波损耗S22低于-6dB.与报道的C-X-Ku频段宽带功率放大器相比,有较好的功率平坦度.  相似文献   

14.
A Ka-band monolithic microwave integrated circuit (MMIC) oscillator was implemented by using a coplanar waveguide photonic bandgap (PBG) resonator and a 0.1-/spl mu/m GaAs pseudomorphic high electron mobility transistor. A coplanar labyrinthine one-dimensional PBG resonator was used for reduction in MMIC size. The fabricated MMIC oscillator had an output power of 6.5dBm at 30.3GHz and a free-running phase noise of -80dBc/Hz at 100-kHz offset.  相似文献   

15.
该组件是将输入信号 (1 5 GHz,1 0 d Bm)倍频至 3 0 GHz,与本振信号 (5 GHz,1 0 d Bm)上变频到 3 5 GHz,然后进行功率放大输出。其倍频部分采用 Ga As PHEMT有源倍频并进行放大 ,混频电路采用 Ga As二极管的双平衡混频 ,滤波放大后由 8mm波导输出。最终结果为输出频率为 3 5 GHz,输出功率为 1 7d Bm,谐波抑制度大于 40 d BC,偏离中心频率± 2 0 0 MHz带宽内 ,幅度不平坦度小于 1 .5 d B。整个组件尺寸仅为 60 mm×2 2 mm× 1 5 mm。  相似文献   

16.
A 25-75 GHz compact double balanced frequency doubler fabricated in standard 0.18-mum CMOS process is demonstrated. The resistive doubler is composed of two identical asymmetric broadside-coupled baluns, and a quad GS-connected diode. The fabricated doubler achieves a radio frequency bandwidth from 25 to 75 GHz with a maximum output power better than +3 dBm; the fundamental signal rejection is ranging from 32 to 59 dB, and only occupies a chip size of 0.24 mm2. To the knowledge of the authors, this double balanced frequency doubler is the first demonstration with an operating frequency up to 75 GHz in 0.18-mum CMOS technology and shows this silicon-based frequency doubler can compare with its GaAs counterpart.  相似文献   

17.
Ali  F. Gupta  A. Salib  M. 《Electronics letters》1994,30(3):245-246
A fully matched, broadband, high efficiency MMIC power amplifier using AlGaAs/GaAs HBTs has been designed and tested. At 7 V collector bias, this HBT amplifier produced 31 dBm CW peak output power with 9 dB gain and 55% peak power-added efficiency in the 9.5-14.5 GHz band. To the authors' knowledge, this is the highest efficiency ever achieved from a broadband MMIC power amplifier  相似文献   

18.
2~12GHz GaAs单片行波放大器   总被引:1,自引:1,他引:0  
报道了一个全平面超宽带GaAs单片行波放大器的研究结果。该单片电路的核心部件是四个300μm栅宽的MESFET,整个电路拓扑结构简单,芯片面积为3.0mm×1.8mm。电路经优化设计后在2~12GHz范围内,小信号增益为5±1dB,输入输出电压驻波比≤1.75。上述频率范围内输出功率≥16dBm,噪声系数≤8dB。采用全离子注入、全平面工艺,均匀性、一致性良好。实验结果与设计预计值十分一致。  相似文献   

19.
《Electronics letters》2006,42(22):1286-1287
A high linear output power two-stage GaAs heterojunction bipolar transistor (HBT) power amplifier MMIC is reported. The input, interstage and output matching circuits are designed for wideband and low-voltage operations, and are fully integrated into an MMIC chip. The power amplifier measured with 54 Mbits 64-QAM OFDM signals at a collector supply voltage of 3.3 V showed linear output power of higher than 23.2 dBm at an error vector magnitude of 3.0% in a frequency range 3.3-3.6 GHz  相似文献   

20.
介绍了一种基于肖特基阻性Z-极管的140GHzZ-倍频器,该倍频器采用矩形波导内嵌石英基片微带电路,通过四肖特基结正向并联结构提高驱动功率承受能力。倍频设计中应用了自建精确二极管三维电磁模型、宽带电磁耦合结构和宽带阻抗匹配结构,以提高仿真结果和实际器件的吻合度。测试结果表明:在频率为65GHz一75GHz,功率为20dBm的驱动信号激励下,二倍频器输出频率为130GHz~150GHz,输出功率为3.3dBm~8.0dBm,倍频损耗为11.7dB~16.3dB。在23dBm-24dBm的最大驱动功率激励下,倍频器最大输出功率达11.2dBm/136GHz,基本达到了成像雷达的应用性能指标。  相似文献   

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