金纳米活化陶瓷化学镀铜

陶瓷表面经传统钯液活化后化学镀铜层的结合力受Sn2＋的影响,且操作麻烦,污染环境,生产成本高。为此,制备了具有催化活性的金纳米液,并将其用于陶瓷化学镀铜前的活化。通过SEM,EDS,XRD及结合力测试讨论了镀液成分、温度及装载量对沉积速度的影响,确定了金纳米活化陶瓷后的最佳化学镀铜工艺参数,并将其与传统钯活化陶瓷化学镀...     

4 μm SiC颗粒表面化学镀铜工艺

为了增强微米级SiC陶瓷颗粒与金属基体的结合力,采用化学镀铜法对SiC颗粒表面进行了改性处理,使SiC颗粒在金属基体液中分散更均匀、镀覆更好。通过正交试验法优化了化学镀铜工艺的主要参数,研究了其主要工艺条件对化学镀铜的影响;分别通过JSM7500F,S-3400N扫描电镜(SEM)对微米级SiC颗粒镀铜前后的表观形貌进行了观察分析,利用X射线衍射仪(XRD)对其镀铜前后的组成进行了表征,并测试了镀铜层与SiC颗粒的结合力;同时对比了微米级SiC颗粒镀铜前后对锌基复合材料微观形貌的影响;讨论了镀液中配位剂、pH值、还原剂等对铜镀层的影响。结果表明:随着镀液中配位剂、还原剂含量的增加,单位时间内微米级SiC颗粒表面镀铜层的质量先增加后降低,pH值的升高显著降低了镀铜的诱导时间;可实现微米级SiC颗粒表面化学镀铜层的均匀镀覆,且结合良好。     

纯钛超声微弧氧化-化学镀铜涂层的制备及抗菌性

为了赋予纯钛口腔种植体表面涂层生物活性及抗菌性,发挥酸蚀、微弧氧化技术、碱处理及化学镀铜技术各自优势,在TA2纯钛表面制备载铜生物涂层。研究了镀铜时间和温度对载铜含量及涂层表面形貌、结合力和抗菌性的影响。结果表明:钛基体酸蚀获得表面腐蚀均匀的微纳米结构,为超声微弧氧化提供了更多的氧化物生长空间;钛超声微弧氧化涂层碱处理使陶瓷层Ti O2活化,并利于载铜;利用多孔涂层进行化学镀铜时,涂层中铜元素含量随化学镀铜温度的升高和时间增长而增大,而涂层结合力随着化学镀铜时间增长而下降;50℃下化学镀铜3 min时,涂层抗菌率为98.3%,表面铜含量适宜,载铜破坏生物膜的形成使细菌黏附的微环境发生改变,造成细菌难以正常生长,实现了抗菌效果。     

导电陶瓷Ti3SiC2颗粒表面无敏化活化的化学镀铜

利用无敏化、活化的化学镀覆技术能成功地在Ti3SiC2颗粒表面均匀地化学镀铜.实验表明:镀前对陶瓷颗粒进行严格的粗化处理,使其表面具有很强的催化中心,通过采用合适的镀液配方和工艺,能成功地在Ti3SiC2颗粒表面镀覆一层铜,从而增强了陶瓷Ti3SiC2颗粒和铜基体之间的界面结合力,为Ti3SiC2在复合材料领域中的应用开辟了更广阔的前景.     

超声波对聚氨酯泡沫塑料化学镀铜的影响

为了研究超声波对泡沫塑料化学镀铜的影响,比较了聚氨酯泡沫塑料在以Sn-Pd活化后直接加超声波进行化学镀铜以及在形成连续铜层的基础上施加超声波进行化学镀铜的效果.结果表明:直接在连续铜层上施加超声波不但可缩短镀铜诱导期,而且使镀速加快、施镀深度加大,并随超声波功率增加,铜层增重加快变缓.而在聚氨酯上未形成连续铜层前,在预处理以PdCl2敏化的基础上施加超声波,早期可将钯核震掉影响镀速,从而确定了施加超声波的时间至少在预镀5min后进行.     

石墨粉化学镀铜工艺的研究

在石墨粉表面化学镀铜,以解决金属-石墨复合材料制造中的界面结合力问题并提高其综合性能.由于石墨粉具有微小疏水、表面惰性的性质,对其镀铜很困难.以CuSO4为主盐,锌粉为还原剂,分别研究了4种添加剂:A(烷基苯磺酸盐)、B(烷基磺酸盐)、C(十二烷基脂肪酸盐)和D(十二烷基脂肪酸盐 醋酸钠)对石墨粉镀铜的影响.结果表明,D型添加剂最有利于石墨粉化学镀铜;扫描电镜观察镀铜石墨层发现,镀层和石墨结合良好.     

化学镀铜前碳纤维预处理的研究

碳纤维具有疏水性和表面惰性,很难直接镀铜.为此,研究了碳纤维表面的预处理工艺、条件等技术参数.结果表明:高温灼烧除胶、过硫酸铵氧化、氯化银活化较好地改善了碳纤维的疏水性,大大提高了碳纤维表面的粗糙度,使碳纤维表面具有了催化活性.预处理后的碳纤维进行化学镀铜,其镀层光亮、均匀、致密,与基体的结合力较好.     

PZT压电陶瓷表面局部化学镀铜-镉合金

研究了PZT压电陶瓷表面局部化学镀覆Cu-Cd合金电极的新工艺、新型活化钯液及其简单活化操作,测定了镀层的主要性能。     

SiC粉体化学镀铜前的铁盐活化工艺

为了实现Si C粉体化学镀前的无钯活化,采用铁盐的乙醇溶液对Si C粉体进行活化,通过单因素试验研究了活化液中铁盐含量、硼氢化钠的含量、活化温度和p H值等对Si C粉体表面铜沉积量的影响。采用扫描电镜(SEM)对Si C粉体包覆前后的表观形貌进行了观察,通过X射线衍射仪(XRD)获得了包覆前后Si C粉体的组成,并对活化粉体化学镀铜后镀层的结合力进行测试。结果表明:经过铁盐活化后Si C表面吸附上了铁微粒,化学镀处理后在其表面沉积了一层铜,其结合力符合要求;最佳活化工艺条件为5.0 g/L硝酸铁,3.0 g/L硼氢化钠,p H值12.5,温度20℃。     

激光微加工对陶瓷表面化学镀铜的影响研究

采用扫描电镜(SEM)、X射线光电子谱(XPS)、X射线衍射能谱仪(XRD)等手段比较激光微加工处理前后陶瓷表面形貌发生的变化,探讨了激光微处理在陶瓷表面无敏化活化化学镀铜工艺中的作用.结果表明,陶瓷基底经激光处理后,其表面成分并未发生改变,但其表面活性增强,从而促进了化学镀铜反应的进行.     

微米级铜粉化学镀银及抗氧化性分析

采用化学镀的方法在微米级铜粉表面镀银.用X射线衍射法(XRD)和热重分析法(TG)测定了铜-银粉的物相和抗氧化性,比较了由镀前有无活化的铜粉所制备的两种金属粉体的性能,最后用X射线荧光光谱仪对两种粉体的表面元素和含量进行测定.结果表明镀银能明显提高铜粉抗氧化性,而镀前经活化的铜粉具有更好的活性,银在铜粉表面含量达到93.27%.     

镍/陶瓷复合膜的制备及表征

采用镍盐浸渍-液相化学还原法对氧化铝支撑体进行镍活化,再采用化学镀制备得到镍/陶瓷复合膜.采用XRD,SEM-EDS及气体渗透等方法表征镍/陶瓷复合膜的表面微结构、形貌及分离性能.结果表明:采用镍活化-化学镀过程可成功制备厚度较均匀的镍/陶瓷复合膜,在渗透压差0.08 MPa、室温的条件下,H2/N2分离因子为3.8.     

ADHESION STRENGTH OF ELECTROLESS NICKEL DEPOSITS ON ALUMINA CERAMIC SUBSTRATE

Alumina ceramics are. widely used for LSI packages and printed circuit and sensor materials. For many of these applications, metallization of the surface is required. In general,this is performed by applying a conductive paste on the ceramic surface

An alternative approach is the subject of this paper. A wet process involving etching, catalytic activation, and electroless plating was investigated to deposit a nickel film with excellent adhesion. To obtain good adhesion of electroless nickel on alumina ceramics, ammonium fluoride etching, stannous chloride sensitizing and palladium chloride activation were used sequentially as preplating treatments. A dilute nickel bath with a 1:4 molar ratio of Ni to hypophosphite and a pH of 6 was optimal. Purging the bath with an inert gas improved nickel adhesion.     

光选择性活化无电解电镀在ABS树脂上沉积金属铜线路

在绝缘材料表面涂布活化催化膜,通过光选择性活化,然后在无电解电镀溶液中沉积金属电路是高密度封装和３－维ＭｌＤ关最理想的方法之一,,但目前所采用的光源多,使用波长均在３００ｎｍ以下,大规模实用有一定困难。本工作选择了３种Ｐｄ盐作为活性催化剂,研究使用紫外光１－线和ｇ－线在ＡＢＳ树脂上沉积铜线路的方法。实验结果表明,Ｐｄｌ２具有对紫外光敏感性,单独用作活化催化剂时可在ＡＢＳ上沉积负性金属铜图形,当它和     

3D Printing of Ceramics with Controllable Green-Body Configuration Assisted by the Polyvinyl Alcohol-Based Physical Gels

Additive manufacturing of ceramics has received intense attention. In particular, 3D-printed ceramics with customized shapes are highly desirable in the chemical industry, aerospace, and biomedical engineering. Nevertheless, developing a simple and cost-effective process that shapes dense ceramics to complex geometries remains challenging because of the high hardness and low ductility of ceramic materials. Extrusion-based printing, such as direct ink writing (DIW), often requires supporting materials that pose additional difficulties during printing. Herein, a simple approach is developed to produce stretchable ceramic green bodies of zirconia and alumina for DIW. The ink is composed of polyvinyl alcohol (PVA) and an aqueous suspension of ceramic powders. Besides the colloidal network formed by the ceramic particles, PVA plays an important role in tuning the printability of the aqueous ink. Through a freeze-thaw process, PVA crystallizes to form physical networks. This strategy provides highly stretchable hydrogel green bodies that can be reprogrammed to complex geometries difficult for common DIW printing. The subsequent drying, debinding, and sintering processes produce ceramics with dense structures and fine mechanical properties. In short, this work demonstrates an efficient method for the DIW of ceramic parts that can be reprogrammed to complex geometries.     

Study of a pre-treatment process for electroless copper plating on ceramics

In this paper, a pre-treatment process for electroless copper plating on the ceramics was explored. Due to the catalytic activity of gold nanoparticles, the traditional three-step coarsening-sensitization-activation pre-treatment process has been optimized to a two-step coarsening-activation process. In our study, the following results were observed: electroless copper coating on the ceramics was formed after activating the substrate by gold nanoparticles; a more flat and compact nano-composite coating was also obtained by adding gold nanoparticles to the plating solutions. The mechanisms of pre-treatment and composite plating with gold nanoparticles were discussed.     

DNA-templated copper nanowire fabrication by a two-step process involving electroless metallization

Here, we report a new fabrication method of DNA-templated copper nanowires. The copper nanowires were fabricated via two-step reactions. First, Pd(II) ions were electrostatically adsorbed onto negatively charged DNA molecules immobilized on the substrate surfaces and reduced chemically. As a result, palladium nanowires with a diameter of approximately 6 nm were obtained. Second, the palladium nanowires were dipped into a copper electroless plating bath. Electroless deposition of copper proceeded specifically on the palladium nanowires. The diameters of the copper nanowires were controlled by the plating time.     

Al2 O3 陶瓷表面金属化

为了提高陶瓷与金属覆盖层的结合强度,较系统地研究了Al2O3(96%)陶瓷表面金属化过程,研究内容包括:陶瓷的表面刻蚀、表面催化、化学沉积条件等,综合分析了金属化层与陶瓷基体之间结合强度的影响因素,研究发现在熔融的NaOH浴中,可获得最佳刻蚀表面形貌,Al2O3(96%)陶瓷基片上化学镀层的最佳结合强度为25.0～32.5 MPa.为开发性应用提供了建设性的意见.