纳米螺旋碳纤维表面金属涂层的制备

研究了在铁片试样上化学镀镍铁合金涂层的工艺,考察了主盐、还原剂对化学镀反应沉积速率的影响。利用此工艺在经过敏化、活化处理后的纳米螺旋碳纤维表面沉积出Ni-Fe-P合金涂层。采用能量色散X射线谱(EDS)分析得出涂层成分,利用扫描电子显微镜(SEM)观察涂层形貌。结果表明,可以在纳米螺旋碳纤维表面沉积连续、均匀的合金涂层。     

碳纳米管表面改性工艺参数优化试验研究

利用超声分散法对团聚的原始碳纳米管分散处理后,通过酸化、敏化、活化等步骤对其进行表面改性处理,采用表面化学镀在其表面镀覆镍层,并进行热处理.研究了碳纳米管的分散、表面改性和镀镍工艺对镀层质量的影响.实验结果表明：在乙醇溶液中,利用分散剂进行超声分散可以明显改善碳纳米管之间的团聚状况;经过酸化、敏化、活化处理后其表面可形成密集的活化点;镀镍温度在20℃左右,pH值约8.2时,所得镀层较为均匀,经410℃保温2 h的热处理后,镀层变得光滑、连续、致密,镀层的厚度为12～20 nm.     

碳酸钙粉体无钯活化化学镀银研究

采用无钯活化粉体化学镀技术制备了银包碳酸钙导电粉体.探讨了表面处理和PH值对沉积效果的影响,以及复合粒子的结合强度.通过扫描电镜(SEM),X射线能量色散谱仪(EDS)和X射线衍射(XRD)对复合粉体进行表面形貌分析和成分测试.结果表明:碳酸钙粉体经WD-50表面处理后,生成的银粒子粒径较小,对碳酸钙粒子的包覆均匀致密.随着镀液pH值的升高,银的析出量增大,粉体表观颜色变浅.调节镀液pH至13.0,得到了镀层结合强度高的银包碳酸钙复合粉体.     

镁合金电镀镍涂层的耐蚀性能

以化学镀镍作为保护层,对AZ91D镁合金进行直流电镀镍涂层以提高其耐腐蚀性能,并对镁合金表面两个不同厚度的镀镍涂层进行了比较.采用SEM对涂层的表面形态进行了研究.在X射线下纹理明显.镍涂层硬度约560VHN,远远高于AZ91D镁合金基底的硬度(约100VHN).电化学测量结果表明,在已经研究的镁合金涂层中,镍镀层有最低的腐蚀电流密度和最高的腐蚀电位.加速腐蚀实验中AZ91D镁合金镀镍具有很高的耐腐蚀性能.     

Ni-P/Al_2O_3复合镀层性能的表征与测试

为了提高镀层的耐磨性和硬度,在45碳钢基材上实施Ni-P/Al2O3化学复合镀,使纳米Al2O3微粒均匀分布于Ni-P基体中.研究了化学复合镀工艺条件和镀液组分对镀层性能的影响.镀件的耐蚀性实验和XRD分析表明:当硫酸镍25 g/L,次亚磷酸钠30 g/L,纳米Al2O3微粒加入量为5 g/L,乳酸20 mL/L和柠檬酸5 g/L,在pH=5.5,施镀温度为(85±2)℃,获得的Ni-P/Al2O3复合镀层表面光滑、胞状物致密,镀层的耐腐蚀性较高、硬度可达600HV,有利于得到综合性能较高的镀层.     

镍基纳米碳管/二氧化钛复合镀层的制备及性能

为了改善金属基材的表面性能,以钛铁矿为原料,利用微波等离子体化学气相沉积法制备了纳米碳管/二氧化钛复合粉体.采用复合电泳电沉积法在不锈钢基体表面制备了镍基纳米碳管/二氧化钛复合镀层;利用扫描电镜、X射线衍射仪、数显维氏硬度计和电化学测试等手段研究了纳米碳管/二氧化钛复合粉体对复合镀层结构和性能的影响.结果表明纳米碳管/二氧化钛复合粉体的加入有效地减小了复合镀层中镍的晶粒尺寸,促进了金属镍沿(111)晶面择优取向生长,改变了镍的电沉积层结构,提高了镀层的硬度,改善了镀层的耐腐蚀性能;在复合粉体的作用下,复合镀层的硬度与纯镍镀层相比提高了110%,腐蚀电位正移了23mV,腐蚀电流密度减少了0.991微安/平方厘米.     

纳米SiO2颗粒镍基复合刷镀层组织与磨损特性

应用电刷镀技术制备含有纳米SiO2的镍基复合镀层,测试了该镀层的显微硬度和摩擦磨损性能,分析了纳米陶瓷颗粒沉积量对镀层摩擦磨损性能的影响,研究了复合镀层表面形貌、陶瓷颗粒分布的特点．试验结果表明,纳米陶瓷颗粒复合镀层比快镍镀层具有更高的显微硬度和良好的耐磨性．     

Al及Al合金化学镀Ni-P工艺及性能研究

研究了铝及铝合金表面化学镀Ｎｉ－Ｐ合金的预处理、镀液配方及镀后热处理。经除油、酸洗两道工序处理后,在铝及铝合金表面上直接进行酸性化学镀Ｎｉ－Ｐ合金,镀速最快可达到３２．５μｍ／ｈ,镀层光亮美观。经技术保护后,在空气电阻炉中进行热处理,硬度达ＨＶ１１００～１２００。     

Electroless copper-phosphorus coatings with the addition of silicon carbide （SiC） particles

Cu-P-silicon carbide(SiC)composite coatings were deposited by means of electroless plating.The effects ofpH values,temperature,and different concentrations of sodium hypophosphite(NaH2PO2·H2O),nickel sulfate(NiSO4·6H2O),sodium citrate(C6H5Na3O7·2H2O)and SiC on the deposition rate and coating compositions were evaluated,and the bath formulation for Cu-P-SiC composite coatings was optimised.The coating compositions were determined using energy-dispersive X-ray analysis(EDX).The corresponding optimal operating parameters for depositing Cu-P-SiC are as follows:pH 9; temperature,90℃; NaH2PO2·H2O concentration,125 g/L; NiSO4·6H2O concentration,3.125 g/L; SiC concentration,5 g/L; and C6H5Na3O7·2H2O concentration,50 g/L.The surface morphology of the coatings analysed by scanning electron microscopy(SEM)shows that Cu particles are uniformly distributed.The hardness and wear resistance of Cu-P composite coatings are improved with the addition of SiC particles and increase with the increase of SiC content.     

Ni-P-Cr_2O_3化学复合镀工艺及稀土的影响

研究了Ni P Cr2 O3 化学复合镀工艺及稀土对复合镀工艺及第二相粒子沉积量的影响 .结果表明 :Ni P Cr2 O3 复合镀的最佳工艺参数为 :Cr2 O3 :10 g/L、温度 :86± 2℃ ,pH值 :4 .7± 0 .1.此条件下镀速为15～ 16 μm/h ;沉积量为 2 4 .2 % .稀土能与Ni、P共沉积 ,对镀层起到微合金化的作用 ,同时提高了第二相粒子的沉积量 .当稀土的加入量为 2 0～ 2 5mg/L时 ,Cr2 O3 的沉积量增加了 1倍多 .     

酸性镀液铝合金表面沉积Ni-Mo-P三元合金非晶镀层

采用酸性化学镀液在铝合金表面沉积Ni-Mo-P三元合金非晶镀层。利用透射电镜（TEM）、场发射扫描电镜（FESEM）、X射线衍射分析（XRD）、能谱（EDS）等现代分析手段,对镀层显微结构进行了表征,探讨了钼酸钠浓度和热处理对镀层纳米压痕硬度的影响。结果表明,镀态下,化学镀Ni-Mo-P三元合金镀层为致密非晶态镀层,镀层中Mo元素分布均匀,镀层与基体结合良好。热处理可促使非晶镀层晶化,产生Ni和Ni3P晶相,获得了纳米压痕硬度为15.12 GPa的最大值。     

Ni系非晶态合金膜的晶化过程与吸氢性能（Ⅱ）——Ni系非晶态膜的XPS和XAES表征

利用改进的化学镀镍技术,制备了对氢具有高选择性和透过性Ni基非晶态合金膜,并通过XPS和XAES手段对Ni-P非晶态合金膜表面进行了考察。结果表明,Ni-P合金表面物种,Ni以Ni_2O_3,而P以P~(5+)的形式存在,体相以元素态Ni~0和P~0存在为主。Ni-P合金膜经高温晶化后,P由体相向表面扩散。     

Ni—Cu—P镀层在氢氟酸溶液中的耐蚀性研究

为了改善20R钢在氢氟酸介质中的耐蚀性,采用化学镀技术在该材料表面制备了Ni—Cu—P三元合金镀层。通过金相显微镜和X射线衍射观察和分析了镀层的表面形貌和组成,通过浸泡法、电化学系统测试了20R钢和镀层在氢氟酸溶液中的腐蚀性能。结果表明：Ni—Cu—P镀层能顺利地在20R钢表面发生沉积,镀层光滑、致密、无裂纹,阻隔了氢氟酸与20R钢的直接接触。镀层在氢氟酸溶液中更容易发生钝化,具有一定的耐蚀性能。     

镁合金表面HA/CNTs涂层的制备及电化学性能研究

为了提高生物镁合金羟基磷灰石(HA)涂层的耐蚀性能,在微弧氧化电解液中加入羟基磷灰石/碳纳米管(HA/CNTs)复合粉体添加剂,制备HA/CNTs复合涂层。分别对制备的HA/CNTs复合粉体和HA/CNTs复合涂层进行表面形貌和物相组成分析,并对HA/CNTs复合涂层在模拟体液(SBF)中的耐腐蚀性能进行了研究。结果表明,HA/CNTs复合粉体在微弧氧化过程中能均匀地沉积在镁合金表面,结晶良好且无任何杂质;与HA涂层相比,HA/CNTs涂层具有较小的腐蚀电流密度值和较大的阻抗值。此外,在SBF中浸泡4d后,HA/CNTs复合涂层表面出现大量的亚微米级颗粒产物且没有任何腐蚀裂纹。     

Effect of attapulgite added in plating bath on the properties of Ni/TiC nano-composite coatings

Pure copper plates were coated by Ni-TiC dipulse current plating method. The effects of adding different concentration(ranging from 0.5 g/L to 3.0 g/L) of attapulgite nano particles to the plating bath on the surface morphology, wear resistance, and oxidation resistance of Ni/TiC/Attapulgite nano-composite coatings were investigated. The experimental results show that the composite coating is flat and compact with adding 3.0 g/L in the bath, and the coating preferred orientation is changed from the planes (111) to (200). The coefficient of the composite coatings decreases from 0.68 to 0.18 with increasing content of attapulgite in the bath, a mixed mode of adhesive-abrasive wear occurs for all coatings, and the wear mechanism shows a transition from adhesive-abrasive to predominantly abrasive wear mechanism when the concentration of attapulgite is beyond 1.5 g/L in electrolyte. The oxidation resistance of composite coatings is the best prepared when adding attapulgite particles at 0.5 g/L in the bath, the oxide mainly consists of a NiO phase by X-ray analysis.     

Fabrication of W@Cu composite powders by direct electroless plating using a dripping method

A direct electroless copper (Cu) coating on tungsten powders method requiring no surface treatment or stabilizing agent and using glyoxylic acid (C₂H₂O₃) as a reducing agent was reported. The effects of copper sulfate concentration and the pH of the plating solution on the properties of the prepared W@Cu composite powders were assessed. The content of Cu in the composite powders was controlled by adjusting the concentration of copper sulfate in the electroless plating solution. A uniform, dense, and consistent Cu coating was obtained under the established optimum conditions (flow rate of C₂H₂O₃ = 5.01 mL/min, solution pH = 12.25 and reaction temperature 45.35 °C) by using central composite design method. In addition, the crystalline Cu coating was evenly dispersed within the W@Cu composite powders and Cu element in the coating existed as Cu0. The formation mechanism for the W@Cu composite powders by electroless plating in the absence of surface treatment and stabilizing agent was also proposed.     

Growth behavior of electroless copper on silicon substrate

The growth behavior containing deposit morphology, growth rate, activation energy, and growth mechanism of copper on silicon substrate, especially at the initial stage, in the electroless plating process was studied. Copper was deposited on the surface of the silicon substrate in an electloless plating bath containing formalin （CH2O 37vol%） as a reducing agent at a pH value of 12.5 and a temperature of 50-75℃. The copper deposit was characterized using a field emission scanning electron microscope and transmission electron microscope. The results showed that after the activation process, nanoscale Pd particles were distributed evenly on the surface of the silicon; in the deposition process, copper first nucleated at locations not only near the Pd particles but also between the Pd particles; the growth rate of electroless Cu ranged from 0.517 nm/s at 50℃ to 1.929 nm/s at 75℃. The activation energy of electroless Cu on Si was 52.97 kJ/mol.     

Electroless plating composite coatings of Ni-Ti-Re on the surface of diamond

Ｄｉａｍｏｎｄｔｏｏｌｓａｒｅｍａｄｅｇｅｎｅｒａｌｙｔｈｒｏｕｇｈｔｈｅｐｏｗｄｅｒｍｅｔａｌｕｒｇｉｃａｌｓｉｎｔｅｒｐｒｏｃｅｓ．Ｉｔｉｓｏｂｖｉｏｕｓｔｈａｔｔｈｅｉｎｔｅｒｆａｃｅｅｎｅｒｇｙｂｅｔｗｅｎｔｈｅｄｉａｍｏｎｄａｎｄｏｒｄ...     

金刚石表面化学镀Ni-P的研究

对金刚石表面化学镀Ni-P工艺进行了研究，用X射线衍射仪进行了物相鉴定，结果表明：高P化学Ni-P镀层为非晶态，热处理后镀层转变为Ni3P晶态结构．同时证明：Ni-P镀层与金刚石没有发生界面反应．扫描电镜分析表明：Ni-P镀层与金刚石之间的结合状态良好；研究对镀液成分控制和施镀工艺进行了分析．     

Fe^2＋质量浓度对纳米晶Ni-Fe合金电沉积层耐蚀性的影响

采用直流电沉积技术在黄铜基体上制备出低Fe高Ni的纳米晶Ni-Fe合金镀层。研究不同Fe2＋质量浓度（2～12 g/L）对合金镀层的表面形貌、镀层成分、相结构、镀层显微硬度和耐蚀性的影响规律。实验结果表明,电镀Ni-Fe合金可获得纳米晶结构,当Fe2＋质量浓度为4 g/L时,硬度较高,为658 HV。在质量分数为3.5%的NaCl溶液中,Fe2＋质量浓度为4 g/L时,合金镀层的耐蚀性最好,自腐蚀电流密度较小,约为0.430μA/cm2,涂层电阻较大,约为143 400Ω,比基体黄铜提高约40倍。