高灵敏度CMOS光电集成接收机设计

设计了一个由调节型级联跨阻抗放大器(TIA)和双光电二极管(DPD)构成的CMOS光电集成(OEIC)接收机.具体分析了这个光电集成接收机的噪声和灵敏度及其相互关系.接收机中的噪声主要是电路中电阻的热噪声和MOS器件的闪烁噪声.提出了优化接收机灵敏度的方法.通过低成本的CSMC 0.6μm CMOS工艺流片并对芯片进行了测试.从测试眼图可知,该CMOS光电集成接收机可工作在1.25GB/s的传输速率下,灵敏度为-12dBm.     

Long-wavelength PINFET receiver OEIC on a GaAs-on-InP heterostructure

A long-wavelength PINFET OEIC has been fabricated on a GaAs-on-InP heterostructure for the first time. A receiver sensitivity as high as ?31 dBm for 600Mbit/s NRZ has been obtained. The great potential of the GaAs-on-InP hetero-structure for high-performance, long-wavelength OEIC applications has been demonstrated.     

A proposed OEIC receiver using MESFET photodetector

An optical receiver configuration based on the concept of using a single optically gated metal-semiconductor-fieid-effect transistor (MESFET) to perform the function of a photodetector and preamplifier has been introduced. The proposed optoelectronic integrated circuit (OEIC) receiver has been analyzed theoretically. A simplified noise model of the receiver has also been developed. Results have been presented for an OEIC receiver based on InGaAs MESFET supposed to be fabricated with matured InGaAs-InP MMIC technology. Theoretical results based on a simplistic noise model reveal that the proposed OEIC receiver has superior performance characteristics over the existing optical receivers     

Multigigabit/s 1.5 μm λ/4-shifted DFB OEIC transmitterand its use in transmission experiments

Optoelectronic integrated circuit (OEIC) transmitters consisting of 1.5 μm λ/4-shifted distributed feedback (DFB) lasers and InGaAs-InAlAs MODFETs were fabricated for the first time. The entire processing requires only two organometallic vapor-phase epitaxy (OMVPE) growths, with the potential for high yield and low cost. Direct modulation of the OEIC transmitter is demonstrated for bit rates up to 10 Gb/s. A transmission experiment using the OEIC transmitter and a hybrid p-i-n/HEMT receiver is conducted at 5 Gb/s, with a sensitivity of -20 dBm and a bit-rate-distance product of 145 Gb/s-km     

高速12路并行CMOS单片光电集成接收机设计与实现

设计并实现了一个高速12路并行CMOS单片光电集成接收机.其每一路都包括一个光探测器、一个跨阻放大器以及后续放大电路.双光电二极管(DPD)结构可以提高接收机速度,但同时降低了响应度.在跨阻放大器电路中采用有源电感来展宽-3dB带宽.通过无锡上华(CSMC)0.6μm CMOS工艺流片并对芯片进行了测试.测试结果显示该接收机单路传输比特率可达0.8～1.4 Gb/s,总的12路可传输15Gb/s数据.     

基于0.25μm MS/RF CMOS工艺的光电单片集成接收机设计

设计了一种单片集成的光电接收机芯片.在同一衬底上制作了基于同一工艺的光电二极管与接收机电路,以消除混合集成引入的寄生影响.这种单片集成接收机采用了先进的深亚微米MS/RF(混合信号/射频)CMOS工艺,利用这种新型工艺提供的新技术对原有光电二极管进行了改进,使其部分性能显著改善,并对整个光电集成芯片性能的提高有所帮助.     

Monolithically Integrated Optoelectronic Receivers Implemented in 0.25μm MS/RF CMOS

设计了一种单片集成的光电接收机芯片．在同一衬底上制作了基于同一工艺的光电二极管与接收机电路，以消除混合集成引入的寄生影响．这种单片集成接收机采用了先进的深亚微米MS／RF（混合信号／射频）CMOS工艺，利用这种新型工艺提供的新技术对原有光电二极管进行了改进，使其部分性能显著改善，并对整个光电集成芯片性能的提高有所帮助．     

A 3 GHz transimpedance OEIC receiver for 1.3-1.55 μm fiber-opticsystems

A high-performance metal-semiconductor-metal high-electron-mobility transistor (MSM-HEMT) transimpedance photoreceiver fabricated using OMCVD-grown InAlAs/InGaAs heterostructures on an InP substrate is discussed. This is the first demonstration of a monolithically integrated receiver amplifier that incorporates a cascode amplifier stage and a Schottky diode level-shifting stage implemented on InP-based optoelectronic integrated circuit (OEIC) photoreceivers. The transimpedance amplifier has an open-loop gain of 5.7 and a bandwidth of 3.0 GHz, which represent the highest gain and the highest speed performance reported for 1.3-1.55-μm-wavelength OEIC receivers     

1.2 Gbit/s, 52.5 km optical fibre transmission experiment usingOEICs on GaAs-on-InP heterostructure

High-performance, long-wavelength OEICs on a GaAs-on-InP heterostructure were fabricated. For the transmitter OEIC, high-speed operation up to 2.4 Gbit/s was achieved, and a receiver sensitivity as high as -26.0 dBm for a 1.2 Gbit/s NRZ signal was realised for the receiver OEIC. To confirm the usefulness of these OEICs for optical fibre networks, a 1.2 Gbit/s optical fibre transmission experiment was successfully carried out over a 52.5 km span     

11 GHz bandwidth optical integrated receivers using GaAs MESFET andMSM technology

State-of-the-art performance of GaAs-FET-based monolithic optoelectronic integrated circuit (OEIC) receivers is reported. The OEIC receiver achieves -3-dB bandwidth as high as 11 GHz for optical signals at a wavelength of 850 nm. The feedback resistance of the receiver is 1000 Ω and the effective transimpedance into a 50 Ω load is 565 Ω. The effective transimpedance-bandwidth (TZBW) product is 6.1 THz-Ω. This ultra-high-performance receiver was implemented via a high-yield, low-cost direct ion implanted GaAs MESFET technology with a 0.6-μm gate length and a metal-semiconductor-metal (MSM) detector with 2-μm lines×3-μm spacings     

Reading light-optoelectronics on indium phosphide

In the future every house could be served by a single optical fibre which will carry basic telephony plus a wide range of broadband services such as video, videophone and high definition TV. The author discusses optoelectronic circuits (OEIC) as cheap optical receiver components. The construction and operation of OEIC are described and the use of them in optical receivers is discussed     

A 10 Gbit/s OEIC photoreceiver using InP/InGaAs heterojunction bipolar transistors

Metal organic molecular beam epitaxy (MOMBE) was successfully used for the first time to realise a high speed monolithic photoreceiver. Incorporating an InGaAs pin photodetector followed by a transimpedance preamplifier circuit implemented with InP/InGaAs heterojunction bipolar transistors (HBTs), the OEIC photoreceiver had a bandwidth of 6 GHz and a midband transimpedance of 350 Omega . In a system experiment performed at 10 Gbit/s, the receiver exhibited a sensitivity of -15.5 dBm for a bit error rate of 10/sup -9/ at a wavelength of 1.53 mu m. This is the first demonstration of operation of a long wavelength OEIC photoreceiver at this speed.<>     

A 622 Mb/s high-sensitivity monolithic InGaAs-InP pin-FET receiver OEIC employing a cascode preamplifier

A long-wavelength monolithically integrated receiver optoelectronic integrated circuit (OEIC) comprising a low input-capacitance cascode transimpedance preamplifier and a p-i-n photodiode has been demonstrated. The OEIC is fabricated using metal-organic vapor phase epitaxy (MOVPE) grown epilayers and the beryllium ion-implantation technique. The receiver exhibits a sensitivity of -34.7 dBm at 622 Mb/s for BER-10/sup -9/. Using a cascode preamplifier reduces an input capacitance to about one-half of that of an inverter type, which results in the use of a larger feedback resistance of 16 k Omega . The combination of low input capacitance and large feedback resistance reduces the noise current of the receiver and results in high sensitivity.<>     

4×4 OEIC switch module using GaAs substrate

A compact 4×4 optical switch module consisting of a monolithic 4-channel OEIC receiver chip, a 4×4 GaAs IC chip, and a 4-channel OEIC transmitter chip has been developed for the first time. The module offers good performance, without an optical loss, a bandwidth of more than 600 MHz, and a crosstalk between neighboring channels of less than -20 dB. It has a good switching and distributive performance for high speed optical input signals of 560 Mbit/s. The switch module is attractive for use in high data-rate optical communication systems, particularly in local area networks, CATV systems, and intra-office links     

40-Gbit/s OEIC on GaAs substrate through metamorphic buffer technology

An optoelectronic integrated circuit operating in the 1.55-/spl mu/m wavelength range was realized on GaAs substrate through metamorphic technology. High indium content layers, metamorphically grown on a GaAs substrate, were used to fabricate the optoelectronic integrated circuits (OEICs) with -3 dB bandwidth of 40 GHz and 210 V/W of calculated responsivity. The analog OEIC photoreceiver consists of a 12-/spl mu/m, top-illuminated p-i-n photodiode, and a traveling wave amplifier (TWA). This receiver shows 6 GHz wider bandwidth than a hybrid photoreceiver, which was built using comparable, but stand-alone metamorphic p-i-n diode and TWA. With the addition of a buffer amplifier, the OEIC shows 7 dB more gain than the hybrid counterpart. To our knowledge, this is the first 40 Gbit/s OEIC achieved on a GaAs substrate operating at 1.55 /spl mu/m.     

High-performance Al/sub 0.48/In/sub 0.52/As/Ga/sub 0.47/In/sub 0.53/As MSM-HEMT receiver OEIC grown by MOCVD on patterned InP substrates

Reports the first demonstration of a new long-wavelength receiver OEIC comprising an AlInAs/GaInAs MSM detector and an AlInAs/GaInAs HEMT preamplifier. The layer structure was grown by LP-MOCVD on patterned InP substrates, which allowed independent optimisation of the MSM detector and HEMT preamplifier. The MSM detector showed the lowest leakage current yet reported and the HEMT exhibited a transconductance of 260 mS/mm. An excellent receiver response to 1.7 Gbit/s NRZ signals has been obtained.<>     

10 Gb/s OEIC optical receiver front-end and 3.125 Gb/s PHEMT limiting amplifier

A 10 Gb/s OEIC (optoelectronic integrated circuit) optical receiver front-end has been studied and fab ricated based on the φ-76 mm GaAs PHEMT process; this is the first time that a limiting amplifier (LA) has been designed and realized using depletion mode PHEMT. An OEIC optical receiver front-end mode composed of an MSM photodiode and a current mode transimpedance amplifier (TIA) has been established and optimized by simu lation software ATLAS. The photodiode has a bandwidth of 10 GHz, a capacitance of 3 fF/μm and a photosensitive area of 50×50 μm~2. The whole chip has an area of 1511×666 μm~2. The LA bandwidth is expanded by spiral inductance which has been simulated by software HFSS. The chip area is 1950×1910μm~2 and the measured results demonstrate an input dynamic range of 34 dB (10-500 mVpp) with constant output swing of 500 tnVpp.     

First heterodyne receiver frontend module including a polarizationdiversity receiver OEIC on InP

For the first time a packaged polarization diversity coherent receiver OEIC including detector units (photodetectors, JFET, load resistor) has been fabricated with the following data: waveguide loss 2 dB, 3 dB balance within 0.4 dB, polarization extinction >30 dB (TM) and >17 dB (TE), 3 dB cutoff frequency of 0.9 GHz, common mode rejection ratio 30 dB     

10～40Gb/s OEIC光接收机前端的最新研究进展

基于OEIC光接收机前端的集成方式和前放电路形式介绍了OEIC光接收机前端的最新研究进展.     

A monolithically integrated 1-Gb/s optical receiver in 1-μm CMOStechnology

Results of a monolithically integrated Si optical receiver for applications in optical data transmission and in optical interconnects with wavelengths of 638 and 850 nm are presented. The optoelectronic integrated circuit (OEIC) implementing a vertical p-type-intrinsic-n-type photodiode achieves a data rate of 1 Gb/s for 638 nm with a sensitivity of -15.4 dBm at a bit-error rate of 10^-9 . The sensitivity of this OEIC in a 1.0-μm CMOS technology is improved by at least a factor of four compared to that of published submicrometer OEICs. A 25-THz.Ω effective transimpedance bandwidth product of the implemented amplifier is achieved