Structure and properties of highly oriented polyoxymethylene/multi-walled carbon nanotube composites produced by hot stretching

Highly-oriented polyoxymethylene (POM)/multi-walled carbon nanotube (MWCNT) composites were fabricated through solid hot stretching technology. With the draw ratio as high as 900%, the oriented composites exhibited much improved thermal conductivity and mechanical properties along the stretching direction compared with that of the isotropic samples before drawing. The thermal conductivity of the composite with 11.6 vol.% MWCNTs can reach as high as 1.2 W/m K after drawing. Microstructure observation demonstrated that the POM matrix had an ordered fibrillar bundle structure and MWCNTs in the composite tended to align parallel to the stretching direction. Wide-angle X-ray diffraction results showed that the crystal axis of the POM matrix was preferentially oriented perpendicular to the draw direction, while MWCNTs were preferentially oriented parallel to the draw direction. The strong interaction between the POM matrix and the MWCNTs hindered the orientation movement of molecules of POM, but induced the orientation movement of MWCNTs.     

Electrical and thermal property enhancement of fiber-reinforced polymer laminate composites through controlled implementation of multi-walled carbon nanotubes

Aligned carbon nanotubes (CNTs) are implemented into alumina-fiber reinforced laminates, and enhanced mass-specific thermal and electrical conductivities are observed. Electrical conductivity enhancement is useful for electrostatic discharge and sensing applications, and is used here for both electromagnetic interference (EMI) shielding and deicing. CNTs were grown directly on individual fibers in woven cloth plies, and maintained their alignment during the polymer (epoxy) infiltration used to create laminates. Using multiple complementary methods, non-isotropic electrical and thermal conductivities of these hybrid composites were thoroughly characterized as a function of CNT volume/mass fraction. DC and AC electrical conductivity measurements demonstrate high electrical conductivity of >100 S/m (at 3% volume fraction, ∼1.5% weight fraction, of CNTs) that can be used for multifunctional applications such as de-icing and electromagnetic shielding. The thermal conductivity enhancement (∼1 W/m K) suggests that carbon-fiber based laminates can significantly benefit from aligned CNTs. Application of such new nano-engineered, multi-scale, multi-functional CNT composites can be extended to system health monitoring with electrical or thermal resistance change induced by damage, fire-resistant structures among other multifunctional attributes.     

Texture,transport and mechanical properties of graphite nanoplatelet/silicone composites produced by three roll mill

Thermally conducting and highly compliant composites for thermal interface applications were developed by dispersing graphite nanoplatelets (GNPs) in silicone polymer using a three-roll mill process. X-ray diffraction and electron microscopy showed that the roll mill produces composites with better dispersion of GNPs than previously achieved by speed and mechanical mixing. The roll mill also allows production of a composite at 25 wt.% GNP loading. The thermal conductivities of the composites reached 1.03 and 3.15 W/m K at 8 and 25 wt.% of GNPs, respectively, compared to 0.17 W/m K for silicone. Compression testing showed that the composites’ moduli increase by 1.5 times up to 20 wt.% loading but the strength and strain to failure decrease. The Shore hardness was similar or slightly lower to that of silicone. The composites are thus promising alternatives to the commercial thermal interface materials currently available.     

Enchanced high-temperature performances of SiC/SiC composites by high densification and crystalline structure

We report the enchanced in situ performances of tensile strength and thermal conductivity at elevated temperatures of the PCS-free SiC/SiC composite with a high fiber volume fraction above 50% fabricated by NITE process for nuclear applications. The composite was fabricated by the optimized combination of the fiber coating, the matrix slurry and the pressure-sintering conditions, based on our previous composites’ study history. The composite showed the excellent tensile strength up to 1500 °C, that it retained approximately 88% of the room-temperature strength. Also, the thermal conductivity of the composites represented over 20 W/m K up to 1500 °C, which was enough high to take the advantage of the assumed design value for nuclear applications. Microstructural observation indicated that the excellent high-temperature performances regarding tensile strength and thermal conductivity up to 1500 °C were the contribution to the high densification and crystalline structure in matrix.     

Effect of coating on the microstructure and thermal conductivities of diamond-Cu composites prepared by powder metallurgy

Diamond-Cu composites from the direct combination of diamond and Cu show low thermal conductivities due to weak interface and high thermal resistance as a result of chemical incompatibility. In this paper, a new method is proposed to strengthen interfacial binding between diamond and Cu by coating strong carbide-forming elements, e.g., Ti or Cr on the surface of the diamond through vacuum micro-deposition. Interfacial thermal resistance of diamond-Cu composites is greatly decreased when diamond particles are coated by a Cr or Ti layer of a certain thickness before combining with Cu. Thermal conductivity is also increased several times. Cr coating can reduce more effectively interface thermal resistance between diamond and Cu than Ti coating. Moreover, it has a smaller negative impact on the thermal conductivity of the Cu matrix, resulting in higher thermal conductivity of Cr-coated diamond-Cu composites. Through the vacuum micro-deposition technology, Cr on the diamond particle surface is present in the form Cr₇C₃ near diamond and a pure Cr outer layer at 2:1. The optimum thickness is within 0.6-0.9 μm; at this depth, the thermal conductivities of 70 vol% diamond-Cu composites can be increased four times and reach as high as 657 W/m K. In this work, an original theoretical model is proposed to estimate the thermal conductivities of composite materials with an interlayer of a certain thickness. The predicted values from this model are in good agreement with the experimental values.     

Elevated temperature tensile properties and thermal expansion of CNT/2009Al composites

1.5 vol.% and 4.5 vol.% carbon nanotubes reinforced 2009Al (CNT/2009Al) composites with homogeneously dispersed CNTs and refined matrix grains, were fabricated using powder metallurgy (PM) followed by 4-pass friction stir processing (FSP). Tensile properties of the composites between 293 and 573 K and the coefficient of thermal expansion (CTE) from 293 to 473 K were tested. It was indicated that load transfer mechanism still takes effect at temperatures elevated up to 573 K, thus the yield strength of the 1.5 vol.% CNT/2009Al composite at 423–573 K, was enhanced compared with the 2009Al matrix. However, for the 4.5 vol.% CNT/2009Al composite, the yield strength at 573 K was even lower than that for the matrix, due to the quicker softening of ultrafine-grained matrix. Compared with the 2009Al matrix, the CTEs of the composites were greatly reduced for the zero thermal expansion and high modulus of the CNTs and could be well predicted by the Schapery’s model.     

Predicting the thermal conductivity of composite materials with imperfect interfaces

This paper compares the predicted values of the thermal conductivity of a composite made using the equivalent inclusion method (EIM) and the finite element method (FEM) using representative volume elements. The effects of inclusion anisotropy, inclusion orientation distribution, thermal interface conductance, h, and inclusion dimensions have been considered. Both methods predict similar overall behaviour, whereby at high h values, the effective thermal conductivity of the composite is limited by the inclusion anisotropy, while at lower h values, the effect of anisotropy is greatly diminished due to the more dominant effect of limited heat flow across the inclusion/matrix interface. The simulation results are then used to understand why in those cases where it has been possible to produce CNF reinforced Cu matrix composites with a large volume fraction of well dispersed CNFs, the measured thermal properties of the composite have failed to meet the expectations in terms of thermal conductivity, with measured conductivities in the range 200–300 W/m K. The simulation results show that, although degradation of the thermal properties of the CNFs and a poor interfacial thermal conductance are very likely the reasons behind the low conductivities reported, great care should be taken when measuring the thermal conductivity of this new class of materials, to avoid misleading results due to anisotropic effects.     

Fabrication and effective thermal conductivity of multi-walled carbon nanotubes reinforced Cu matrix composites for heat sink applications

A novel particles-compositing method was used for the first time to disperse different contents of multi-walled carbon nanotubes (CNTs) in micron sized copper powders, which were subsequently consolidated into CNT/Cu composites by spark plasma sintering (SPS). Microstructural observations showed that the homogeneous distribution of CNTs and dense composites could be obtained for 0–10 vol.% CNT contents. The CNT clusters were appeared in the powder mixture with 15 vol.% CNTs, which resulted in an insufficient densification of the composites. The effective thermal conductivity of the composites was analyzed both theoretically and experimentally. The addition of CNTs showed no enhancement in overall thermal conductivity of the composites due to the interface thermal resistance associated with the low phase contrast of CNT to copper and the random tube orientation. Besides, the composite containing 15 vol.% CNTs led to a rather low thermal conductivity due possiblely to the combined effect of unfavorable factors induced by the presence of CNT clusters, i.e. large porosity, lower effective conductivity of CNT clusters themselves and reduction of SPS cleaning effect. The CNT/Cu composites may be a promising thermal management material for heat sink applications.     

Carbon fiber reinforced carbon aerogel composites for thermal insulation prepared by soft reinforcement

To overcome the brittleness and the pyrolysis shrinkage of carbon aerogels, carbon fiber reinforced composites were prepared by copyrolysis of polyacrylonitrile fiber reinforced resorcinol-formaldehyde aerogel composites (PAN/RFs). The PAN/RFs were obtained by impregnating the PAN fiber felt with RF sol and then supercritical drying. Upon carbonization the PAN fiber shrinks with the RF aerogel, thus reducing the shrinkage differences between the fiber and the aerogel, and results in crack-free carbon fiber reinforced carbon aerogel composites, with a thermal conductivity of 0.073 W/m K at 25 °C in air. Our new method may greatly expand the usage of carbon aerogels in general applications.     

Thermomechanical properties of copper–carbon nanofibre composites prepared by spark plasma sintering and hot pressing

Several types of carbon nanofibres (CNF) were coated with a uniform and dense copper layer by electroless copper deposition. The coated fibres were then sintered by two different methods, spark plasma sintering (SPS) and hot pressing (HP). The Cu coating thickness was varied so that different volume fraction of fibres was achieved in the produced composites. In some cases, the CNF were pre-coated with Cr for the improvement the Cu adhesion on CNF. The results show that the dispersion of the CNF into the Cu matrix is independent of the sintering method used. On the contrary, the dispersion is directly related to the efficiency of the Cu coating, which is tightly connected to the CNF type. Overall, strong variations of the thermal conductivity (TC) of the composites were observed (20–200 W/mK) as a function of CNF type, CNF volume fraction and Cr content, while the coefficient of thermal expansion (CTE) in all cases was found to be considerably lower than Cu (9.9–11.3 ppm/K). The results show a good potential for SPS to be used to process this type of materials, since the SPS samples show better properties than HP samples even though they have a higher porosity, in applications where moderate TC and low CTE are required.     

Effects of carbon nanotubes and carbon fiber reinforcements on thermal conductivity and ablation properties of carbon/phenolic composites

The ablation properties and thermal conductivity of carbon nanotube (CNT) and carbon fiber (CF)/phenolic composites were evaluated for different filler types and structures. It was found that the mechanical and thermal properties of phenolic-polymer matrix composites were improved significantly by the addition of carbon materials as reinforcement. The concentrations of CF and CNT reinforcing materials used in this study were 30 vol% and 0.5 wt%, respectively. The thermal conductivity and thermal diffusion of the different composites were observed during ablation testing, using an oxygen–kerosene (1:1) flame torch. The thermal conductivity of CF mat/phenolic composites was higher than that of random CF/phenolic composites. Both CF mat and CNT/phenolic composites exhibited much better thermal conductivity and ablation properties than did neat phenolic resin. The more conductive carbon materials significantly enhanced the heat conduction and dissipation from the flame location, thereby minimizing local thermal damage.     

Fabrication and characterization of aluminum nitride polymer matrix composites with high thermal conductivity and low dielectric constant for electronic packaging

Polymethyl methacrylate (PMMA) composites filled with Aluminum Nitride (AlN) were prepared by powder processing technique. The microstructures of the composites were investigated by scanning electron microscopy techniques. The effect of AlN filler content (0.1–0.7 volume fraction (vf)) on the thermal conductivity, relative permittivity, and dielectric loss were investigated. As the vf of AlN filler increased, the thermal conductivity of the specimens increased. The thermal conductivity and relative permittivity of AlN/PMMA composites with 0.7 vf AlN filler were improved to 1.87 W/(m K) and 4.4 (at 1 MHz), respectively. The experimental thermal conductivity and relative permittivity were compared with that from simulation model.     

Thermal conductivity and dielectric properties of Al/PVDF composites

Polymeric composites with relatively high thermal conductivity, high dielectric permittivity, and a low dissipation factor are obtained in the present study. Three types of core-shell-structured aluminum (Al) particles are incorporated in poly(vinylidene fluoride) (PVDF) by melt-mixing and hot-pressing processes. The morphological, thermal, and dielectric properties of the composites are characterized using thermal analysis, a scanning electron microscope, and a dielectric analyzer. The results indicate that the Al particles decrease the degree of crystallinity of PVDF, and that the particle size and shape of the filler affect the thermal conductivity and dielectric properties of Al/PVDF. No variation in the dissipation factor is observed up to 60 wt.% Al. Thermal conductivity and dielectric permittivity values as high as 1.65 W/m K and 230, respectively, as well as a low dissipation factor of 0.25 at 0.1 Hz, are realized for the composites with 80 wt.% spherical Al.     

Graphene woven fabric-reinforced polyimide films with enhanced and anisotropic thermal conductivity

Due to the growing needs of thermal management in modern electronics, polyimide-based (PI) composites are increasingly demanded in thermal interface materials (TIMs). Graphene woven fabrics (GWFs) with a mesh structure have been prepared by chemical vapor deposition and used as thermally conductive filler. With the incorporation of 10-layer GWFs laminates (approximate 12 wt%), the in-plane thermal conductivity of GWFs/PI composite films achieves 3.73 W/mK, with a thermal conductivity enhancement of 1418% compared to neat PI. However, the out-of-plane thermal conductivity of the composites is only 0.41 W/mK. The in-plane thermal conductivity exceeds its out-of plane counterpart by over 9 times, indicating a highly anisotropic thermal conduction of GWFs/PI composites. The thermal anisotropy and the enhanced in-plane thermal conductivity can be attributed to the layer-by-layer stacked GWFs network in PI matrix. Thus, the GWFs-reinforced polyimide films are promising for use as an efficient heat spreader for electronic cooling applications.     

Thermal conductivity of InAs quantum dot stacks using AlAs strain compensating layers on InP substrate

The growth and thermal conductivity of InAs quantum dot (QD) stacks embedded in GaInAs matrix with AlAs compensating layers deposited on (1 1 3)B InP substrate are presented. The effect of the strain compensating AlAs layer is demonstrated through Atomic Force Microscopy (AFM) and X-ray diffraction structural analysis. The thermal conductivity (2.7 W/m K at 300 K) measured by the 3ω method reveals to be clearly reduced in comparison with a bulk InGaAs layer (5 W/m K). In addition, the thermal conductivity measurements of S doped InP substrates and the SiN insulating layer used in the 3ω method in the 20–200 °C range are also presented. An empirical law is proposed for the S doped InP substrate, which slightly differs from previously presented results.     

Increasing the through-thickness thermal conductivity of carbon fiber polymer-matrix composite by curing pressure increase and filler incorporation

The low through-thickness thermal conductivity limits heat dissipation from continuous carbon fiber polymer-matrix composites. This conductivity is increased by up to 60% by raising the curing pressure from 0.1 to 2.0 MPa and up to 33% by incorporation of a filler (?1.5 vol.%) at the interlaminar interface. The 7-μm-diameter 7-W/m K-thermal-conductivity continuous fiber volume fraction is increased by the curing pressure increase, but is essentially unaffected by filler incorporation. The thermal resistivity is dominated by the lamina resistivity (which is contributed substantially by the intralaminar fiber-fiber interfacial resistivity), with the interlaminar interface thermal resistivity being unexpectedly negligible. The lamina resistivity and intralaminar fiber-fiber interfacial resistivity are decreased by up to 56% by raising the curing pressure and up to 36% by filler incorporation. The curing pressure increase does not affect the effectiveness of 1-mm-long 10-μm-diameter 900-1000-W/m K-thermal-conductivity K-1100 carbon fiber or single-walled carbon nanotube (SWCNT) as fillers for enhancing the conductivity, but hinders the effectiveness of carbon black (CB, low-cost), which is less effective than K-1100 or SWCNT at the higher curing pressure, but is almost as effective as K-1100 and SWCNT at the lower curing pressure. The effectiveness for enhancing the flexural modulus/strength/ductility decreases in the order: SWCNT, CB, K-1100.     

Synergistic effect of hybrid graphene nanoplatelet and multi-walled carbon nanotube fillers on the thermal conductivity of polymer composites and theoretical modeling of the synergistic effect

We found that the thermal conductivity of polymer composites was synergistically improved by the simultaneous incorporation of graphene nanoplatelet (GNP) and multi-walled carbon nanotube (MWCNT) fillers into the polycarbonate matrix. The bulk thermal conductivity of composites with 20 wt% GNP filler was found to reach a maximum value of 1.13 W/m K and this thermal conductivity was synergistically enhanced to reach a maximum value of 1.39 W/m K as the relative proportion of MWCNT content was increased but the relative proportion of GNP content was decreased. The synergistic effect was theoretically estimated based on a modified micromechanics model where the different shapes of the nanofillers in the composite system could be taken into account. The waviness of the incorporated GNP and MWCNT fillers was found to be one of the most important physical factors determining the thermal conductivity of the composites and must be taken into consideration in theoretical calculations.     

The effect of ultra-thin graphite on the morphology and physical properties of thermoplastic polyurethane elastomer composites

Composites of thermoplastic polyurethane (TPU) and ultra-thin graphite (UTG) with concentrations ranging from 0.5 wt.% to 3 wt.% were prepared using a solution compounding strategy. Substantial reinforcing effects with increased loadings are achieved. Compared to neat TPU, values for storage modulus and shear viscosity are enhanced by 300% and 150%, respectively, for UTG concentrations of 3 wt.%. Additionally, an enhancement of thermal properties is accomplished. The crystallization temperature and thermal stability increased by 30 °C and 10 °C, respectively, compared to neat TPU. Furthermore, the use of oxidized UTG (UTGO) with its added functional oxygen groups suggests the presence of chemical interactions between UTG and TPU, which additionally impact on the thermal properties of the corresponding composites. Controlling the oxidation degree, thus offers further possibilities to obtain composites with tailored properties. The presented approach is straightforward, leads to homogeneous TPU-UTG composites with improved materials properties and is especially suitable for commercial UTG materials and further up-scaled production.     

Melt mixed nano composites of PA12 with MWNTs: Influence of MWNT and matrix properties on macrodispersion and electrical properties

Nanocomposites containing four different polyamide 12 (PA12) types and three grades of multiwalled carbon nanotubes (MWNTs) were prepared via small-scale melt processing to study the effect of different MWNTs and the influence of polymer properties on the dispersion of the fillers and the electrical properties of the composites. Under the selected mixing conditions the lowest electrical percolation threshold of 0.7 wt.% was found for Nanocyl™ NC7000 in low viscous PA12. Moreover, big influences of the end group functionality (acid or amine excess) and the melt viscosity of the matrix were found. Composites of PA12 with acid excess showed lower percolation thresholds than those based on amine terminated materials. At constant end group ratio low viscous matrices resulted in lower percolation thresholds than high viscous materials. The best MWNT dispersion was obtained in both high viscous PA12 composites. In these systems the mixing speed was varied indicating an optimum concerning electrical conductivity at 150 rpm as compared to 50 and 250 rpm.     

Thermo-physical properties and TEM analysis of silver based MMCs utilizing metallized multiwall-carbon nanotubes

Metal matrix composites with embedded multiwall-carbon nanotubes (MWNT) are attractive because MWNTs exhibit high intrinsic thermal conductivity. Thus to improve the thermal conductivity of a metal matrix, silver matrix composites with MWNT were prepared by “chemical” mixing, different active elements were introduced enhancing the bonding between inclusions and matrix. The evolution of the thermal conductivity and the coefficient of thermal expansion CTE as a function of the MWNT concentration and the presence of active elements cobalt, molybdenum or nickel in the silver matrix in Ag–X/MWNT composites are presented. A transition from weak to strong matrix/MWNT bonding is observed by adding active elements, the latter leading concomitantly to an increase in thermal conductivity and a decrease in CTE. The thermal conductivity was found to increase by up to 10% for a composition of 0.2 wt.% MWNT and cobalt as active element and a 6% decrease in CTE compared to a pure silver reference.