Sn-0.7Cu焊料在覆Cu FR-4 PCB板上电化学腐蚀及枝晶生长行为研究

用动电位扫描结合EDAX、XRD和SEM研究无铅焊料Sn-0.7Cu在覆Cu FR-4基板上于3.5mass%NaCl溶液中电化学腐蚀行为及枝晶生长过程。结果显示,Sn-0.7Cu钎料腐蚀主要以共晶组织中Sn腐蚀为主;且随着电场强度增大,腐蚀电流密度增大,低电场为均匀腐蚀,高电场时有不均匀腐蚀发生。钎料枝晶生长引起"桥连"短路问题严重影响电子产品可靠性,EDAX分析表明,枝晶上Cu离子含量大于Sn离子,说明Cu离子的电化学迁移能力和还原沉积能力大于Sn。枝晶生长是螺旋式从内到外沿四个方向最快伸展的生长方式,晶粒形成存在一定取向,主要为(411)和(220);电场强度越大,枝晶生长速率越快,桥连时间愈短;当阴、阳间距为3 mm时,两极桥连时间分别为12.5 h(8 V),20.4 h(5 V),28.5 h(3 V),39.6 h(1V)。XRD结果显示其腐蚀产物主要为:SnO_2,SnCl_4;枝晶组成主要为:Sn,SnO_2,SnCl_4,Cu,CuCl_2。     

外加电场对EB-PVD热障涂层高温氧化行为影响

根据YSZ在高温下是氧离子导体的电化学特性,对EB-PVD制备的双层结构YSZ/MCrAlY热障涂层试样进行外加直流电场作用下的高温氧化实验,利用SEM、EDS观察分析了外加电场条件下YSZ/MCrAlY界面热生长氧化物TGO结构形貌和成分。结果表明,在20V直流电场作用下经过1050℃,80h高温氧化后,与电源正极连接一侧热障涂层试样表面平整,TGO致密,与YSZ结合较好,而与电源负极连接一侧的涂层出现鼓起失效,涂层产生严重内氧化。外电场控制氧离子从YSZ表面向YSZ/MCrAlY界面扩散,改变YSZ/MCrAlY界面氧分压和氧空位浓度,对热障涂层高温氧化行为和失效产生影响。     

直流电场对固体软氮化的影响与作用机理分析

以45钢和20CrMnMo钢为例进行了直流电场下的固体软氮化.软氮化试样为直流电场负极,电场正极为板状,平行于试样的欲软氮化面放置.实验结果表明:直流电场加速软氮化过程,改善渗层硬度梯度分布;直流电场的加热作用加速渗剂的化学反应,提高N、C原子在试样中的扩散速度;与常规加热固体软氮化工艺相比,效率提高.分析认为:直流电场使含N、C活性基团向负极试样快速定向扩散,使得负极试样周围N、C浓度较常规粉末渗中的单纯热扩散提高,相对减少了渗箱内壁与样品非工作面对N、C原子的吸收;直流电场的物理作用强化渗剂间的化学反应,从而增加活性N、C原子或含N、C活性基团的产率与活性.     

对流作用下枝晶生长行为的相场法

基于Wheeler等提出的纯扩散相场模型,建立耦合溶质场、温度场和流场的相场模型,采用有限差分法对控制方程进行数值求解,研究Ni-Cu合金凝固过程中单晶粒枝晶和多晶粒枝晶在强制对流作用下的生长行为。结果表明:熔体的流动显著改变凝固前沿的传热和传质,从而改变枝晶的生长行为。在流速为6.43m/s的垂直强制对流作用下,上游枝晶受过冷熔体冲刷,枝晶尖端溶质浓度和温度低,实际过冷度大,枝晶生长迅速,稳态生长速度比纯扩散时增加28%;热量和溶质在下游富集,下游枝晶尖端溶质浓度和温度高,实际过冷度小,枝晶生长缓慢,稳态生长速度比纯扩散时减小26%。     

直流电场对ZA27合金凝固组织的影响

研究了直流电场作用下ZA27合金凝固组织的变化。试验结果表明，随着电流密度的增加，枝晶间距逐渐变小，框大的富Al树枝状枝晶在电场作用下逐渐向球状晶转化，且人晶相逐渐增多。初步分析了电场作用造成上述结果的机理。     

直流电场增强粉末渗硼特性研究

将20钢和45钢试样置于渗罐中平行的板状正负电极上及靠近和远离电极的部位,并施加一直流电场,以研究800℃时直流电场在粉末渗硼中的作用。试验结果表明,直流电场对渗罐内不同位置试样及同一试样的不同部位的渗硼作用不同,远离电极的试样渗硼速度比常规渗硼的还要低;从正极到负极,直流电场的促渗作用逐渐增强,直流电场促进试样渗硼的作用主要表现于面向正极的试样面。这种结果是由直流电场对渗硼过程中渗剂的化学反应、含硼活性基团及硼的扩散的影响所决定的。     

Influence of Direct Current Field on Powder-pack Nitrocarburizing

少了渗箱内壁与以45钢和20CrMnMo钢为例进行了直流电场下的固体软氮化. 软氮化试样为直流电场负 极, 电场正极为板状, 平行于试样的欲软氮化面放置. 实验结果表明: 直流电场加速软氮化过程, 改善渗层硬度梯度分布; 直流电场的加热作用加速渗剂的化学反应, 提高N、C原子在试样中的扩 散速度; 与常规加热固体软氮化工艺相比, 效率提高. 分析认为: 直流电场使含N、C活性基团向 负极试样快速定向扩散, 使得负极试样周围N、C浓度较常规粉末渗中的单纯热扩散提高, 相对减 样品非工作面对N、C原子的吸收; 直流电场的物理作用强化渗剂间的化学反应, 从而增加活性N、C原子或含N、C活性基团的产率与活性.     

基于CA-LBM模型的枝晶非对称生长行为研究

建立了用于模拟单相合金固溶体凝固过程温度场、流场、浓度场,以及微观组织模拟的二维元胞自动机-格子玻尔兹曼方法(cellular automaton-lattice Boltzmann method,CA-LBM)数值模型。对强制对流作用下不同工艺条件对枝晶非对称性生长(Dendritic asymmetrical growth,DAG)行为的影响进行了研究。模拟结果表明,与不计入流动过程的纯扩散型合金凝固模拟结果相比较,强制对流造成枝晶非对称性生长行为,且枝晶的凝固效率增加;当工艺条件改变时,枝晶非对称性生长行为也会随之发生变化,表现为初始过冷度越小、对流速度越大、冷却速率越小会使枝晶非对称性生长行为趋向更强。     

电场对A1—4％Si亚共晶合金凝固组织的影响

研究了不同电流密度下直流电场、交流电场对A1-4%Si亚共晶合金凝固组织的影响。结果表明,直流电场、交流电场都使合金初生相α-Al枝晶间距和晶粒大小产生变化,直流电场下随着电流密度的增加枝晶间距和晶粒逐渐减小,在电流密度达到最大值32.5mA/mm2时,枝晶间距和晶粒最为细小;交流电场下随着电流密度的增加,α-Al枝晶间距和晶粒也经历了一次细化过程。枝晶间距和晶粒的细化使合金的力学性能提高。     

模拟工业环境下直流电场对金属Zn腐蚀机理的影响

采用失重法,电化学测试技术,X射线衍射(XRD)并结合扫描电镜(SEM)研究了模拟工业环境下直流电场对金属Zn在30 d内腐蚀行为的影响。结果表明,模拟工业环境下,在一定暴露时间内,直流电场强度越大,Zn的腐蚀速率越大。随着直流电场的介入,Zn的阴极还原过程与阳极溶解过程均有提高,从而腐蚀速率增加。直流电场对于Zn腐蚀行为的影响本质上归结于电场对溶液中离子分布的影响,进而改变了腐蚀产物的结构,促进了腐蚀过程的进行。     

Effect of direct current electric field on atmospheric corrosion behavior of copper under thin electrolyte layer

A thin layer electrochemical cell was successfully developed to study the atmospheric corrosion behavior of copper film in printed circuit board (PCB-Cu) under thin electrolyte layer (TEL) and direct current electric field (DCEF) by electrochemical impedance and electrochemical noise analysis. The electrochemical measurements and SEM morphologies after corrosion test indicate that DCEF decreases the corrosion of PCB-Cu under TEL. The corrosion rate and probability of pitting corrosion of PCB-Cu under DCEF decrease due to the electric migration of aggressive Cl⁻ ion out of working electrode surface.     

The effects of temperature and electric field on atmospheric corrosion behaviour of PCB-Cu under absorbed thin electrolyte layer

The effects of temperature and electric field on atmospheric corrosion behaviour of PCB-Cu under absorbed thin electrolyte layers were investigated by cathodic polarization and electrochemical impedance spectroscopy. Results indicate that the cathodic current density increases with increasing temperature, but decreases with increasing intensity of electric field. Electric field reduces the corrosion rate of PCB-Cu due to the aggressive ions migrating out from PCB-Cu electrode surface under the effect of electric field. When the ions can not freely migrate out from PCB-Cu electrode surface, local enrichment of aggressive ions under the electric field will cause serious localized corrosion of PCB-Cu.     

热带雨林环境中霉菌对PCB-Cu腐蚀行为的影响

目的 研究PCB-Cu在热带雨林环境下的霉菌腐蚀行为。方法 利用平板培养法筛选出PCB表面出现频率较高的两株真菌Fusarium solani和Daldinia eschscholtzii。利用干重法研究Cu2+对其生理活性的影响,利用扫描电子显电镜观测PCB-Cu表面的生物成膜情况,并利用动电位极化曲线研究其腐蚀电化学行为。 结果 两株真菌在6天时,均能在PCB-Cu表面形成生物膜,且在菌丝密集处,出现腐蚀产物的堆积。同时,薄液膜内Cu2+浓度的升高能抑制菌体的繁殖。相比于无菌组,两株菌株均能够在前期抑制PCB-Cu自腐蚀电位Ecorr的升高,在后期抑制PCB-Cu自腐蚀电位Ecorr的降低。结论 霉菌孢子接种到PCB-Cu表面后,由于初期PCB-Cu表面薄液膜中的Cu2+含量较少,对菌体的抑制作用较低,因此菌体活性较好,其分泌物抑制了PCB-Cu表面氧化膜的生成,从而在初期促进了PCB-Cu的腐蚀。但随着腐蚀反应的进行,PCB-Cu表面薄液膜中Cu2+浓度逐渐升高,菌体的活性受到抑制,因此腐蚀性分泌物含量下降,而此时附着在PCB-Cu表面的生物膜对基体起到了保护作用,从而开始抑制腐蚀。     

Effects of electrolyte thickness,chloride ion concentration,and an external direct current electric field on corrosion behaviour of silver under a thin electrolyte layer

ABSTRACT

Effects of electrolyte thickness, chloride ion concentration, and an external direct current electric field (DCEF) on the corrosion behaviour of silver under a thin electrolyte layer (TEL) were investigated using electrochemical and surface techniques. The results indicate the corrosion rate of silver increases with the decrease of TEL thickness and the increase of chloride ion concentration. Moreover, an interesting conclusion was drawn that the corrosion rate of silver near the positive plate of DCEF first increases and then decreases with the increase of electric field intensity. In a DCEF, different polarisation behaviours of silver at different positions were attributed to the differences of the local corrosion environment.     

霉菌对裸铜和镀金处理的印制电路板腐蚀行为的影响

采用扫描Kelvin探针测试技术研究了裸铜印制电路板(PCB-Cu)和无电镀镍金处理印制电路板(PCB-ENIG)在霉菌作用下的腐蚀行为,通过体视学显微镜、扫描电镜和能谱分析对PCB的腐蚀和霉菌生长情况进行了观察和分析.结果表明,在湿热环境下霉菌在2种材料表面均能良好生长并且数量逐渐增加,28 d完成一个生长代谢周期且分生孢子活性良好;84 d后试样表面都出现了腐蚀产物,PCB-ENIG腐蚀更为严重.霉菌的生长代谢作用在一定程度上能抑制PCB-Cu表面霉菌生长区域的腐蚀,但是对PCB-ENIG的微孔腐蚀起促进作用.     

The effects of Cl ion concentration and relative humidity on atmospheric corrosion behaviour of PCB-Cu under adsorbed thin electrolyte layer

The effects of Cl⁻ ion concentration and relative humidity on atmospheric corrosion behaviour of PCB-Cu under adsorbed thin electrolyte layer were investigated by cathodic polarization curves and electrochemical impedance spectroscopy. Results indicated that the cathodic process of PCB-Cu corrosion was dominated by the reduction of oxygen and corrosion products. The cathodic current density increased with increasing relative humidity and Cl⁻ ion concentration. The corrosion rate was initially dominated by oxygen reduction, but at the later stage of corrosion, the anodic process began to affect the corrosion rate due to the accumulation of corrosion products.     

不同强度恒定磁场下杂色曲霉对PCB-Cu腐蚀行为的影响

目的 研究不同强度恒定磁场下杂色曲霉对PCB-Cu的腐蚀行为与机理.方法 对PCB-Cu试样表面喷涂孢子悬浮液,沿垂直于试样表面方向分别施加不同恒定强度的磁场.采用3D共聚焦显微镜、扫描电子显微镜(SEM)、能谱分析仪(EDS)、拉曼光谱仪,研究杂色曲霉的生长状况,分析表面腐蚀形态和产物组成.采用扫描开尔文探针(SKP)测试分析PCB-Cu上的表面电势变化.结果 通过观察表面形貌可以明显看出,无磁场组霉菌生命活动更旺盛,并且磁场强度越高,对霉菌生长的抑制作用越强,这使得霉菌孢子数量减少、生长状况变差.磁场影响霉菌生长和腐蚀性离子的迁移,在恒定强度为15 mT时,出现腐蚀拐点.通过对腐蚀产物的成分进行测定,表明腐蚀产物成分存在不同,无磁场区比磁场区的O、Cl含量更高.结论 磁场主要通过影响霉菌生长对PCB-Cu的腐蚀起到抑制作用,但是磁场也会影响离子的迁移,进而加速电化学腐蚀,在磁场强度为15 mT时,腐蚀程度最轻微.无磁场的腐蚀产物主要由CuO、少量的Cu2O和铜的氯化物组成,施加磁场后,CuO和铜的氯化物成为主要腐蚀产物.     

Corrosion behaviour of NiTi endodontic instruments

Abstract

The present study investigates the influence of the sterilisation treatment conducted at 50°C in 5% sodium hypochlorite solution (NaClO) on the corrosion behaviour of endodontic instruments made of NiTi (GT Rotary and K3) and stainless steel (K file) by measuring potentiodynamic polarisation curves in the same environment at 37°C. For comparison, the electrochemical characterisation was also carried out on endodontic instruments that were not sterilised. The characterisation of the sample surface after the electrochemical tests were carried out by means of scanning electron microscopy coupled with X-ray energy dispersive spectroscopy. There was no significant influence of the sterilisation treatment on the corrosion behaviour of K file and GT Rotary endodontic instruments. However, a negative influence of the sterilisation treatment on the corrosion resistance of K3 endodontic instruments was observed, and the effect appears to be more dramatic for longer sterlisation treatment periods.     

Influence of temperature and chloride ion concentration on the corrosion behaviour of Mg–4Al–3Ca–0.5RE alloy

The influence of temperature and chloride ion concentration on the corrosion behaviour of Mg?4Al?3Ca?0.5RE alloys were studied in this paper. Corrosion rates of the alloys were measured by weight loss test and electrochemical measurement. The results revealed that a shorter incubation period to the onset of corrosion, a more negative corrosion potential, and a higher corrosion rate was correlated with a higher temperature in 3% NaCl solution and a higher chloride ion concentration at 30°C. The corrosion behaviour of the alloys was affected by surface film and the corrosion mainly occurred at the breaks or defects in surface films.     

Investigation of the influence of iron-containing abrasives on the corrosion behaviour of the aluminium alloy AlSi1.2Mg0.4

The corrosion resistance of aluminium surfaces is closely linked to the surface state after a grinding process. For years, iron-containing abrasive materials were suspected to lead to increased corrosion susceptibility after processing of aluminium surfaces. To prove a possible correlation between the iron content of an abrasive and the corrosion behaviour of aluminium components, scientific investigations and experimentally practical corrosion tests are necessary. For the current investigation, specimens of a technical Al-Si alloy from the same batch were used. The test specimens were mechanically ground with various resin-bonded model abrasives containing different iron contents. The performed corrosion tests did not reveal a negative influence of the different iron-containing abrasives on the corrosion behaviour of the Al–Si alloy. However, the most sensitive measuring method (electrochemical noise) showed differences in the surface activity depending on the type of abrasive.